JP4454773B2 - 位置合わせ方法及び位置合わせ装置 - Google Patents

位置合わせ方法及び位置合わせ装置 Download PDF

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Publication number
JP4454773B2
JP4454773B2 JP2000078394A JP2000078394A JP4454773B2 JP 4454773 B2 JP4454773 B2 JP 4454773B2 JP 2000078394 A JP2000078394 A JP 2000078394A JP 2000078394 A JP2000078394 A JP 2000078394A JP 4454773 B2 JP4454773 B2 JP 4454773B2
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Japan
Prior art keywords
alignment
substrate
wafer
precision
aligning
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Expired - Fee Related
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JP2000078394A
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English (en)
Japanese (ja)
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JP2001267229A (ja
JP2001267229A5 (enExample
Inventor
重夫 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2000078394A priority Critical patent/JP4454773B2/ja
Publication of JP2001267229A publication Critical patent/JP2001267229A/ja
Publication of JP2001267229A5 publication Critical patent/JP2001267229A5/ja
Application granted granted Critical
Publication of JP4454773B2 publication Critical patent/JP4454773B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2000078394A 2000-03-21 2000-03-21 位置合わせ方法及び位置合わせ装置 Expired - Fee Related JP4454773B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000078394A JP4454773B2 (ja) 2000-03-21 2000-03-21 位置合わせ方法及び位置合わせ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000078394A JP4454773B2 (ja) 2000-03-21 2000-03-21 位置合わせ方法及び位置合わせ装置

Publications (3)

Publication Number Publication Date
JP2001267229A JP2001267229A (ja) 2001-09-28
JP2001267229A5 JP2001267229A5 (enExample) 2007-05-17
JP4454773B2 true JP4454773B2 (ja) 2010-04-21

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ID=18595813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000078394A Expired - Fee Related JP4454773B2 (ja) 2000-03-21 2000-03-21 位置合わせ方法及び位置合わせ装置

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JP (1) JP4454773B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4609167B2 (ja) * 2005-04-13 2011-01-12 株式会社ニコン 露光システム、露光方法及びマイクロデバイスの製造方法
JP5096965B2 (ja) 2008-02-29 2012-12-12 キヤノン株式会社 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法
CN103165501A (zh) * 2011-12-08 2013-06-19 财团法人金属工业研究发展中心 无标记基板组装对位方法
CN103995440B (zh) * 2014-06-12 2016-01-27 上海华力微电子有限公司 光刻机对准性能的检测方法
CN119153378B (zh) * 2019-09-30 2025-11-21 深圳中科飞测科技股份有限公司 一种检测设备的检测方法以及检测设备

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Publication number Publication date
JP2001267229A (ja) 2001-09-28

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