JP4428865B2 - 多ノズル配置整列センサ内のグリントを制御するために改良された方法および装置 - Google Patents

多ノズル配置整列センサ内のグリントを制御するために改良された方法および装置 Download PDF

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Publication number
JP4428865B2
JP4428865B2 JP2000579952A JP2000579952A JP4428865B2 JP 4428865 B2 JP4428865 B2 JP 4428865B2 JP 2000579952 A JP2000579952 A JP 2000579952A JP 2000579952 A JP2000579952 A JP 2000579952A JP 4428865 B2 JP4428865 B2 JP 4428865B2
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Japan
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light
glint
detector
plane
shadow
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JP2000579952A
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Japanese (ja)
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JP2002529687A (ja
JP2002529687A5 (enExample
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デュケッテ，デビッド，ダブリュー．
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サイバーオプティクス コーポレーション
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Input (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Electron Sources, Ion Sources (AREA)
JP2000579952A 1998-10-30 1999-10-29 多ノズル配置整列センサ内のグリントを制御するために改良された方法および装置 Expired - Fee Related JP4428865B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10628398P 1998-10-30 1998-10-30
US60/106,283 1998-10-30
PCT/US1999/025543 WO2000026617A1 (en) 1998-10-30 1999-10-29 Improved methods and apparatus for controlling glint in a multi-nozzle position alignment sensor

Publications (3)

Publication Number Publication Date
JP2002529687A JP2002529687A (ja) 2002-09-10
JP2002529687A5 JP2002529687A5 (enExample) 2006-10-12
JP4428865B2 true JP4428865B2 (ja) 2010-03-10

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JP2000579952A Expired - Fee Related JP4428865B2 (ja) 1998-10-30 1999-10-29 多ノズル配置整列センサ内のグリントを制御するために改良された方法および装置

Country Status (6)

Country Link
US (1) US6291830B1 (enExample)
JP (1) JP4428865B2 (enExample)
KR (1) KR100619097B1 (enExample)
DE (1) DE19982294T1 (enExample)
GB (1) GB2347498B (enExample)
WO (1) WO2000026617A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6639239B2 (en) * 1998-10-30 2003-10-28 Cyberoptics Corporation Angle rejection filter
JP2002050896A (ja) * 2000-08-03 2002-02-15 Sony Corp 部品把持位置補正装置および補正方法
US6909515B2 (en) * 2001-01-22 2005-06-21 Cyberoptics Corporation Multiple source alignment sensor with improved optics
US6897463B1 (en) 2001-07-13 2005-05-24 Cyberoptics Semiconductor, Inc. Wafer carrier mapping sensor assembly
AT520307B1 (de) * 2017-11-27 2019-03-15 Riegl Laser Measurement Systems Gmbh Optische Vorrichtung zum Detektieren eines an einem Fernziel reflektierten Lichtstrahls

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4974010A (en) 1989-06-09 1990-11-27 Lc Technologies, Inc. Focus control system
US5278634A (en) 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
US5818061A (en) * 1992-06-24 1998-10-06 Robotic Vision Systems, Inc. Apparatus and method for obtaining three-dimensional data from objects in a contiguous array
US5377405A (en) 1992-07-01 1995-01-03 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
WO1996005477A1 (en) * 1994-08-11 1996-02-22 Cyberoptics Corporation High precision semiconductor component alignment systems
JP3109963B2 (ja) 1994-10-12 2000-11-20 ヤマハ発動機株式会社 表面実装機
JP3337924B2 (ja) 1995-11-28 2002-10-28 ヤマハ発動機株式会社 実装機における部品吸着状態検出装置
JP3417773B2 (ja) 1995-11-28 2003-06-16 ヤマハ発動機株式会社 チップ部品の位置検出方法

Also Published As

Publication number Publication date
US6291830B1 (en) 2001-09-18
KR100619097B1 (ko) 2006-09-04
WO2000026617A1 (en) 2000-05-11
GB2347498A (en) 2000-09-06
GB2347498B (en) 2003-06-25
JP2002529687A (ja) 2002-09-10
DE19982294T1 (de) 2001-03-08
GB0013226D0 (en) 2000-07-19
KR20010033730A (ko) 2001-04-25

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