JP4477314B2 - ウエハの製造方法と粘着テープ - Google Patents

ウエハの製造方法と粘着テープ Download PDF

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Publication number
JP4477314B2
JP4477314B2 JP2003168291A JP2003168291A JP4477314B2 JP 4477314 B2 JP4477314 B2 JP 4477314B2 JP 2003168291 A JP2003168291 A JP 2003168291A JP 2003168291 A JP2003168291 A JP 2003168291A JP 4477314 B2 JP4477314 B2 JP 4477314B2
Authority
JP
Japan
Prior art keywords
wafer
adhesive tape
grinding
temperature
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003168291A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004072084A (ja
Inventor
伸一 石渡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2003168291A priority Critical patent/JP4477314B2/ja
Publication of JP2004072084A publication Critical patent/JP2004072084A/ja
Application granted granted Critical
Publication of JP4477314B2 publication Critical patent/JP4477314B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2003168291A 2002-06-12 2003-06-12 ウエハの製造方法と粘着テープ Expired - Fee Related JP4477314B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003168291A JP4477314B2 (ja) 2002-06-12 2003-06-12 ウエハの製造方法と粘着テープ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002172124 2002-06-12
JP2003168291A JP4477314B2 (ja) 2002-06-12 2003-06-12 ウエハの製造方法と粘着テープ

Publications (2)

Publication Number Publication Date
JP2004072084A JP2004072084A (ja) 2004-03-04
JP4477314B2 true JP4477314B2 (ja) 2010-06-09

Family

ID=34179444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003168291A Expired - Fee Related JP4477314B2 (ja) 2002-06-12 2003-06-12 ウエハの製造方法と粘着テープ

Country Status (4)

Country Link
JP (1) JP4477314B2 (ko)
KR (1) KR100555995B1 (ko)
CN (1) CN1230872C (ko)
TW (1) TWI288438B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005002269A (ja) * 2003-06-13 2005-01-06 Three M Innovative Properties Co 粘着テープ
JP4584607B2 (ja) * 2004-03-16 2010-11-24 浜松ホトニクス株式会社 加工対象物切断方法
JP2006245353A (ja) * 2005-03-04 2006-09-14 Nitta Ind Corp 固定用粘着テープおよび積層セラミックコンデンサの製造方法
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP4635854B2 (ja) * 2005-12-12 2011-02-23 株式会社デンソー 加工品の製造方法
JP4796096B2 (ja) * 2008-06-12 2011-10-19 リンテック株式会社 光照射装置及び光照射方法
JP6131605B2 (ja) * 2013-01-21 2017-05-24 住友電気工業株式会社 炭化珪素半導体装置の製造方法
CN105632938B (zh) * 2014-11-28 2019-02-05 深南电路有限公司 一种金属载体的加工方法及封装基板
EP3786246A4 (en) * 2018-04-24 2022-01-19 Mitsui Chemicals Tohcello, Inc. SELF-ADHESIVE FILM AND ELECTRONIC DEVICE PRODUCTION METHOD
JP7131349B2 (ja) * 2018-12-05 2022-09-06 住友ベークライト株式会社 基板の研削方法

Also Published As

Publication number Publication date
KR20030096021A (ko) 2003-12-24
CN1230872C (zh) 2005-12-07
CN1472773A (zh) 2004-02-04
TWI288438B (en) 2007-10-11
JP2004072084A (ja) 2004-03-04
TW200402786A (en) 2004-02-16
KR100555995B1 (ko) 2006-03-03

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