JP4427543B2 - 太陽電池吸収層の製造方法 - Google Patents
太陽電池吸収層の製造方法 Download PDFInfo
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- JP4427543B2 JP4427543B2 JP2006520990A JP2006520990A JP4427543B2 JP 4427543 B2 JP4427543 B2 JP 4427543B2 JP 2006520990 A JP2006520990 A JP 2006520990A JP 2006520990 A JP2006520990 A JP 2006520990A JP 4427543 B2 JP4427543 B2 JP 4427543B2
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- 238000000034 method Methods 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 238000010521 absorption reaction Methods 0.000 title claims 2
- 239000010409 thin film Substances 0.000 claims description 101
- 239000002243 precursor Substances 0.000 claims description 31
- 229910052711 selenium Inorganic materials 0.000 claims description 27
- 150000001875 compounds Chemical class 0.000 claims description 17
- 238000005229 chemical vapour deposition Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 229910021476 group 6 element Inorganic materials 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 229910052738 indium Inorganic materials 0.000 claims description 9
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 239000012691 Cu precursor Substances 0.000 claims description 2
- 239000011669 selenium Substances 0.000 description 57
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 14
- 239000000203 mixture Substances 0.000 description 12
- 238000001878 scanning electron micrograph Methods 0.000 description 6
- 230000000737 periodic effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004846 x-ray emission Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- PKXHXOTZMFCXSH-UHFFFAOYSA-N 3,3-dimethylbut-1-ene Chemical compound CC(C)(C)C=C PKXHXOTZMFCXSH-UHFFFAOYSA-N 0.000 description 1
- 229910017139 AlTe Inorganic materials 0.000 description 1
- 229910005543 GaSe Inorganic materials 0.000 description 1
- 241000252067 Megalops atlanticus Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical group [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/305—Sulfides, selenides, or tellurides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Description
Claims (10)
- 基板上に、III族及びVI族の元素を含む単一前駆体を用いた有機金属化学気相成長法によって、III−VI化合物の薄膜を形成させる第1のステップと、
前記III−VI化合物の薄膜を、I族金属を含む前駆体を用いた有機金属化学気相成長法によって、I2−VI化合物の薄膜に変化させる第2のステップと、
前記I2−VI化合物の薄膜を、III族及びVI族の元素を含む単一前駆体を用いた有機金属化学気相成長法によって、I−III−VI2化合物の薄膜に変化させる第3のステップと、
を含むことを特徴とするI−III−VI2の薄膜の製造方法。 - 第3のステップで形成されたI−III−VI2化合物の薄膜を、III族及びVI族の元素を含む単一前駆体を用いた有機金属化学気相成長法によって、I−III−VI2化合物の薄膜に変化させる第4のステップをさらに含み、
前記第4のステップで用いられるIII族元素が、前記第1及び第3のステップで用いられるものとは異なるIII族元素であることを特徴とする請求項1に記載の方法。 - 第3のステップで形成されたI−III−VI2化合物の薄膜を、III族及びVI族の元素を含む単一前駆体を用いた有機金属化学気相成長法によって、I−III−VI2化合物の薄膜に変化させる第4のステップをさらに含み、
前記第4のステップで用いられるVI族元素が、前記第1及び第3のステップで用いられるものとは異なるVI族元素であることを特徴とする請求項1に記載の方法。 - 第1及び第3のステップで用いられる前駆体が、[Me2In−(μSeMe)]2であることを特徴とする請求項1乃至3のいずれか一項に記載の方法。
- 第2のステップで用いられる前駆体が、(hfac)Cu(DMB)であることを特徴とする請求項1乃至3のいずれか一項に記載の方法。
- 第4のステップで用いられる前駆体が、[Me2Ga−(μSeMe)]2であることを特徴とする請求項2に記載の方法。
- 前記I−III−VI2化合物の薄膜が、CuIn1−xGaxSe2、CuIn1−xAlxSe2、CuGa1−xAlxSe2、AgIn1−xGaxSe2、AgIn1−xAlxSe2及びAgIn1−xGaxSe2からなる群より選ばれたものであることを特徴とする請求項2に記載の方法。
- 前記I−III−VI2化合物の薄膜が、CuIn(Se、S)2、CuGa(Se、S)2、AgIn(Se、S)2、AgGa(Se、S)2、CuIn(Se、Te)2、CuGa(Se、Te)2、AgIn(Se、Te)2、AgGa(Se、Te)2、CuIn(S、Te)2、CuGa(S、Te)2、AgIn(S、Te)2、及びAgGa(S、Te)2からなる群より選ばれたものであることを特徴とする請求項3に記載の方法。
- 基板上に、InとSeとを含む単一前駆体を用いた有機金属化学気相成長法によって、InSe薄膜を形成させるステップと、
前記InSe薄膜を、Cu前駆体を用いた有機金属化学気相成長法によって、Cu2Se薄膜に変化させるステップと、
前記Cu2Se薄膜を、InとSeとを含む単一前駆体を用いた有機金属化学気相成長法によって、CuInSe2薄膜に変化させるステップと、
を含むことを特徴とする太陽電池吸収層の製造方法。 - 前記CuInSe2薄膜を、GaとSeとを含む単一前駆体を用いた有機金属化学気相成長法によって、CuIn1−xGaxSe2薄膜にさらに変化させるステップを含むことを特徴とする請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20030051828 | 2003-07-26 | ||
KR10-2004-0029221A KR100495924B1 (ko) | 2003-07-26 | 2004-04-27 | 태양전지 흡수층의 제조 방법 |
PCT/KR2004/001251 WO2005010999A1 (en) | 2003-07-26 | 2004-05-27 | Method for manufacturing absorber layers for solar cell |
Publications (2)
Publication Number | Publication Date |
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JP2006528838A JP2006528838A (ja) | 2006-12-21 |
JP4427543B2 true JP4427543B2 (ja) | 2010-03-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006520990A Expired - Fee Related JP4427543B2 (ja) | 2003-07-26 | 2004-05-27 | 太陽電池吸収層の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7641937B2 (ja) |
EP (1) | EP1649520A4 (ja) |
JP (1) | JP4427543B2 (ja) |
WO (1) | WO2005010999A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100495925B1 (ko) * | 2005-01-12 | 2005-06-17 | (주)인솔라텍 | 태양전지용 광흡수층 및 그 제조 방법 |
KR100810730B1 (ko) * | 2006-06-19 | 2008-03-07 | (주)인솔라텍 | 태양전지용 광흡수층의 제조방법 |
US7964418B2 (en) * | 2006-08-18 | 2011-06-21 | Solyndra Llc | Real time process monitoring and control for semiconductor junctions |
KR100889746B1 (ko) * | 2007-03-09 | 2009-03-24 | 한국전자통신연구원 | 칼코젠 박막 트랜지스터 어레이를 포함하는 전자의료영상장치 |
KR100857227B1 (ko) * | 2007-03-13 | 2008-09-05 | (주)인솔라텍 | 단일 유기금속 화학기상 증착 공정에 의한 ⅰ-ⅲ-ⅵ2화합물 박막의 제조방법 |
TWI373851B (en) * | 2008-11-25 | 2012-10-01 | Nexpower Technology Corp | Stacked-layered thin film solar cell and manufacturing method thereof |
KR20110060139A (ko) * | 2009-11-30 | 2011-06-08 | 삼성전자주식회사 | 태양 전지 제조 방법 |
KR20110128580A (ko) | 2010-05-24 | 2011-11-30 | 삼성전자주식회사 | 태양 전지 제조 방법 |
US8563354B1 (en) | 2010-10-05 | 2013-10-22 | University Of South Florida | Advanced 2-step, solid source deposition approach to the manufacture of CIGS solar modules |
US9246086B2 (en) | 2013-10-02 | 2016-01-26 | Sony Corporation | Conductive bridge memory system and method of manufacture thereof |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4652332A (en) * | 1984-11-29 | 1987-03-24 | The United States Of America As Represented By The United States Department Of Energy | Method of synthesizing and growing copper-indium-diselenide (CuInSe2) crystals |
US5028274A (en) * | 1989-06-07 | 1991-07-02 | International Solar Electric Technology, Inc. | Group I-III-VI2 semiconductor films for solar cell application |
JP3064701B2 (ja) * | 1992-10-30 | 2000-07-12 | 松下電器産業株式会社 | カルコパイライト型化合物薄膜の製造方法 |
US5441897A (en) * | 1993-04-12 | 1995-08-15 | Midwest Research Institute | Method of fabricating high-efficiency Cu(In,Ga)(SeS)2 thin films for solar cells |
US5436204A (en) * | 1993-04-12 | 1995-07-25 | Midwest Research Institute | Recrystallization method to selenization of thin-film Cu(In,Ga)Se2 for semiconductor device applications |
JP3484259B2 (ja) * | 1995-05-15 | 2004-01-06 | 松下電器産業株式会社 | 半導体薄膜形成用前駆体及び半導体薄膜の製造方法 |
JP3244408B2 (ja) * | 1995-09-13 | 2002-01-07 | 松下電器産業株式会社 | 薄膜太陽電池及びその製造方法 |
US5731031A (en) * | 1995-12-20 | 1998-03-24 | Midwest Research Institute | Production of films and powders for semiconductor device applications |
US5976614A (en) * | 1998-10-13 | 1999-11-02 | Midwest Research Institute | Preparation of cuxinygazsen precursor films and powders by electroless deposition |
US6736989B2 (en) * | 1999-10-26 | 2004-05-18 | Powsus, Inc. | Reduction of HF |
AU2249201A (en) * | 1999-11-16 | 2001-05-30 | Midwest Research Institute | A novel processing approach towards the formation of thin-film Cu(In,Ga)Se2 |
US6736986B2 (en) * | 2001-09-20 | 2004-05-18 | Heliovolt Corporation | Chemical synthesis of layers, coatings or films using surfactants |
US7115304B2 (en) * | 2004-02-19 | 2006-10-03 | Nanosolar, Inc. | High throughput surface treatment on coiled flexible substrates |
JP5259178B2 (ja) * | 2004-03-15 | 2013-08-07 | ソロパワー、インコーポレイテッド | 太陽電池製造のための半導体の薄層を堆積する方法および装置 |
-
2004
- 2004-05-27 US US10/565,975 patent/US7641937B2/en not_active Expired - Fee Related
- 2004-05-27 JP JP2006520990A patent/JP4427543B2/ja not_active Expired - Fee Related
- 2004-05-27 WO PCT/KR2004/001251 patent/WO2005010999A1/en active Application Filing
- 2004-05-27 EP EP04773827A patent/EP1649520A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1649520A4 (en) | 2009-03-11 |
US20060204659A1 (en) | 2006-09-14 |
EP1649520A1 (en) | 2006-04-26 |
JP2006528838A (ja) | 2006-12-21 |
US7641937B2 (en) | 2010-01-05 |
WO2005010999A1 (en) | 2005-02-03 |
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