JP4487225B2 - Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 - Google Patents

Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 Download PDF

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Publication number
JP4487225B2
JP4487225B2 JP2000081091A JP2000081091A JP4487225B2 JP 4487225 B2 JP4487225 B2 JP 4487225B2 JP 2000081091 A JP2000081091 A JP 2000081091A JP 2000081091 A JP2000081091 A JP 2000081091A JP 4487225 B2 JP4487225 B2 JP 4487225B2
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target material
film
corrosion resistance
amount
based target
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Japanese (ja)
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JP2001262328A5 (enExample
JP2001262328A (ja
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英夫 村田
邦親 久保田
俊一郎 松本
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Proterial Ltd
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Hitachi Metals Ltd
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JP2000081091A 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 Expired - Lifetime JP4487225B2 (ja)

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JP2000081091A JP4487225B2 (ja) 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜

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Application Number Priority Date Filing Date Title
JP2000081091A JP4487225B2 (ja) 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜

Publications (3)

Publication Number Publication Date
JP2001262328A JP2001262328A (ja) 2001-09-26
JP2001262328A5 JP2001262328A5 (enExample) 2007-03-29
JP4487225B2 true JP4487225B2 (ja) 2010-06-23

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JP2000081091A Expired - Lifetime JP4487225B2 (ja) 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4466902B2 (ja) * 2003-01-10 2010-05-26 日鉱金属株式会社 ニッケル合金スパッタリングターゲット
JP2005093571A (ja) * 2003-09-16 2005-04-07 Hitachi Metals Ltd 薄膜配線層
EP1672086B1 (en) 2003-10-07 2019-03-13 JX Nippon Mining & Metals Corporation HIGH-PURITY Ni-V ALLOY, TARGET THEREFROM, HIGH-PURITY Ni-V ALLOY THIN FILM AND PROCESS FOR PRODUCING HIGH-PURITY Ni-V ALLOY
JP4730662B2 (ja) * 2005-03-02 2011-07-20 日立金属株式会社 薄膜配線層
JP4655281B2 (ja) * 2005-03-29 2011-03-23 日立金属株式会社 薄膜配線層
JP5203908B2 (ja) * 2008-12-04 2013-06-05 新日鉄住金マテリアルズ株式会社 Ｎｉ−Ｍｏ系合金スパッタリングターゲット板
JP2010133001A (ja) * 2008-12-08 2010-06-17 Hitachi Metals Ltd Ｎｉ合金ターゲット材の製造方法
JP5113100B2 (ja) * 2009-01-28 2013-01-09 Ｊｘ日鉱日石金属株式会社 高純度ニッケル合金ターゲット

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