JP4489201B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
- Publication number
- JP4489201B2 JP4489201B2 JP03749099A JP3749099A JP4489201B2 JP 4489201 B2 JP4489201 B2 JP 4489201B2 JP 03749099 A JP03749099 A JP 03749099A JP 3749099 A JP3749099 A JP 3749099A JP 4489201 B2 JP4489201 B2 JP 4489201B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat treatment
- germanium
- polysilicon film
- amorphous silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
- H10D86/0225—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials using crystallisation-promoting species, e.g. using a Ni catalyst
Landscapes
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03749099A JP4489201B2 (ja) | 1998-02-18 | 1999-02-16 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5285198 | 1998-02-18 | ||
| JP10-52851 | 1998-02-18 | ||
| JP03749099A JP4489201B2 (ja) | 1998-02-18 | 1999-02-16 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11307783A JPH11307783A (ja) | 1999-11-05 |
| JPH11307783A5 JPH11307783A5 (enExample) | 2006-03-23 |
| JP4489201B2 true JP4489201B2 (ja) | 2010-06-23 |
Family
ID=26376618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03749099A Expired - Fee Related JP4489201B2 (ja) | 1998-02-18 | 1999-02-16 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4489201B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6812493B2 (en) | 2000-04-04 | 2004-11-02 | Matsushita Electric Industrial Co., Ltd. | Thin-film semiconductor element and method of producing same |
| TWI263336B (en) | 2000-06-12 | 2006-10-01 | Semiconductor Energy Lab | Thin film transistors and semiconductor device |
| JP2002083974A (ja) | 2000-06-19 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US6828587B2 (en) | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US6703265B2 (en) | 2000-08-02 | 2004-03-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| JP7213726B2 (ja) * | 2019-03-13 | 2023-01-27 | 東京エレクトロン株式会社 | 成膜方法及び熱処理装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3450376B2 (ja) * | 1993-06-12 | 2003-09-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JPH09148245A (ja) * | 1995-11-17 | 1997-06-06 | Sharp Corp | 半導体装置およびその製造方法 |
-
1999
- 1999-02-16 JP JP03749099A patent/JP4489201B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11307783A (ja) | 1999-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7473968B2 (en) | Semiconductor device including a thin film transistor and a storage capacitor | |
| US9910334B2 (en) | Semiconductor device and fabrication method thereof | |
| KR100306831B1 (ko) | 반도체물질,이를이용한반도체장치및이의제조방법 | |
| JPH11191628A (ja) | 半導体装置の作製方法 | |
| US20150248030A1 (en) | Method for manufacturing an electrooptical device | |
| KR19990014087A (ko) | 반도체 박막 및 반도체 장치 | |
| JP2001051292A (ja) | 半導体装置および半導体表示装置 | |
| US6693300B2 (en) | Semiconductor thin film and semiconductor device | |
| US6444390B1 (en) | Process for producing semiconductor thin film devices using group 14 element and high temperature oxidizing treatment to achieve a crystalline silicon film | |
| US6759677B1 (en) | Semiconductor device and method for manufacturing same | |
| JP4489201B2 (ja) | 半導体装置の作製方法 | |
| JP4223092B2 (ja) | 半導体装置の作製方法 | |
| JP4115585B2 (ja) | 半導体装置の作製方法 | |
| JP4115582B2 (ja) | 半導体装置の作製方法 | |
| JP2000114173A (ja) | 半導体装置の作製方法 | |
| JP2000114172A (ja) | 半導体装置の作製方法 | |
| JP2000221504A (ja) | 液晶表示装置 | |
| JPH10214975A (ja) | 半導体装置およびその作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060207 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060207 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090108 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090113 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090310 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090929 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091123 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20100105 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100223 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100304 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100330 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100331 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130409 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130409 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130409 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140409 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |