GB2347498B - Improved methods and apparatus for controlling glint in a multi-nozzle position alignment sensor - Google Patents

Improved methods and apparatus for controlling glint in a multi-nozzle position alignment sensor

Info

Publication number
GB2347498B
GB2347498B GB0013226A GB0013226A GB2347498B GB 2347498 B GB2347498 B GB 2347498B GB 0013226 A GB0013226 A GB 0013226A GB 0013226 A GB0013226 A GB 0013226A GB 2347498 B GB2347498 B GB 2347498B
Authority
GB
United Kingdom
Prior art keywords
glint
controlling
improved methods
alignment sensor
position alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0013226A
Other languages
English (en)
Other versions
GB0013226D0 (en
GB2347498A (en
Inventor
David W Duquette
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Publication of GB0013226D0 publication Critical patent/GB0013226D0/en
Publication of GB2347498A publication Critical patent/GB2347498A/en
Application granted granted Critical
Publication of GB2347498B publication Critical patent/GB2347498B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Input (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Electron Sources, Ion Sources (AREA)
GB0013226A 1998-10-30 1999-10-29 Improved methods and apparatus for controlling glint in a multi-nozzle position alignment sensor Expired - Lifetime GB2347498B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10628398P 1998-10-30 1998-10-30
PCT/US1999/025543 WO2000026617A1 (en) 1998-10-30 1999-10-29 Improved methods and apparatus for controlling glint in a multi-nozzle position alignment sensor

Publications (3)

Publication Number Publication Date
GB0013226D0 GB0013226D0 (en) 2000-07-19
GB2347498A GB2347498A (en) 2000-09-06
GB2347498B true GB2347498B (en) 2003-06-25

Family

ID=22310577

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0013226A Expired - Lifetime GB2347498B (en) 1998-10-30 1999-10-29 Improved methods and apparatus for controlling glint in a multi-nozzle position alignment sensor

Country Status (6)

Country Link
US (1) US6291830B1 (enExample)
JP (1) JP4428865B2 (enExample)
KR (1) KR100619097B1 (enExample)
DE (1) DE19982294T1 (enExample)
GB (1) GB2347498B (enExample)
WO (1) WO2000026617A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6639239B2 (en) 1998-10-30 2003-10-28 Cyberoptics Corporation Angle rejection filter
JP2002050896A (ja) * 2000-08-03 2002-02-15 Sony Corp 部品把持位置補正装置および補正方法
US6909515B2 (en) * 2001-01-22 2005-06-21 Cyberoptics Corporation Multiple source alignment sensor with improved optics
US6897463B1 (en) 2001-07-13 2005-05-24 Cyberoptics Semiconductor, Inc. Wafer carrier mapping sensor assembly
AT520307B1 (de) * 2017-11-27 2019-03-15 Riegl Laser Measurement Systems Gmbh Optische Vorrichtung zum Detektieren eines an einem Fernziel reflektierten Lichtstrahls

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4974010A (en) * 1989-06-09 1990-11-27 Lc Technologies, Inc. Focus control system
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
US5897611A (en) * 1994-08-11 1999-04-27 Cyberoptics Corporation High precision semiconductor component alignment systems

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278634A (en) 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
US5818061A (en) * 1992-06-24 1998-10-06 Robotic Vision Systems, Inc. Apparatus and method for obtaining three-dimensional data from objects in a contiguous array
EP0578136B1 (en) 1992-07-01 1995-11-22 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor
JP3109963B2 (ja) 1994-10-12 2000-11-20 ヤマハ発動機株式会社 表面実装機
JP3417773B2 (ja) 1995-11-28 2003-06-16 ヤマハ発動機株式会社 チップ部品の位置検出方法
JP3337924B2 (ja) 1995-11-28 2002-10-28 ヤマハ発動機株式会社 実装機における部品吸着状態検出装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4974010A (en) * 1989-06-09 1990-11-27 Lc Technologies, Inc. Focus control system
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
US5897611A (en) * 1994-08-11 1999-04-27 Cyberoptics Corporation High precision semiconductor component alignment systems

Also Published As

Publication number Publication date
JP2002529687A (ja) 2002-09-10
GB0013226D0 (en) 2000-07-19
JP4428865B2 (ja) 2010-03-10
US6291830B1 (en) 2001-09-18
GB2347498A (en) 2000-09-06
WO2000026617A1 (en) 2000-05-11
DE19982294T1 (de) 2001-03-08
KR100619097B1 (ko) 2006-09-04
KR20010033730A (ko) 2001-04-25

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