JP4420507B2 - 基板露光方法および装置 - Google Patents
基板露光方法および装置 Download PDFInfo
- Publication number
- JP4420507B2 JP4420507B2 JP2000014896A JP2000014896A JP4420507B2 JP 4420507 B2 JP4420507 B2 JP 4420507B2 JP 2000014896 A JP2000014896 A JP 2000014896A JP 2000014896 A JP2000014896 A JP 2000014896A JP 4420507 B2 JP4420507 B2 JP 4420507B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lower frame
- mask film
- frame
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 119
- 238000000034 method Methods 0.000 title claims description 22
- 238000003825 pressing Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 230000006870 function Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 description 38
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 208000037516 chromosome inversion disease Diseases 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000014896A JP4420507B2 (ja) | 2000-01-24 | 2000-01-24 | 基板露光方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000014896A JP4420507B2 (ja) | 2000-01-24 | 2000-01-24 | 基板露光方法および装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001209192A JP2001209192A (ja) | 2001-08-03 |
| JP2001209192A5 JP2001209192A5 (enExample) | 2007-03-08 |
| JP4420507B2 true JP4420507B2 (ja) | 2010-02-24 |
Family
ID=18542274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000014896A Expired - Fee Related JP4420507B2 (ja) | 2000-01-24 | 2000-01-24 | 基板露光方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4420507B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230115589A (ko) | 2022-01-27 | 2023-08-03 | 주식회사 세미다린 | 무아레가 억제된 진공척 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100628455B1 (ko) | 2002-12-21 | 2006-09-28 | 주식회사 이오테크닉스 | 칩 스케일 마커 및 마킹방법 |
| JP4589198B2 (ja) * | 2005-08-16 | 2010-12-01 | 富士フイルム株式会社 | ワーク搬送装置とそれを備えた画像形成装置並びにワーク搬送方法 |
| JP4880521B2 (ja) * | 2007-05-29 | 2012-02-22 | 株式会社オーク製作所 | 描画装置 |
| JP4651648B2 (ja) * | 2007-09-12 | 2011-03-16 | 日立ビアメカニクス株式会社 | 密着露光の方法及びその装置 |
| JP4949195B2 (ja) * | 2007-10-26 | 2012-06-06 | 株式会社アドテックエンジニアリング | 露光装置及び基板の矯正装置 |
| KR101345994B1 (ko) | 2012-05-31 | 2013-12-31 | 주식회사 선일기연 | 순차적으로 밀착 가능한 구조를 갖는 시트형 fpcb 자동 진공흡탈착장치 |
| JP6096515B2 (ja) * | 2013-01-15 | 2017-03-15 | 株式会社アドテックエンジニアリング | Itoパターン露光装置 |
| CN110625540B (zh) * | 2014-05-03 | 2021-10-29 | 株式会社半导体能源研究所 | 薄膜状部件支撑设备 |
| CN104076619A (zh) * | 2014-07-03 | 2014-10-01 | 无锡宏纳科技有限公司 | 一种接触式光刻机吸盘 |
-
2000
- 2000-01-24 JP JP2000014896A patent/JP4420507B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230115589A (ko) | 2022-01-27 | 2023-08-03 | 주식회사 세미다린 | 무아레가 억제된 진공척 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001209192A (ja) | 2001-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9170483B2 (en) | Photomask, photomask set, exposure apparatus and exposure method | |
| JP4420507B2 (ja) | 基板露光方法および装置 | |
| JPH11312635A (ja) | コンタクト露光方法 | |
| JP4949195B2 (ja) | 露光装置及び基板の矯正装置 | |
| JP4401142B2 (ja) | パターン形成方法およびパターン形成装置 | |
| JP5424803B2 (ja) | 露光装置 | |
| JP2002134597A (ja) | ステージ装置 | |
| JP2020194192A (ja) | ワーク吸着保持方法、ワークステージ及び露光装置 | |
| JP2010197415A (ja) | ワークステージ及びそのワークステージを備えた露光装置 | |
| TWI694540B (zh) | 印刷基板用曝光裝置 | |
| CN101661218B (zh) | 透明光掩模的制备方法 | |
| JP2010039227A (ja) | 露光装置、露光方法及び基板載置方法 | |
| JP2007178557A (ja) | 露光装置 | |
| JP2002251017A (ja) | 露光装置 | |
| JPH0846017A (ja) | 基板の位置決め装置および位置決め方法 | |
| JP2003021909A (ja) | 露光装置 | |
| JPH06230581A (ja) | 露光装置 | |
| TWI727837B (zh) | 取膜裝置及取膜方法 | |
| JP6789368B2 (ja) | プリント基板用露光装置 | |
| TW201123121A (en) | Device and method for fabricating flat display device | |
| JP2531653Y2 (ja) | 露光装置のベース板装置 | |
| JPH05333555A (ja) | プリント基板の露光方法 | |
| TWI681515B (zh) | 半導體封裝製造設備、雷射加工方法以及加工載板之整平方法 | |
| JPH05232714A (ja) | 露光工程における基板と原版との位置合わせ方法 | |
| JP2002091011A (ja) | 密着露光装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070118 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070118 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090811 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090903 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091201 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091201 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121211 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4420507 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121211 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121211 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131211 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |