JP4422525B2 - 半導体製造装置 - Google Patents

半導体製造装置 Download PDF

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Publication number
JP4422525B2
JP4422525B2 JP2004086631A JP2004086631A JP4422525B2 JP 4422525 B2 JP4422525 B2 JP 4422525B2 JP 2004086631 A JP2004086631 A JP 2004086631A JP 2004086631 A JP2004086631 A JP 2004086631A JP 4422525 B2 JP4422525 B2 JP 4422525B2
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Japan
Prior art keywords
reaction tube
temperature
heater
reaction
semiconductor manufacturing
Prior art date
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Expired - Fee Related
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JP2004086631A
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English (en)
Japanese (ja)
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JP2005277005A5 (enExample
JP2005277005A (ja
Inventor
明 諸橋
真一 島田
智晴 島田
愛彦 柳沢
恵信 山▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Publication date
Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2004086631A priority Critical patent/JP4422525B2/ja
Publication of JP2005277005A publication Critical patent/JP2005277005A/ja
Publication of JP2005277005A5 publication Critical patent/JP2005277005A5/ja
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Publication of JP4422525B2 publication Critical patent/JP4422525B2/ja
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JP2004086631A 2004-03-24 2004-03-24 半導体製造装置 Expired - Fee Related JP4422525B2 (ja)

Priority Applications (1)

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JP2004086631A JP4422525B2 (ja) 2004-03-24 2004-03-24 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004086631A JP4422525B2 (ja) 2004-03-24 2004-03-24 半導体製造装置

Publications (3)

Publication Number Publication Date
JP2005277005A JP2005277005A (ja) 2005-10-06
JP2005277005A5 JP2005277005A5 (enExample) 2007-10-25
JP4422525B2 true JP4422525B2 (ja) 2010-02-24

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JP2004086631A Expired - Fee Related JP4422525B2 (ja) 2004-03-24 2004-03-24 半導体製造装置

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JP (1) JP4422525B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3007511B1 (fr) * 2013-06-19 2017-09-08 Herakles Installation pour traitements thermiques de produits en materiau composite comprenant des moyens de mesure de temperature delocalises
JP6087323B2 (ja) * 2014-07-31 2017-03-01 東京エレクトロン株式会社 熱処理装置、熱処理方法及びその熱処理方法を実行させるためのプログラムを記録した記録媒体
CN115747956A (zh) * 2022-12-05 2023-03-07 宁波恒普真空科技股份有限公司 一种应用于立式成膜设备的热场

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JP2005277005A (ja) 2005-10-06

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