JP4410065B2 - 電子部品放熱用のコールドプレート - Google Patents

電子部品放熱用のコールドプレート Download PDF

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Publication number
JP4410065B2
JP4410065B2 JP2004261405A JP2004261405A JP4410065B2 JP 4410065 B2 JP4410065 B2 JP 4410065B2 JP 2004261405 A JP2004261405 A JP 2004261405A JP 2004261405 A JP2004261405 A JP 2004261405A JP 4410065 B2 JP4410065 B2 JP 4410065B2
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JP
Japan
Prior art keywords
plate
fin
refrigerant
flow path
heat exchange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004261405A
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English (en)
Japanese (ja)
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JP2006080226A5 (enExample
JP2006080226A (ja
Inventor
誠二 伊藤
健次 大久保
大助 西野
知憲 江副
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2004261405A priority Critical patent/JP4410065B2/ja
Publication of JP2006080226A publication Critical patent/JP2006080226A/ja
Publication of JP2006080226A5 publication Critical patent/JP2006080226A5/ja
Application granted granted Critical
Publication of JP4410065B2 publication Critical patent/JP4410065B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004261405A 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート Expired - Lifetime JP4410065B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004261405A JP4410065B2 (ja) 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004261405A JP4410065B2 (ja) 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート

Publications (3)

Publication Number Publication Date
JP2006080226A JP2006080226A (ja) 2006-03-23
JP2006080226A5 JP2006080226A5 (enExample) 2007-01-25
JP4410065B2 true JP4410065B2 (ja) 2010-02-03

Family

ID=36159449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004261405A Expired - Lifetime JP4410065B2 (ja) 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート

Country Status (1)

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JP (1) JP4410065B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11284534B2 (en) 2016-09-23 2022-03-22 Sumitomo Precision Products Co., Ltd. Cooling device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4992808B2 (ja) 2008-04-16 2012-08-08 トヨタ自動車株式会社 熱交換器の製造方法
FI127831B (en) * 2015-01-15 2019-03-29 Lappeenrannan Teknillinen Yliopisto A method for fabricating a semiconductor module
DE102021209504A1 (de) 2021-08-30 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlrippenanordnung eines fluiddurchströmbaren Kühlers zum Kühlen einer Leistungselektronik

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11284534B2 (en) 2016-09-23 2022-03-22 Sumitomo Precision Products Co., Ltd. Cooling device

Also Published As

Publication number Publication date
JP2006080226A (ja) 2006-03-23

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