JP4428166B2 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP4428166B2 JP4428166B2 JP2004225181A JP2004225181A JP4428166B2 JP 4428166 B2 JP4428166 B2 JP 4428166B2 JP 2004225181 A JP2004225181 A JP 2004225181A JP 2004225181 A JP2004225181 A JP 2004225181A JP 4428166 B2 JP4428166 B2 JP 4428166B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting diode
- ceramic composite
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Description
α−Al2O3粉末(純度99.99%)0.8136モルとY2O3粉末(純度99.999%)0.1756モル、CeO2粉末(純度99.99%)0.0109モルを原料として用いた。これらの粉末をエタノール中、ボールミルによって16時間湿式混合した後、エバポレーターを用いてエタノールを脱媒して原料粉末を得た。原料粉末は、真空炉中で予備溶解し一方向凝固の原料とした。
2 支持台
3 導電性ワイヤー
4 電極
5 光変換用セラミック複合体
6 コーティング層
7 モールド層
Claims (3)
- 発光素子と該発光素子の全周に配置した光変換用セラミック複合体とからなる発光ダイオードであり、前記光変換用セラミック複合体は、単一金属酸化物と複合金属酸化物とが連続的にかつ3次元的に相互に絡み合って形成されている凝固体であって、前記単一金属酸化物または前記複合金属酸化物は、蛍光を発する金属元素酸化物を含有していることを特徴とする発光ダイオード。
- 前記複合金属酸化物がセリウムで付活されたYAG(Y3Al5O12:Ce)結晶であり、前記単一金属酸化物がα型酸化アルミニウム(Al2O3)結晶であることを特徴とする請求項1記載の発光ダイオード。
- 前記発光素子が青色または紫色光を発光し、前記発光ダイオードが擬似的に白色を発光することを特徴とする請求項2記載の発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004225181A JP4428166B2 (ja) | 2004-08-02 | 2004-08-02 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004225181A JP4428166B2 (ja) | 2004-08-02 | 2004-08-02 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006049410A JP2006049410A (ja) | 2006-02-16 |
JP4428166B2 true JP4428166B2 (ja) | 2010-03-10 |
Family
ID=36027645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004225181A Expired - Fee Related JP4428166B2 (ja) | 2004-08-02 | 2004-08-02 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4428166B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101431934B (zh) | 2006-04-26 | 2011-01-05 | 皇家飞利浦电子股份有限公司 | 具有改进的转换元件的光传输装置 |
US8337032B2 (en) | 2008-03-26 | 2012-12-25 | Panasonic Corporation | Semiconductor light-emitting apparatus |
WO2010061592A1 (ja) * | 2008-11-28 | 2010-06-03 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
BRPI1008218A2 (pt) | 2009-05-28 | 2016-07-05 | Koninkl Philips Electronics Nv | dispositivo de iluminação e lâmpada |
JP2011012215A (ja) * | 2009-07-03 | 2011-01-20 | Covalent Materials Corp | セラミックス複合体 |
JP5528423B2 (ja) * | 2011-12-20 | 2014-06-25 | 京セラ株式会社 | 発光装置および照明装置 |
JP6215545B2 (ja) * | 2013-03-19 | 2017-10-18 | スタンレー電気株式会社 | 複合セラミックスの製造方法、波長変換部材の製造方法及び発光装置の製造方法 |
-
2004
- 2004-08-02 JP JP2004225181A patent/JP4428166B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006049410A (ja) | 2006-02-16 |
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