JP4485570B2 - フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット - Google Patents

フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット Download PDF

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Publication number
JP4485570B2
JP4485570B2 JP2007503590A JP2007503590A JP4485570B2 JP 4485570 B2 JP4485570 B2 JP 4485570B2 JP 2007503590 A JP2007503590 A JP 2007503590A JP 2007503590 A JP2007503590 A JP 2007503590A JP 4485570 B2 JP4485570 B2 JP 4485570B2
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JP
Japan
Prior art keywords
film
target
barrier
thickness
barrier layer
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Expired - Fee Related
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JP2007503590A
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English (en)
Japanese (ja)
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JPWO2006087873A1 (ja
Inventor
修一 入間田
康廣 山越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
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Publication date
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Publication of JPWO2006087873A1 publication Critical patent/JPWO2006087873A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H10P14/44—

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
JP2007503590A 2005-02-17 2005-12-27 フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット Expired - Fee Related JP4485570B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005039979 2005-02-17
JP2005039979 2005-02-17
PCT/JP2005/023866 WO2006087873A1 (ja) 2005-02-17 2005-12-27 フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット

Publications (2)

Publication Number Publication Date
JPWO2006087873A1 JPWO2006087873A1 (ja) 2008-07-03
JP4485570B2 true JP4485570B2 (ja) 2010-06-23

Family

ID=36916284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007503590A Expired - Fee Related JP4485570B2 (ja) 2005-02-17 2005-12-27 フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット

Country Status (3)

Country Link
JP (1) JP4485570B2 (enExample)
TW (1) TW200637928A (enExample)
WO (1) WO2006087873A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101203439B1 (ko) 2007-12-21 2012-11-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박
JP2010133001A (ja) * 2008-12-08 2010-06-17 Hitachi Metals Ltd Ｎｉ合金ターゲット材の製造方法
JP5373453B2 (ja) * 2009-03-31 2013-12-18 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
WO2011001551A1 (ja) * 2009-06-30 2011-01-06 Jx日鉱日石金属株式会社 プリント配線板用銅箔
JP2013219150A (ja) * 2012-04-06 2013-10-24 National Institute Of Advanced Industrial & Technology 炭化珪素半導体装置のオーミック電極の製造方法
WO2016022628A1 (en) * 2014-08-07 2016-02-11 3M Innovative Properties Company Reflection sheet and method of manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299820A (ja) * 1992-04-22 1993-11-12 Toyo Metaraijingu Kk フレキシブルプリント配線板
JPH116061A (ja) * 1997-06-17 1999-01-12 Toray Eng Co Ltd 二層フレキシブル回路基材の製造方法
JP2006073766A (ja) * 2004-09-01 2006-03-16 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260812A (ja) * 1996-03-18 1997-10-03 Toyo Metallizing Co Ltd 無線型ｉｃカード用プリント回路基板
US6171714B1 (en) * 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
JP4593808B2 (ja) * 2001-02-22 2010-12-08 京セラ株式会社 多層配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299820A (ja) * 1992-04-22 1993-11-12 Toyo Metaraijingu Kk フレキシブルプリント配線板
JPH116061A (ja) * 1997-06-17 1999-01-12 Toray Eng Co Ltd 二層フレキシブル回路基材の製造方法
JP2006073766A (ja) * 2004-09-01 2006-03-16 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板及びその製造方法

Also Published As

Publication number Publication date
JPWO2006087873A1 (ja) 2008-07-03
TW200637928A (en) 2006-11-01
WO2006087873A1 (ja) 2006-08-24
TWI296657B (enExample) 2008-05-11

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