JP4408399B2 - 切削ブレードの製造方法 - Google Patents
切削ブレードの製造方法 Download PDFInfo
- Publication number
- JP4408399B2 JP4408399B2 JP2004202012A JP2004202012A JP4408399B2 JP 4408399 B2 JP4408399 B2 JP 4408399B2 JP 2004202012 A JP2004202012 A JP 2004202012A JP 2004202012 A JP2004202012 A JP 2004202012A JP 4408399 B2 JP4408399 B2 JP 4408399B2
- Authority
- JP
- Japan
- Prior art keywords
- circular base
- cutting
- cutting blade
- semiconductor wafer
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005520 cutting process Methods 0.000 title claims description 91
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 21
- 239000006061 abrasive grain Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 44
- 239000004065 semiconductor Substances 0.000 description 42
- 230000000873 masking effect Effects 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000004840 adhesive resin Substances 0.000 description 7
- 229920006223 adhesive resin Polymers 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004202012A JP4408399B2 (ja) | 2004-07-08 | 2004-07-08 | 切削ブレードの製造方法 |
| CNB2005100818887A CN100509223C (zh) | 2004-07-08 | 2005-07-06 | 切削刀片及切削刀片的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004202012A JP4408399B2 (ja) | 2004-07-08 | 2004-07-08 | 切削ブレードの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006021285A JP2006021285A (ja) | 2006-01-26 |
| JP4408399B2 true JP4408399B2 (ja) | 2010-02-03 |
Family
ID=35794930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004202012A Expired - Lifetime JP4408399B2 (ja) | 2004-07-08 | 2004-07-08 | 切削ブレードの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4408399B2 (zh) |
| CN (1) | CN100509223C (zh) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4825622B2 (ja) * | 2006-08-22 | 2011-11-30 | 株式会社リード | 多層構造薄刃ブレード及びその製造方法 |
| JP2009269158A (ja) * | 2008-05-12 | 2009-11-19 | Disco Abrasive Syst Ltd | 切削ブレード |
| JP5214324B2 (ja) * | 2008-05-14 | 2013-06-19 | 株式会社ディスコ | 切削装置 |
| JP5723740B2 (ja) * | 2011-10-11 | 2015-05-27 | 株式会社東京精密 | ダイシング装置のブレード潤滑機構及びブレード潤滑方法 |
| TWI508803B (zh) * | 2013-01-30 | 2015-11-21 | Mgi Zhou Co Ltd | 切削刀具的製造方法 |
| JP2017087353A (ja) * | 2015-11-10 | 2017-05-25 | 株式会社ディスコ | 電着砥石の製造方法 |
| JP2018181908A (ja) * | 2017-04-04 | 2018-11-15 | 株式会社ディスコ | 加工方法 |
| CN111347061B (zh) * | 2018-12-24 | 2021-03-30 | 有研半导体材料有限公司 | 一种硅环加工的工艺方法 |
| CN110473807B (zh) * | 2019-07-16 | 2021-12-28 | 江苏籽硕科技有限公司 | 半导体单片集成电路的蚀刻设备 |
-
2004
- 2004-07-08 JP JP2004202012A patent/JP4408399B2/ja not_active Expired - Lifetime
-
2005
- 2005-07-06 CN CNB2005100818887A patent/CN100509223C/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN100509223C (zh) | 2009-07-08 |
| CN1718333A (zh) | 2006-01-11 |
| JP2006021285A (ja) | 2006-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008053341A (ja) | ウエーハの加工方法 | |
| JP2007214201A (ja) | 切削装置 | |
| KR100815005B1 (ko) | 절삭 블레이드 | |
| JP2009083072A (ja) | 切削装置の切削ブレード検出機構 | |
| CN100509223C (zh) | 切削刀片及切削刀片的制造方法 | |
| KR20160092489A (ko) | 절삭 블레이드 및 절삭 장치 및 웨이퍼의 가공 방법 | |
| JP2001085365A (ja) | ダイシング方法 | |
| JP4373736B2 (ja) | 加工装置のチャックテーブル | |
| JP4903445B2 (ja) | 切削ブレードの切り込み確認方法 | |
| JP4456421B2 (ja) | 加工装置 | |
| JP2005109155A (ja) | 半導体ウェーハの加工方法 | |
| JP2010050295A (ja) | 被加工物の切削方法 | |
| JP5442979B2 (ja) | 切削装置 | |
| JP2009083010A (ja) | 切削装置の切削ブレード検出機構 | |
| JP4373711B2 (ja) | 切削方法 | |
| JP6013934B2 (ja) | マーキング治具およびマーキング方法 | |
| JP5117772B2 (ja) | 切削装置 | |
| JP5518587B2 (ja) | 切削工具の製造方法 | |
| JP5096052B2 (ja) | 切削装置 | |
| JP2009059749A (ja) | ウエーハの切削方法 | |
| TWI778094B (zh) | 金屬露出之基板的加工方法 | |
| JP6935131B2 (ja) | 板状の被加工物の切断方法 | |
| JP2006344630A (ja) | 切削装置 | |
| JP2005066675A (ja) | レーザー加工方法 | |
| JP7286233B2 (ja) | チップの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060825 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090417 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090421 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090618 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091104 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091109 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4408399 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121120 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121120 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121120 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131120 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |