JP4444668B2 - 露光制御を使用して表面を検査する方法およびシステム - Google Patents

露光制御を使用して表面を検査する方法およびシステム Download PDF

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Publication number
JP4444668B2
JP4444668B2 JP2003580842A JP2003580842A JP4444668B2 JP 4444668 B2 JP4444668 B2 JP 4444668B2 JP 2003580842 A JP2003580842 A JP 2003580842A JP 2003580842 A JP2003580842 A JP 2003580842A JP 4444668 B2 JP4444668 B2 JP 4444668B2
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Prior art keywords
ccd
integration time
wafer
tap
array
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Japanese (ja)
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JP2005521876A5 (enExample
JP2005521876A (ja
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レオン，ジェン−クエン
ザオ，グオヘング
ヴァエス−イラバニ，メディ
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8896—Circuits specially adapted for system specific signal conditioning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2003580842A 2002-03-27 2003-03-26 露光制御を使用して表面を検査する方法およびシステム Expired - Lifetime JP4444668B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/113,145 US6724473B2 (en) 2002-03-27 2002-03-27 Method and system using exposure control to inspect a surface
PCT/US2003/009842 WO2003083453A1 (en) 2002-03-27 2003-03-26 Method and system using exposure control to inspect a surface

Publications (3)

Publication Number Publication Date
JP2005521876A JP2005521876A (ja) 2005-07-21
JP2005521876A5 JP2005521876A5 (enExample) 2006-05-18
JP4444668B2 true JP4444668B2 (ja) 2010-03-31

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ID=28673653

Family Applications (1)

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JP2003580842A Expired - Lifetime JP4444668B2 (ja) 2002-03-27 2003-03-26 露光制御を使用して表面を検査する方法およびシステム

Country Status (3)

Country Link
US (1) US6724473B2 (enExample)
JP (1) JP4444668B2 (enExample)
WO (1) WO2003083453A1 (enExample)

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CN1653297B (zh) * 2002-05-08 2010-09-29 佛森技术公司 高效固态光源及其使用和制造方法
WO2005041632A2 (en) * 2003-10-31 2005-05-12 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
WO2005043954A2 (en) * 2003-10-31 2005-05-12 Phoseon Technology, Inc. Series wiring of highly reliable light sources
EP1735844B1 (en) 2004-03-18 2019-06-19 Phoseon Technology, Inc. Use of a high-density light emitting diode array comprising micro-reflectors for curing applications
JP2005283190A (ja) * 2004-03-29 2005-10-13 Hitachi High-Technologies Corp 異物検査方法及びその装置
WO2005100961A2 (en) * 2004-04-19 2005-10-27 Phoseon Technology, Inc. Imaging semiconductor strucutures using solid state illumination
US7436503B1 (en) * 2004-08-03 2008-10-14 Kla-Tencor Technologies Corp. Dark field inspection apparatus and methods
KR100567625B1 (ko) * 2004-10-19 2006-04-04 삼성전자주식회사 결함 검사 방법 및 이를 수행하기 위한 장치
KR101288758B1 (ko) * 2004-12-30 2013-07-23 포세온 테크날러지 인코퍼레이티드 산업 공정에서 광원을 사용하는 시스템 및 방법
US7804993B2 (en) 2005-02-28 2010-09-28 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
US7813541B2 (en) 2005-02-28 2010-10-12 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers
US7489393B2 (en) * 2005-03-02 2009-02-10 Kla-Tencor Technologies Corporation Enhanced simultaneous multi-spot inspection and imaging
US7291856B2 (en) * 2005-04-28 2007-11-06 Honeywell International Inc. Sensor and methods for measuring select components in moving sheet products
US7345754B1 (en) * 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
US7859668B2 (en) 2005-12-15 2010-12-28 Honeywell International Inc. Apparatus and method for illuminator-independent color measurements
US8017927B2 (en) * 2005-12-16 2011-09-13 Honeywell International Inc. Apparatus, system, and method for print quality measurements using multiple adjustable sensors
US7688447B2 (en) 2005-12-29 2010-03-30 Honeywell International Inc. Color sensor
US7573575B2 (en) 2005-12-29 2009-08-11 Honeywell International Inc. System and method for color measurements or other spectral measurements of a material
US7642527B2 (en) * 2005-12-30 2010-01-05 Phoseon Technology, Inc. Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
US8031931B2 (en) * 2006-04-24 2011-10-04 Applied Materials South East Asia Pte. Ltd. Printed fourier filtering in optical inspection tools
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
US20090116727A1 (en) * 2006-05-02 2009-05-07 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Defects Detection
US20090122304A1 (en) * 2006-05-02 2009-05-14 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Exclusion Measurement
US7433033B2 (en) * 2006-05-05 2008-10-07 Asml Netherlands B.V. Inspection method and apparatus using same
JP5172162B2 (ja) * 2006-08-25 2013-03-27 株式会社日立ハイテクノロジーズ 欠陥検査装置
US8260035B2 (en) * 2006-09-22 2012-09-04 Kla-Tencor Corporation Threshold determination in an inspection system
US7525649B1 (en) 2007-10-19 2009-04-28 Kla-Tencor Technologies Corporation Surface inspection system using laser line illumination with two dimensional imaging
US7592608B2 (en) * 2008-01-22 2009-09-22 Honeywell International Inc. Apparatus and method for measuring and/or controlling ultraviolet-activated materials in a paper-making process
US8049892B2 (en) * 2008-01-22 2011-11-01 Honeywell International Inc. Apparatus and method for camera-based color measurements
US7826049B2 (en) * 2008-02-11 2010-11-02 Applied Materials South East Asia Pte. Ltd. Inspection tools supporting multiple operating states for multiple detector arrangements
JP2009236791A (ja) * 2008-03-28 2009-10-15 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
US7973921B2 (en) * 2008-06-25 2011-07-05 Applied Materials South East Asia Pte Ltd. Dynamic illumination in optical inspection systems
US8135207B2 (en) * 2008-06-25 2012-03-13 Applied Materials South East Asia Pte. Ltd. Optical inspection tools featuring parallel post-inspection analysis
US7843558B2 (en) * 2008-06-25 2010-11-30 Applied Materials South East Asia Pte. Ltd. Optical inspection tools featuring light shaping diffusers
US7869645B2 (en) * 2008-07-22 2011-01-11 Seiko Epson Corporation Image capture and calibratiion
US8090184B2 (en) * 2008-07-23 2012-01-03 Seiko Epson Corporation Fault detection of a printed dot-pattern bitmap
US8269836B2 (en) * 2008-07-24 2012-09-18 Seiko Epson Corporation Image capture, alignment, and registration
KR101214806B1 (ko) * 2010-05-11 2012-12-24 가부시키가이샤 사무코 웨이퍼 결함 검사 장치 및 웨이퍼 결함 검사 방법
US8401809B2 (en) 2010-07-12 2013-03-19 Honeywell International Inc. System and method for adjusting an on-line appearance sensor system
JP5637841B2 (ja) 2010-12-27 2014-12-10 株式会社日立ハイテクノロジーズ 検査装置
CN104034697B (zh) * 2014-06-25 2016-08-17 天津大学 一种制造表面粗糙度影响激光测量性能的试验装置及方法
US10739276B2 (en) * 2017-11-03 2020-08-11 Kla-Tencor Corporation Minimizing filed size to reduce unwanted stray light
JP7292073B2 (ja) * 2019-03-20 2023-06-16 東京ガスエンジニアリングソリューションズ株式会社 漏洩検査システムおよび漏洩検査方法
WO2025177433A1 (ja) * 2024-02-20 2025-08-28 株式会社日立ハイテク 欠陥検査装置

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US6608676B1 (en) 1997-08-01 2003-08-19 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
JP2000223541A (ja) * 1999-01-27 2000-08-11 Hitachi Ltd 欠陥検査装置およびその方法
IL131284A (en) * 1999-08-05 2003-05-29 Orbotech Ltd Illumination for inspecting surfaces of articles
JP3858571B2 (ja) * 2000-07-27 2006-12-13 株式会社日立製作所 パターン欠陥検査方法及びその装置

Also Published As

Publication number Publication date
WO2003083453A1 (en) 2003-10-09
US6724473B2 (en) 2004-04-20
US20030223058A1 (en) 2003-12-04
JP2005521876A (ja) 2005-07-21

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