JP4407204B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP4407204B2
JP4407204B2 JP2003298801A JP2003298801A JP4407204B2 JP 4407204 B2 JP4407204 B2 JP 4407204B2 JP 2003298801 A JP2003298801 A JP 2003298801A JP 2003298801 A JP2003298801 A JP 2003298801A JP 4407204 B2 JP4407204 B2 JP 4407204B2
Authority
JP
Japan
Prior art keywords
light
phosphor
light emitting
ceramic
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003298801A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004111937A5 (https=
JP2004111937A (ja
Inventor
英夫 朝川
良馬 末永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2003298801A priority Critical patent/JP4407204B2/ja
Publication of JP2004111937A publication Critical patent/JP2004111937A/ja
Publication of JP2004111937A5 publication Critical patent/JP2004111937A5/ja
Application granted granted Critical
Publication of JP4407204B2 publication Critical patent/JP4407204B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Luminescent Compositions (AREA)
JP2003298801A 2002-08-30 2003-08-22 発光装置 Expired - Lifetime JP4407204B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003298801A JP4407204B2 (ja) 2002-08-30 2003-08-22 発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002253536 2002-08-30
JP2003298801A JP4407204B2 (ja) 2002-08-30 2003-08-22 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009104604A Division JP5077282B2 (ja) 2002-08-30 2009-04-23 発光素子搭載用パッケージおよび発光装置

Publications (3)

Publication Number Publication Date
JP2004111937A JP2004111937A (ja) 2004-04-08
JP2004111937A5 JP2004111937A5 (https=) 2006-05-11
JP4407204B2 true JP4407204B2 (ja) 2010-02-03

Family

ID=32301344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003298801A Expired - Lifetime JP4407204B2 (ja) 2002-08-30 2003-08-22 発光装置

Country Status (1)

Country Link
JP (1) JP4407204B2 (https=)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4670251B2 (ja) * 2004-04-13 2011-04-13 日亜化学工業株式会社 発光装置
JP2005310911A (ja) * 2004-04-19 2005-11-04 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
US20080043444A1 (en) * 2004-04-27 2008-02-21 Kyocera Corporation Wiring Board for Light-Emitting Element
KR101157313B1 (ko) 2004-04-27 2012-06-18 파나소닉 주식회사 형광체 조성물과 그 제조방법, 및 그 형광체 조성물을 이용한 발광 장치
JP4525193B2 (ja) * 2004-06-15 2010-08-18 パナソニック株式会社 光半導体素子用パッケージとそれを用いた発光装置
JP5320655B2 (ja) * 2004-06-30 2013-10-23 三菱化学株式会社 発光装置、照明、表示装置用バックライトユニット及び表示装置
US20090026920A1 (en) 2004-06-30 2009-01-29 Mitsubishi Chemical Corporation Phosphor, light-emitting device using same, image display and illuminating device
US9929326B2 (en) 2004-10-29 2018-03-27 Ledengin, Inc. LED package having mushroom-shaped lens with volume diffuser
US8324641B2 (en) 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
US8816369B2 (en) 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
US7473933B2 (en) * 2004-10-29 2009-01-06 Ledengin, Inc. (Cayman) High power LED package with universal bonding pads and interconnect arrangement
JP4802533B2 (ja) * 2004-11-12 2011-10-26 日亜化学工業株式会社 半導体装置
US7683393B2 (en) * 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
JP2006222358A (ja) * 2005-02-14 2006-08-24 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP4638761B2 (ja) * 2005-04-14 2011-02-23 日本特殊陶業株式会社 配線基板
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
JP2006351611A (ja) * 2005-06-13 2006-12-28 Rohm Co Ltd 発光素子搭載用基板及びそれを用いた光半導体装置
JP4938255B2 (ja) * 2005-06-29 2012-05-23 京セラ株式会社 発光素子収納用パッケージ、光源および発光装置
DE102005041153A1 (de) * 2005-08-30 2007-03-01 Leuchtstoffwerk Breitungen Gmbh Nitridocarbid-Leuchtstoffe
JP2007110060A (ja) * 2005-09-15 2007-04-26 Nichia Chem Ind Ltd 発光装置
JP4715422B2 (ja) * 2005-09-27 2011-07-06 日亜化学工業株式会社 発光装置
JP2007242738A (ja) * 2006-03-06 2007-09-20 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
EP1848042A1 (en) * 2006-04-21 2007-10-24 LEXEDIS Lighting GmbH LED package with submount
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP4611937B2 (ja) * 2006-06-07 2011-01-12 日亜化学工業株式会社 表面実装型発光装置及びその製造方法
JP2008021670A (ja) 2006-07-10 2008-01-31 Nec Lighting Ltd 発光装置
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP4856558B2 (ja) * 2007-01-22 2012-01-18 日本特殊陶業株式会社 配線基板
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP5196107B2 (ja) * 2007-03-29 2013-05-15 日亜化学工業株式会社 発光装置
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
JP2009267274A (ja) * 2008-04-30 2009-11-12 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US8075165B2 (en) 2008-10-14 2011-12-13 Ledengin, Inc. Total internal reflection lens and mechanical retention and locating device
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8507300B2 (en) 2008-12-24 2013-08-13 Ledengin, Inc. Light-emitting diode with light-conversion layer
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
JP5640632B2 (ja) 2010-03-12 2014-12-17 旭硝子株式会社 発光装置
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
JP5809440B2 (ja) * 2011-05-10 2015-11-10 ローム株式会社 Ｌｅｄモジュール
JP5734090B2 (ja) * 2011-05-23 2015-06-10 日本カーバイド工業株式会社 発光素子搭載用基板及び発光装置
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9897284B2 (en) 2012-03-28 2018-02-20 Ledengin, Inc. LED-based MR16 replacement lamp
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US9865779B2 (en) 2015-09-30 2018-01-09 Nichia Corporation Methods of manufacturing the package and light-emitting device

Also Published As

Publication number Publication date
JP2004111937A (ja) 2004-04-08

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