JP4418486B2 - ウエット処理装置 - Google Patents

ウエット処理装置 Download PDF

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Publication number
JP4418486B2
JP4418486B2 JP2007224798A JP2007224798A JP4418486B2 JP 4418486 B2 JP4418486 B2 JP 4418486B2 JP 2007224798 A JP2007224798 A JP 2007224798A JP 2007224798 A JP2007224798 A JP 2007224798A JP 4418486 B2 JP4418486 B2 JP 4418486B2
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JP
Japan
Prior art keywords
chamber
opening
processing liquid
processing
closing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007224798A
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English (en)
Japanese (ja)
Other versions
JP2009059825A (ja
Inventor
淳 松井
Original Assignee
株式会社Ｍｔｋ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｍｔｋ filed Critical 株式会社Ｍｔｋ
Priority to JP2007224798A priority Critical patent/JP4418486B2/ja
Priority to KR20080065061A priority patent/KR101495248B1/ko
Publication of JP2009059825A publication Critical patent/JP2009059825A/ja
Application granted granted Critical
Publication of JP4418486B2 publication Critical patent/JP4418486B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
JP2007224798A 2007-08-30 2007-08-30 ウエット処理装置 Expired - Fee Related JP4418486B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007224798A JP4418486B2 (ja) 2007-08-30 2007-08-30 ウエット処理装置
KR20080065061A KR101495248B1 (ko) 2007-08-30 2008-07-04 웨트 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007224798A JP4418486B2 (ja) 2007-08-30 2007-08-30 ウエット処理装置

Publications (2)

Publication Number Publication Date
JP2009059825A JP2009059825A (ja) 2009-03-19
JP4418486B2 true JP4418486B2 (ja) 2010-02-17

Family

ID=40555318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007224798A Expired - Fee Related JP4418486B2 (ja) 2007-08-30 2007-08-30 ウエット処理装置

Country Status (2)

Country Link
JP (1) JP4418486B2 (ko)
KR (1) KR101495248B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5864355B2 (ja) * 2012-05-11 2016-02-17 東京エレクトロン株式会社 基板処理装置および基板処理方法
US11705351B2 (en) * 2017-12-01 2023-07-18 Elemental Scientific, Inc. Systems for integrated decomposition and scanning of a semiconducting wafer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2587833Y2 (ja) * 1992-04-13 1998-12-24 島田理化工業株式会社 ウエハ処理装置
JPH06333899A (ja) * 1993-05-19 1994-12-02 Matsushita Electric Ind Co Ltd 薬液処理方法およびその処理装置
JPH1154475A (ja) * 1997-07-30 1999-02-26 Kemitoronikusu:Kk ウエットエッチング装置
JP3960462B2 (ja) * 2001-09-17 2007-08-15 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20090023063A (ko) 2009-03-04
JP2009059825A (ja) 2009-03-19
KR101495248B1 (ko) 2015-02-24

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