JP4436265B2 - 発光素子実装用配線基板 - Google Patents

発光素子実装用配線基板 Download PDF

Info

Publication number
JP4436265B2
JP4436265B2 JP2005038775A JP2005038775A JP4436265B2 JP 4436265 B2 JP4436265 B2 JP 4436265B2 JP 2005038775 A JP2005038775 A JP 2005038775A JP 2005038775 A JP2005038775 A JP 2005038775A JP 4436265 B2 JP4436265 B2 JP 4436265B2
Authority
JP
Japan
Prior art keywords
plating layer
light
layer
emitting element
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005038775A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006228856A5 (https=
JP2006228856A (ja
Inventor
久 若子
敦士 内田
誠 永井
雅仁 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2005038775A priority Critical patent/JP4436265B2/ja
Priority to KR1020050116162A priority patent/KR101154801B1/ko
Priority to US11/291,965 priority patent/US7648775B2/en
Priority to EP11007897.9A priority patent/EP2405723B1/en
Priority to EP05026495A priority patent/EP1670295B1/en
Publication of JP2006228856A publication Critical patent/JP2006228856A/ja
Publication of JP2006228856A5 publication Critical patent/JP2006228856A5/ja
Application granted granted Critical
Publication of JP4436265B2 publication Critical patent/JP4436265B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
JP2005038775A 2004-12-03 2005-02-16 発光素子実装用配線基板 Expired - Fee Related JP4436265B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005038775A JP4436265B2 (ja) 2005-02-16 2005-02-16 発光素子実装用配線基板
KR1020050116162A KR101154801B1 (ko) 2004-12-03 2005-12-01 세라믹 기판 및 발광 소자 수납용 세라믹 패키지
US11/291,965 US7648775B2 (en) 2004-12-03 2005-12-02 Ceramic substrate, ceramic package for housing light emitting element
EP11007897.9A EP2405723B1 (en) 2004-12-03 2005-12-05 Ceramic package for housing light emitting element
EP05026495A EP1670295B1 (en) 2004-12-03 2005-12-05 Ceramic substrate, ceramic package for housing light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005038775A JP4436265B2 (ja) 2005-02-16 2005-02-16 発光素子実装用配線基板

Publications (3)

Publication Number Publication Date
JP2006228856A JP2006228856A (ja) 2006-08-31
JP2006228856A5 JP2006228856A5 (https=) 2009-01-29
JP4436265B2 true JP4436265B2 (ja) 2010-03-24

Family

ID=36989974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005038775A Expired - Fee Related JP4436265B2 (ja) 2004-12-03 2005-02-16 発光素子実装用配線基板

Country Status (1)

Country Link
JP (1) JP4436265B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5773649B2 (ja) * 2008-07-17 2015-09-02 株式会社東芝 発光装置とそれを用いたバックライト、液晶表示装置および照明装置
JP5220526B2 (ja) * 2008-09-11 2013-06-26 昭和電工株式会社 発光装置、発光モジュール、表示装置
US8378369B2 (en) 2008-09-09 2013-02-19 Showa Denko K.K. Light emitting unit, light emitting module, and display device
JP5220522B2 (ja) * 2008-09-09 2013-06-26 昭和電工株式会社 発光装置、発光モジュール
JP5220527B2 (ja) * 2008-09-11 2013-06-26 昭和電工株式会社 発光装置、発光モジュール
JP2011040668A (ja) * 2009-08-18 2011-02-24 Shin-Etsu Chemical Co Ltd 光半導体装置
JP2011216588A (ja) * 2010-03-31 2011-10-27 Toshiba Corp 発光素子モジュール基板、発光素子モジュール及び照明装置
JP5159985B2 (ja) 2010-11-25 2013-03-13 京セラ株式会社 発光素子実装用基体および発光装置
JP5198638B2 (ja) * 2011-09-21 2013-05-15 株式会社東芝 発光素子モジュール基板の製造方法
WO2019059690A2 (ko) * 2017-09-22 2019-03-28 엘지이노텍 주식회사 발광소자 패키지

Also Published As

Publication number Publication date
JP2006228856A (ja) 2006-08-31

Similar Documents

Publication Publication Date Title
KR101154801B1 (ko) 세라믹 기판 및 발광 소자 수납용 세라믹 패키지
JP4436265B2 (ja) 発光素子実装用配線基板
JP2009071013A (ja) 発光素子実装用基板
JP4856470B2 (ja) 配線基板
JP4383088B2 (ja) 発光素子収納用パッケージ
US8809080B2 (en) Electronic assembly
JP4638761B2 (ja) 配線基板
JP4309897B2 (ja) 配線基板
JP2006339362A (ja) 発光素子実装用配線基板
JP2008016593A (ja) 発光素子搭載用配線基板
JP2004311920A (ja) 発光素子収納用パッケージおよび発光装置
JP2006156747A (ja) 配線基板
JP2004335495A (ja) 発光素子収納用パッケージおよび発光装置
JP4132039B2 (ja) 発光素子収納用パッケージおよび発光装置
JP2004311917A (ja) 発光素子収納用パッケージおよび発光装置
JP2009267274A (ja) 発光素子実装用配線基板
JP2007258619A (ja) 発光素子収納用パッケージ
JP4336137B2 (ja) 発光素子収納用パッケージおよび発光装置
JP4369899B2 (ja) 配線基板
JP2006222358A (ja) 発光素子実装用配線基板
JP4183175B2 (ja) 発光素子収納用パッケージおよび発光装置
JP2005101329A (ja) 発光素子収納用パッケージおよび発光装置
JP4486583B2 (ja) 発光素子実装用配線基板
JP2022180570A (ja) 電子素子搭載用基板、電子装置および電子モジュール
EP2822367B1 (en) Wiring board

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081209

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20090108

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20090422

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090512

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090706

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090825

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091019

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091201

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091225

R150 Certificate of patent or registration of utility model

Ref document number: 4436265

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130108

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130108

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130108

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140108

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees