JP4433378B2 - 音響バッキング材料を介して超音波変換器に電気的に接続する方法 - Google Patents

音響バッキング材料を介して超音波変換器に電気的に接続する方法 Download PDF

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Publication number
JP4433378B2
JP4433378B2 JP2003391556A JP2003391556A JP4433378B2 JP 4433378 B2 JP4433378 B2 JP 4433378B2 JP 2003391556 A JP2003391556 A JP 2003391556A JP 2003391556 A JP2003391556 A JP 2003391556A JP 4433378 B2 JP4433378 B2 JP 4433378B2
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acoustic
layer
conductive
ultrasonic transducer
backing layer
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JP2004180301A (ja
JP2004180301A5 (enExample
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チャールズ・イー・バウムガートナー
ロジャー・エス・ルバンドウスキー
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General Electric Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
JP2003391556A 2002-11-22 2003-11-21 音響バッキング材料を介して超音波変換器に電気的に接続する方法 Expired - Fee Related JP4433378B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/065,813 US7053530B2 (en) 2002-11-22 2002-11-22 Method for making electrical connection to ultrasonic transducer through acoustic backing material

Publications (3)

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JP2004180301A JP2004180301A (ja) 2004-06-24
JP2004180301A5 JP2004180301A5 (enExample) 2009-02-12
JP4433378B2 true JP4433378B2 (ja) 2010-03-17

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JP2003391556A Expired - Fee Related JP4433378B2 (ja) 2002-11-22 2003-11-21 音響バッキング材料を介して超音波変換器に電気的に接続する方法

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US (1) US7053530B2 (enExample)
JP (1) JP4433378B2 (enExample)
FR (1) FR2847492A1 (enExample)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6831394B2 (en) * 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
US7257051B2 (en) * 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
JP4376533B2 (ja) * 2003-03-25 2009-12-02 パナソニック株式会社 超音波探触子
JP4503347B2 (ja) * 2004-04-28 2010-07-14 日本電波工業株式会社 超音波探触子の製造方法
EP2305124B1 (en) 2004-09-21 2012-01-25 Olympus Corporation Ultrasonic transducer array
JP4575108B2 (ja) * 2004-10-15 2010-11-04 株式会社東芝 超音波プローブ
US7449821B2 (en) * 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP4790315B2 (ja) * 2005-05-31 2011-10-12 オリンパスメディカルシステムズ株式会社 静電容量型超音波振動子
US20070016058A1 (en) * 2005-07-15 2007-01-18 Scott Kerwin System and method for controlling ultrasound probe having multiple transducer arrays
US7229292B1 (en) 2005-12-22 2007-06-12 General Electric Company Interconnect structure for transducer assembly
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
US8105239B2 (en) 2006-02-06 2012-01-31 Maui Imaging, Inc. Method and apparatus to visualize the coronary arteries using ultrasound
RU2449418C2 (ru) * 2006-09-25 2012-04-27 Конинклейке Филипс Электроникс Н.В. Межсоединение по методу перевернутого кристалла через сквозные отверстия в микросхеме
WO2008051639A2 (en) 2006-10-25 2008-05-02 Maui Imaging, Inc. Method and apparatus to produce ultrasonic images using multiple apertures
US20080130415A1 (en) * 2006-11-07 2008-06-05 General Electric Company Compound flexible circuit and method for electrically connecting a transducer array
US7791252B2 (en) * 2007-01-30 2010-09-07 General Electric Company Ultrasound probe assembly and method of fabrication
US7892176B2 (en) * 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080296708A1 (en) * 2007-05-31 2008-12-04 General Electric Company Integrated sensor arrays and method for making and using such arrays
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
JP4386109B2 (ja) * 2007-07-11 2009-12-16 株式会社デンソー 超音波センサ及び超音波センサの製造方法
US8702609B2 (en) * 2007-07-27 2014-04-22 Meridian Cardiovascular Systems, Inc. Image-guided intravascular therapy catheters
US9788813B2 (en) * 2010-10-13 2017-10-17 Maui Imaging, Inc. Multiple aperture probe internal apparatus and cable assemblies
US9282945B2 (en) 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
US9339256B2 (en) 2007-10-01 2016-05-17 Maui Imaging, Inc. Determining material stiffness using multiple aperture ultrasound
US9247926B2 (en) 2010-04-14 2016-02-02 Maui Imaging, Inc. Concave ultrasound transducers and 3D arrays
US20090182233A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki Ultrasound System With Integrated Control Switches
US20090182229A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki UltraSound System With Highly Integrated ASIC Architecture
US8602993B2 (en) * 2008-08-08 2013-12-10 Maui Imaging, Inc. Imaging with multiple aperture medical ultrasound and synchronization of add-on systems
KR101064601B1 (ko) * 2009-02-10 2011-09-15 주식회사 휴먼스캔 초음파 탐촉자, 초음파 영상 장치 및 그의 제조 방법
US20100256502A1 (en) * 2009-04-06 2010-10-07 General Electric Company Materials and processes for bonding acoustically neutral structures for use in ultrasound catheters
WO2010120907A2 (en) 2009-04-14 2010-10-21 Maui Imaging, Inc. Multiple aperture ultrasound array alignment fixture
DE102009026682A1 (de) * 2009-06-03 2010-12-09 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zu dessen Herstellung
US8330333B2 (en) * 2009-07-29 2012-12-11 Imacor Inc. Ultrasound imaging transducer acoustic stack with integral electrical connections
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
KR102322776B1 (ko) 2010-02-18 2021-11-04 마우이 이미징, 인코포레이티드 초음파 이미지를 구성하는 방법 및 이를 위한 다중-개구 초음파 이미징 시스템
WO2011146694A1 (en) * 2010-05-19 2011-11-24 Ultra-Scan Corporation Sensor system having a platen with a dome-shaped contact surface
US8387230B2 (en) * 2010-08-27 2013-03-05 Transducerworks, Llc Method of making an ultrasonic transducer system
US8776335B2 (en) * 2010-11-17 2014-07-15 General Electric Company Methods of fabricating ultrasonic transducer assemblies
DE102012201715A1 (de) * 2011-03-03 2012-09-06 Intelligendt Systems & Services Gmbh Prüfkopf zum Prüfen eines Werkstückes mit einer eine Mehrzahl von Wandlerelementen enthaltenden Ultraschallwandleranordnung und Verfahren zum Herstellen eines solchen Prüfkopfes
US9237880B2 (en) * 2011-03-17 2016-01-19 Koninklijke Philips N.V. Composite acoustic backing with high thermal conductivity for ultrasound transducer array
US8754574B2 (en) * 2011-04-20 2014-06-17 Siemens Medical Solutions Usa, Inc. Modular array and circuits for ultrasound transducers
US9530955B2 (en) 2011-11-18 2016-12-27 Acist Medical Systems, Inc. Ultrasound transducer and processing methods thereof
WO2013082455A1 (en) 2011-12-01 2013-06-06 Maui Imaging, Inc. Motion detection using ping-based and multiple aperture doppler ultrasound
US20130170321A1 (en) * 2011-12-28 2013-07-04 General Electric Company Systems and methods for controlling transducer pulse transitions in ultrasound imaging
KR20140107648A (ko) 2011-12-29 2014-09-04 마우이 이미징, 인코포레이티드 임의의 경로들의 ｍ-모드 초음파 이미징
KR101403905B1 (ko) * 2012-01-19 2014-06-11 삼성메디슨 주식회사 초음파 진단장치용 프로브 및 그 제조방법
RU2620867C2 (ru) 2012-03-20 2017-05-30 Конинклейке Филипс Н.В. Ультразвуковой матричный зонд с рассеивающим тепло кабелем и теплообменом через опорный блок
WO2013148673A1 (en) 2012-03-26 2013-10-03 Maui Imaging, Inc. Systems and methods for improving ultrasound image quality by applying weighting factors
KR101336246B1 (ko) 2012-04-23 2013-12-03 삼성전자주식회사 초음파 트랜스듀서, 초음파 프로브, 및 초음파 진단장치
CN104620128B (zh) 2012-08-10 2017-06-23 毛伊图像公司 多孔径超声探头的校准
WO2014031642A1 (en) 2012-08-21 2014-02-27 Maui Imaging, Inc. Ultrasound imaging system memory architecture
CN103676827A (zh) 2012-09-06 2014-03-26 Ip音乐集团有限公司 用于远程控制音频设备的系统和方法
US9289188B2 (en) * 2012-12-03 2016-03-22 Liposonix, Inc. Ultrasonic transducer
CN103230865B (zh) * 2013-03-01 2016-05-25 北京中科信芯科技有限责任公司 对接阵
US9510806B2 (en) 2013-03-13 2016-12-06 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
JP6221582B2 (ja) * 2013-09-30 2017-11-01 セイコーエプソン株式会社 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置
KR102262231B1 (ko) * 2013-10-29 2021-06-08 삼성메디슨 주식회사 초음파 프로브 및 이를 포함하는 초음파 영상 장치
US9536511B2 (en) * 2013-12-31 2017-01-03 Acist Medical Systems, Inc. Ultrasound transducer stack
US11045167B2 (en) * 2014-07-12 2021-06-29 University Of Southern California Forward-looking ultrasound array probe for intravascular imaging and navigation applications
US9766328B2 (en) * 2014-07-15 2017-09-19 Garmin Switzerland Gmbh Sonar transducer array assembly and methods of manufacture thereof
JP6722656B2 (ja) 2014-08-18 2020-07-15 マウイ イマギング，インコーポレーテッド ネットワークベース超音波イメージングシステム
KR102406927B1 (ko) * 2014-12-02 2022-06-10 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
EP3028772B1 (en) * 2014-12-02 2022-12-28 Samsung Medison Co., Ltd. Ultrasonic probe and method of manufacturing the same
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
KR102681141B1 (ko) 2015-03-30 2024-07-02 마우이 이미징, 인코포레이티드 오브젝트 모션을 검출하기 위한 초음파 이미징 시스템들 및 방법들
JP6597026B2 (ja) * 2015-07-30 2019-10-30 セイコーエプソン株式会社 超音波デバイス及び超音波モジュール
JP6549001B2 (ja) * 2015-09-17 2019-07-24 株式会社日立製作所 超音波プローブ
WO2017058244A1 (en) 2015-10-02 2017-04-06 Halliburton Energy Services, Inc. Ultrasonic transducer with improved backing element
US10856846B2 (en) 2016-01-27 2020-12-08 Maui Imaging, Inc. Ultrasound imaging with sparse array probes
US10347818B2 (en) 2016-03-31 2019-07-09 General Electric Company Method for manufacturing ultrasound transducers
US9667173B1 (en) * 2016-04-26 2017-05-30 Turtle Beach Corporation Electrostatic parametric transducer and related methods
US11090688B2 (en) 2016-08-10 2021-08-17 The Ultran Group, Inc. Gas matrix piezoelectric ultrasound array transducer
JP7136791B2 (ja) * 2016-10-31 2022-09-13 タレス オーストラリア リミテッド 音響トランスデューサ
US11756520B2 (en) * 2016-11-22 2023-09-12 Transducer Works LLC 2D ultrasound transducer array and methods of making the same
US10510628B2 (en) * 2017-05-11 2019-12-17 Siemens Medical Solutions Usa, Inc. Contact pads for electrical module assembly with multidimensional transducer arrays
CN106984516A (zh) * 2017-05-31 2017-07-28 陈江龙 一种用于检测的接触式超声换能器及其制备方法
US10492760B2 (en) 2017-06-26 2019-12-03 Andreas Hadjicostis Image guided intravascular therapy catheter utilizing a thin chip multiplexor
US11109909B1 (en) 2017-06-26 2021-09-07 Andreas Hadjicostis Image guided intravascular therapy catheter utilizing a thin ablation electrode
US10188368B2 (en) 2017-06-26 2019-01-29 Andreas Hadjicostis Image guided intravascular therapy catheter utilizing a thin chip multiplexor
GB201802402D0 (en) * 2018-02-14 2018-03-28 Littlejohn Alexander Apparatus and method for prosthodontics
CN108671426B (zh) * 2018-07-17 2023-12-05 重庆医科大学 超声换能器
CN110721891B (zh) * 2019-10-29 2021-11-05 深圳市索诺瑞科技有限公司 一种超声换能器加工方法
US11731165B2 (en) * 2019-12-20 2023-08-22 GE Precision Healthcare LLC Stressed-skin backing panel for image artifacts prevention
KR102802030B1 (ko) * 2020-04-22 2025-05-02 삼성메디슨 주식회사 초음파 프로브
KR20230124893A (ko) 2020-10-21 2023-08-28 마우이 이미징, 인코포레이티드 다중 어퍼쳐 초음파를 사용한 조직 특성 묘사를 위한 시스템들 및 방법들
CN116635162A (zh) 2020-11-02 2023-08-22 毛伊图像公司 用于改进超声图像质量的系统和方法
WO2022104683A1 (zh) * 2020-11-20 2022-05-27 深圳先进技术研究院 一种阵列式超声换能器及其制作方法
GB202019016D0 (en) * 2020-12-02 2021-01-13 Ionix Advanced Tech Ltd Transducer and method of manufacture
CN114029219B (zh) * 2020-12-22 2025-09-23 武汉联影医疗科技有限公司 背衬、超声换能系统及背衬的制作方法
US20230201876A1 (en) * 2021-12-23 2023-06-29 Fujifilm Sonosite, Inc. Array architecture and interconnection for transducers
US20240263980A1 (en) * 2023-02-07 2024-08-08 Baker Hughes Holding LLC Ultrasonic transducers with malleable backing members
US20250083188A1 (en) * 2023-09-12 2025-03-13 Roger Zemp Ultrasound transducer with reduced cross-talk and method of manufacture

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5160870A (en) * 1990-06-25 1992-11-03 Carson Paul L Ultrasonic image sensing array and method
US5103129A (en) * 1990-07-26 1992-04-07 Acoustic Imaging Technologies Corporation Fixed origin biplane ultrasonic transducer
US5267221A (en) 1992-02-13 1993-11-30 Hewlett-Packard Company Backing for acoustic transducer array
US5297553A (en) * 1992-09-23 1994-03-29 Acuson Corporation Ultrasound transducer with improved rigid backing
US5493541A (en) 1994-12-30 1996-02-20 General Electric Company Ultrasonic transducer array having laser-drilled vias for electrical connection of electrodes
US5648942A (en) * 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
US6043590A (en) 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
US6266857B1 (en) 1998-02-17 2001-07-31 Microsound Systems, Inc. Method of producing a backing structure for an ultrasound transceiver
US6276211B1 (en) * 1999-02-09 2001-08-21 Duke University Methods and systems for selective processing of transmit ultrasound beams to display views of selected slices of a volume
WO2002040184A2 (en) 2000-11-15 2002-05-23 Koninklijke Philips Electronics N.V. Multidimensional ultrasonic transducer arrays
US6759791B2 (en) * 2000-12-21 2004-07-06 Ram Hatangadi Multidimensional array and fabrication thereof
US6537220B1 (en) * 2001-08-31 2003-03-25 Siemens Medical Solutions Usa, Inc. Ultrasound imaging with acquisition of imaging data in perpendicular scan planes
US6659954B2 (en) * 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same

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Publication number Publication date
JP2004180301A (ja) 2004-06-24
US20040100163A1 (en) 2004-05-27
FR2847492A1 (fr) 2004-05-28
US7053530B2 (en) 2006-05-30

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