JP4403229B2 - Board inspection equipment - Google Patents

Board inspection equipment Download PDF

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Publication number
JP4403229B2
JP4403229B2 JP2000111298A JP2000111298A JP4403229B2 JP 4403229 B2 JP4403229 B2 JP 4403229B2 JP 2000111298 A JP2000111298 A JP 2000111298A JP 2000111298 A JP2000111298 A JP 2000111298A JP 4403229 B2 JP4403229 B2 JP 4403229B2
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JP
Japan
Prior art keywords
substrate
upper
guide
lower
inspection
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Expired - Lifetime
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JP2000111298A
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Japanese (ja)
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JP2001296254A (en
Inventor
順 藤原
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国際技術開発株式会社
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate inspection apparatus, and more particularly, to a substrate inspection apparatus that inspects for the presence or absence of defects such as holes in a flat substrate such as a wiring substrate on which a pattern such as a wiring is formed, and a pattern defect on the front or back surface of the substrate.
[0002]
[Prior art]
Usually, when a wiring board or the like is manufactured, after the wiring pattern is formed, it is inspected for the presence or absence of a defect such as disconnection or chipping in the wiring or a hole in the board.
[0003]
For this defect inspection, particularly for surface defect inspection of a flat substrate such as a wiring board, an automatic inspection apparatus using an image reading apparatus such as a line CCD sensor is widely adopted. In recent years, a flat substrate applied to a liquid crystal display device or the like has a tendency to gradually increase in size, and a stricter and quicker automatic inspection apparatus for this type of enlarged substrate is desired.
[0004]
Conventionally, with the increase in size of the substrate to be inspected, the substrate to be inspected is transported by a transporting means such as a transport belt or a roller in an automatic inspection device because it can be easily handled and high-speed transport is possible. A technique is widely used in which an inspected portion of the inspected substrate is read as an image by an image reading device such as a CCD sensor at a predetermined position, and the presence or absence of a defect is inspected based on the read image.
[0005]
Specifically, for example, a plurality of sets of opposed roller pairs are arranged in parallel along the transport direction at a predetermined interval, and both side edges of the test substrate in the transport direction are supported between the rollers of each set. A substrate that transports a substrate to be inspected and inspects for defects at a predetermined position while maintaining the flatness of the substrate is widely used.
[0006]
[Problems to be solved by the invention]
However, since the transport device in the conventional substrate inspection apparatus transports the entire surface of the substrate to be inspected without supporting the entire surface of the substrate to be inspected, the size of the substrate to be inspected increases with the weight of the substrate to be inspected. A part of the substrate sinks downward, and the substrate to be inspected is curved. For this reason, it becomes difficult to ensure the flatness of the substrate to be inspected, and there is a problem that a difference in depth of field occurs in an area where an image is read by a CCD sensor, and a defect cannot be detected with high accuracy.
[0007]
The present invention has been made to solve the above-described problems, and prevents the substrate from being bent, bent, warped, etc., and suppresses displacement in the thickness direction over the width direction of the substrate in the inspection region, thereby transporting the substrate. Accordingly, an object of the present invention is to provide a substrate inspection apparatus capable of inspecting defects of a substrate with high accuracy in the inspection region.
[0008]
[Means for Solving the Problems]
In order to achieve the above-mentioned object, the invention of claim 1 is characterized in that a conveying means for conveying a substrate on which a wiring pattern is formed by holding at least both ends in the width direction of the substrate with respective narrow belts; Consists of a plurality of rotating bodies whose axes are translated in the thickness direction of the substrate with respect to the trajectory when the substrate is linearly transferred by the transfer means, and the substrate is bent by the rotating body, Each rotating body is disposed so that the displacement amount in the thickness direction of the substrate from the locus is the largest in the inspection region provided in the transport path, and at least the In the inspection area, the conveyance guide means for guiding the conveyance so that there is no displacement in the thickness direction over the width direction of the substrate, and in the inspection area, along the width direction of the substrate guided by the conveyance guide means. And a line sensor that detects the substrate surface by scanning the substrate surface.
[0009]
Claim 3 The invention of claim 1 Or claim 2 In the invention, the line sensor is provided on both front and back sides of the substrate in the transport path of the substrate, and an inspection area is provided on each of the front and back sides of the substrate, and the front and back sides of the substrate are provided by the line sensor. Is detected.
[0010]
Claim 4 The invention of claim 1 Any one of Claim 3 According to the invention, an appropriate wiring pattern on the substrate is stored in advance, and a comparison means for comparing the appropriate wiring pattern with a detection result is further provided.
[0011]
According to the first aspect of the invention, the substrate is conveyed at a constant speed by the conveying means, and is guided by the conveying guide means so that there is no displacement in the thickness direction over the width direction of the substrate in the inspection area by the line sensor. Thereby, in the inspection region, the distance between the inspection portion of the substrate and the line sensor is constant in any portion in the width direction of the substrate, and a difference in depth of field is prevented across the width direction of the substrate. . Thereby, the state of the surface of the substrate can be properly detected by the line sensor, and the defect inspection of the substrate can be performed with high accuracy.
[0012]
in addition, Claim 3 According to this invention, the front surface and the back surface of the substrate can be inspected sequentially during one transport, and workability is improved.
[0013]
Furthermore, Claim 4 According to the invention, the pattern stored in advance by the comparison means and the detection result are compared, so that the inspection result is not uneven, and the workability is improved.
[0014]
The invention of claim 2 Conveying means for conveying a substrate on which a wiring pattern is formed by sandwiching at least both ends in the width direction of the substrate with respective narrow belts, and a trajectory when the substrate is conveyed linearly by the conveying means A guide member having an arc surface for displacing the transport path in the thickness direction of the substrate, the substrate is curved by the guide member, and the apex of the arc surface is in an inspection area provided in the transport path. Correspondingly, the guide member is disposed, and at least in the inspection region, transport guide means for guiding transport so that there is no displacement in the thickness direction across the width direction of the substrate, and in the inspection region, A line sensor that detects the substrate surface by scanning the substrate surface along the width direction of the substrate guided by the conveyance guide means. It is characterized by that.
[0015]
Claim 2 According to the invention , Group By providing a guide member having an arc surface for conveying the plate in an arc shape, the substrate to be conveyed is conveyed in an arc shape. That is, the substrate is curved in the transport direction, and the displacement in the thickness direction is suppressed over the width direction of the substrate. In addition, it is more stable than using a roller etc. by supporting a board | substrate with the circular arc surface of a guide member.
[0016]
Claim 1 Departure Clearly The transport guide means is composed of a plurality of rotating bodies whose axes are translated in the thickness direction of the substrate with respect to the trajectory when the substrate is transported linearly, and guides the rotating body. Thus, the rotating body is arranged so that the substrate is curved and the inspection area has the largest displacement amount.
[0017]
Also, Claim 5 The invention of Any one of Claims 1-4. In the invention, a corrugated conveyance path is formed by the rotating body, and the line sensor is arranged on each convex side in the thickness direction.
[0018]
Claim 1 According to the invention , Carrying As the feeding guide means, a plurality of rotating bodies whose axes are translated in the thickness direction of the substrate with respect to the trajectory when the substrate is conveyed linearly are arranged so that the displacement amount of the inspection region is maximized. A rotating body is disposed. Then, by passing the substrate between the rotating bodies, each rotating body supports a predetermined portion of the substrate from the upper side or the lower side in the inspection region. Each of the rotating bodies is displaced and arranged in the thickness direction, for example, the substrate can be curved in the conveying direction by arranging each rotating body alternately shifted in the thickness direction over the conveying direction, In the inspection region, in particular, the displacement in the thickness direction is suppressed over the width direction of the substrate.
[0019]
Also, Claim 5 According to this invention, both sides of the substrate can be inspected by arranging the line sensors on the respective convex sides in the thickness direction.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings.
[0021]
As shown in FIGS. 1 and 2, the substrate inspection apparatus 10 conveys a synthetic resin substrate 15 (see FIG. 9) on which a printed wiring pattern 15A is formed by etching or the like in the direction of arrow A in FIGS. As conveying means for carrying out, lower conveying belts 11 and 11 and upper conveying belts 13 and 13 are provided. In addition to the wiring pattern 15A, the substrate 15 is provided with a plurality of holes 15B for soldering component terminals. The dimensions of the substrate 15 are L = 350 mm and W = 100 mm as shown in FIG.
[0022]
The lower conveyor belts 11 and 11 are a pair of narrow endless belts, and the lower conveyor belts 11 and 11 convey while placing both ends of the substrate 15 in the width direction (arrow B direction in FIG. 1). It is. The lower conveyor belts 11 and 11 are wound around two cylindrical lower belt rollers 12 and 12 connected by a roller shaft 12A.
[0023]
The lower conveyor belts 11 and 11 both receive rotational force from a motor (not shown) via lower belt rollers 12 and 12 and are driven by the rotational force, and both are constant in the direction of arrow C in FIGS. It is designed to rotate at speed.
[0024]
Further, the upper conveyor belts 13 and 13 are a pair of narrow endless belts like the lower conveyor belts 11 and 11, and the upper conveyor belts 13 and 13 are both ends in the width direction by the lower conveyor belts 11 and 11. The substrate 15 travels while pressing the substrate 15 supported from the lower side from the upper side. The upper conveyor belts 13 and 13 are wound around two cylindrical upper belt rollers 14 and 14 connected by a roller shaft 14A, similarly to the lower conveyor belts 11 and 11. The upper conveyor belts 13 and 13 receive rotational force due to the frictional force of the lower conveyor belts 11 and 11 and are driven to rotate at a constant speed in the direction of arrow D in FIGS.
[0025]
The substrate 15 is sandwiched between the upper conveyor belts 13 and 13 and the lower conveyor belts 11 and 11 so that the both ends in the width direction are shifted from the left side to the right side as indicated by an arrow A in FIGS. It is designed to be transported. In addition, the width dimension of the lower side conveyance belts 11 and 11 and the upper side conveyance belts 13 and 13 is 3 mm-5 mm.
[0026]
A predetermined position between the upper belt rollers 14 and 14 is an upper image reading area 25 (see FIG. 2) as an inspection area on the front side surface of the substrate 15. Above the upper image reading area 25, an upper line CCD sensor 16 that reads an image of the front side surface of the substrate 15 is arranged as a line sensor that detects the state of the front side surface of the substrate 15. Below the upper line CCD sensor 16, lenses 17 are arranged at a predetermined interval. The upper line CCD sensor 16 detects the density of the front side surface of the substrate 15 by scanning the front side surface of the substrate 15 along the width direction of the substrate 15.
[0027]
Further, the lower part of the position slightly advanced in the transport direction (in the direction of arrow A in FIG. 2) from the upper image reading area 25 is a lower image reading area 27 (see FIG. 2) as an inspection area on the back side surface of the substrate 15. ing. Below the lower image reading area 27, a lower line CCD sensor 18 is arranged as a line-shaped line sensor that detects the state of the back side surface of the substrate 15. A lens 19 is disposed above the lower line CCD sensor 18 at a predetermined interval. Similar to the upper line CCD sensor 16, the lower line CCD sensor 18 scans the back side surface of the substrate 15 along the width direction of the substrate 15 to detect the density of the back side surface of the substrate 15. Further, in the vicinity of the upper line CCD sensor 16 and the lower line CCD sensor 18, an illumination device (not shown) that irradiates light from a light source (not shown) to the upper image reading area 25 and the lower image reading area 27 is provided. Yes. This illuminating device uniformly irradiates light to a linear region extending in the width direction of the substrate 15 at least in the upper image reading region 25 and the lower image reading region 27.
[0028]
As shown in FIG. 2, in the upper image reading area 25 which is a part of the transport path of the substrate 15, the substrate 15 to be transported is curved so as to extend in the thickness direction (in FIGS. 1 and 2). A plurality of cylindrical guide rollers 20 that suppress displacement in the direction of arrow E) are provided.
[0029]
Each of the plurality of guide rollers 20 is provided at a predetermined interval with respect to the conveyance direction of the substrate 15, and further on a locus L (see FIG. 5) when the substrate 15 is linearly conveyed. On the other hand, the axis is displaced to the upper side in the thickness direction of the substrate 15. As a result, in the upper image reading area 25, the substrate 15 is conveyed while drawing a convex arc locus on FIG. Further, two guide rollers 20 are arranged close to the reading position of the upper line CCD sensor 16 in the upper image reading area 25 (details of this arrangement will be described later), and these two guide rollers. The displacement in the thickness direction is strongly suppressed between the 20 spaces.
[0030]
Similarly, a plurality of guide rollers 20 are provided in the lower image reading area 27, and each of the plurality of guide rollers 20 is provided at a predetermined interval with respect to the conveyance direction of the substrate 15. With respect to the locus L, the axis is displaced downward in the thickness direction of the substrate 15. Thereby, in the lower image reading area 27, the substrate 15 is conveyed while drawing a convex arc locus on the lower side of FIG. Two guide rollers 20 are arranged close to the reading position of the lower line CCD sensor 18 in the lower image reading area 27, and the displacement in the thickness direction is firmly between the two guide rollers. It is supposed to be suppressed.
[0031]
3 and 4, the arrangement configuration for each roller 20 is shown. 3 and 4, the guide rollers 20 are distinguished from each other by adding A, B, C, D, E, F, G, H, I, and J to the end of 20. The leftmost guide roller 20A is provided inside the upper conveyor belts 13 and 13 so that the lower end thereof is positioned on the locus L. Next, the guide roller 20B located next to the guide roller 20A is provided inside the lower transport belts 11 and 11 with a predetermined distance from the guide roller 20A, and the center of rotation of the guide roller 20B. A region in the vicinity of the intermediate portion with the peripheral edge is positioned on the locus L. Further, the guide roller 20C is provided on the inner side of the lower conveying belts 11 and 11 with a predetermined distance from the guide roller 20B, and a portion near the rotation center of the guide roller 20C is positioned on the locus L. It has become. Further, the guide roller 20D is provided inside the lower conveying belts 11 and 11 with a predetermined distance from the guide roller 20C, and is positioned at the same height as the guide roller 20C. Furthermore, the guide roller 20E is provided on the inner side of the lower conveyance belt 15 with a predetermined distance from the guide roller 20D, and is positioned at the same height as the guide roller 20B.
[0032]
Subsequently, the guide roller 20F is provided on the inner side of the upper conveying belts 13 and 13 with a predetermined distance from the guide roller 20E, and the portion near the intermediate portion between the rotation center and the peripheral edge of the guide roller 20F is It is located on the locus L. The guide rollers 20G and 20H are respectively provided on the inner side of the upper conveying belts 13 and 13 with a predetermined distance from the guide roller 20F, and the portions near the rotation center of the guide rollers 20G and 20H are respectively on the locus L. It is supposed to be located. The guide roller 20I is provided inside the upper transport belts 13 and 13 with a predetermined distance from the guide roller 20H, and is positioned at the same height as the guide roller 20F. The guide roller 20J is provided on the inner side of the lower conveyance belt 11 at a predetermined interval from the guide roller 20I, and the upper end thereof is positioned on the locus L.
[0033]
That is, the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 are pressed by the guide roller 20A from the upper side on the locus L from the left side in FIG. 4, and the guide rollers from the lower side slightly above the locus L. Supported by 20B, 20C, 20D, and 20E. At this time, since the displacement amount of the guide rollers 20C and 20D is larger than the displacement amount of the guide rollers 20B and 20E, the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 are different from the guide rollers 20C and 20D. An arcuate conveyance path that protrudes upward with the middle as a vertex X is formed. Therefore, the substrate 15 is conveyed in the upper image reading area 25 along an arc locus having the vertex X in FIG. This arc is 300R.
[0034]
The lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 are pressed by the guide rollers 20F, 20G, 20H, and 20I from the upper side slightly below the locus L, and the guide rollers from the lower side on the locus L. Supported by 20J. At this time, since the displacement amount of the guide rollers 20G and 20H is larger than the displacement amount of the guide rollers 20F and 20H, the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 are intermediate between the guide rollers 20G and 20H. An arcuate conveyance path that protrudes downward with the portion Y as a vertex Y is formed. Therefore, the substrate 15 is transported in the lower image reading area 27 along an arc locus having the vertex Y in FIG. Note that this arc is about 300R, similar to the arc having the apex X as the apex.
[0035]
As a result, when the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 pass through the upper image reading area 25 and further pass through the lower image reading area 27, the conveying path has a gentle waveform in side view. Form. And the board | substrate 15 will be conveyed by the trace of a waveform according to the conveyance path of this waveform.
[0036]
The operation of the first embodiment will be described below.
[0037]
When the substrate 15 is carried in from the left side of FIG. 1, the lower conveyance belts 11 and 11 are driven, and the substrate 15 has both end portions in the width direction on the upper conveyance belts 13 and 13 and the lower conveyance belts 11 and 11. By being pinched, it is conveyed from the left side to the right side in FIG. 1 and carried out to the right side in FIG. 1 (see arrow A in FIG. 1). Since the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 are guided by the guide roller 20, when the substrate 15 passes through the upper image reading area 25, the lower side of the guide roller 20 </ b> A. Is drawn, passing through the upper side of the guide rollers 20B, 20C, 20D, and 20E, and drawing an arc locus protruding upward. Subsequently, when the substrate 15 passes through the lower image reading area 27, it passes under the guide rollers 20F, 20G, 20H and 20I, and further passes over the upper side of the guide roller 20J and protrudes downward. Draw an arc trajectory. As a result, when the substrate 15 passes through the upper image reading region 25 and the lower image reading region 27, the substrate 15 is conveyed along a gentle waveform locus.
[0038]
In the process of transporting the substrate 15, when the tip of the substrate 15 passes between the guide rollers 20 </ b> C and 20 </ b> D, the passage portion becomes an inspection target by the upper line CCD sensor 16. That is, when it is determined by detection of a sensor (not shown) that the front end portion of the substrate 15 passes between the guide rollers 20C and 20D, that is, the upper image reading area 25, light is emitted to the upper image reading area 25 by an illumination device (not shown). Irradiated, the upper line CCD sensor 16 is driven. Then, the vertex X (see FIG. 4) of the arc of the substrate 15 is read as an image along the width direction of the substrate 15 by the upper line CCD sensor 16.
[0039]
Subsequently, when the leading end portion of the substrate 15 passes between the guide rollers 20G and 20H, that is, when it is determined by detection of a sensor (not shown) that the leading end portion of the substrate 15 passes the lower image reading area 27, Light is irradiated to the side image reading area 27 by an illumination device (not shown), and the lower line CCD sensor 18 is driven. Then, the vertex Y (see FIG. 4) of the arc of the substrate 15 is read as an image by the lower line CCD sensor 18 along the width direction of the substrate 15.
[0040]
Further, when the rear end portion of the substrate 15 passes through the upper image reading area 25, the image reading by the upper line CCD sensor 16 is finished, and subsequently, the rear end portion of the substrate 15 passes through the lower image reading area 27. When this is done, image reading by the lower line CCD sensor 18 is completed. Then, when the images of the entire front and back surfaces of the substrate 15 are read, the presence or absence of defects such as chipped patterns or holes in the substrate 15 is inspected based on the read images.
[0041]
As described above, in the present embodiment, in the upper image reading area 25 and the lower image reading area 27, the substrate 15 is curved in the substrate conveyance direction by the guide roller 20, and is conveyed along an arc locus. Displacement in the thickness direction is suppressed over the width direction of the substrate. Accordingly, in the upper image reading area 25 and the lower image reading area 27, there is no difference in the depth of field of the upper line CCD sensor 16 and the lower line CCD sensor 18, and the vertices X and Y of the arcs of the substrate are not affected. By reading the image, the substrate 15 is appropriately reflected in the image read by the upper line CCD sensor 16 and the lower line CCD sensor 18. As a result, the defect inspection of the substrate 15 can be performed with high accuracy based on the read image.
[0042]
(Second Embodiment)
Then, the board | substrate inspection apparatus which is the 2nd Embodiment of this invention is demonstrated. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
[0043]
As shown in FIGS. 6 and 7, a first guide 31 and a second guide 32 are provided in the upper image reading area 25 which is a part of the conveyance path of the substrate 15 in the substrate inspection apparatus.
[0044]
The first guide 31 is provided on the inner side of the lower conveyance belts 11, and the shape thereof is a kamaboko shape in which the upper end surface (the upper side surface in FIG. 7) is an arcuate convex shape in a side view. The second guide 32 is provided inside the upper transport belts 13 and 13 and has a rectangular parallelepiped shape.
[0045]
The first guide 31 is positioned so that the vertex α of the arc (see FIG. 7) is positioned at the reading position by the upper line CCD sensor 16 in the upper image reading area 25 and the portion near the center of the first guide 31. Arranged so as to coincide with the locus L. The second guide 32 is provided at a predetermined interval in the direction opposite to the transport direction from the first guide 31 and is arranged so that the lower end surface thereof coincides with the locus L (see FIG. 8).
[0046]
That is, the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 are pressed by the second guide 32 from the upper side on the locus L from the left side in FIGS. The guide 31 is supported from below. At this time, the lower end surface of the second guide 32 is located on the locus L, but the arc surface of the first guide 31 is displaced above the locus L, so the lower conveyor belts 11 and 11 and the upper conveyor belt 13 and 13 form an arcuate conveyance path protruding upward with the apex α of the arc surface of the first guide 31 as the apex.
[0047]
Therefore, the first guide 31 and the second guide 32 are configured to suppress displacement in the thickness direction over the width direction of the substrate 15 by curving the substrate 15 to be conveyed.
[0048]
Similarly, a first guide 33 and a second guide 34 are provided in the lower image reading area 27 which is a part of the conveyance path of the substrate 15.
[0049]
The first guide 33 is provided on the inner side of the upper transport belts 13 and 13 and has a kamaboko shape whose lower end surface (the lower side surface in FIG. 7) has an arcuate convex shape in a side view. The second guide 34 is provided on the inner side of the upper conveyor belts 11 and 11 and has a rectangular parallelepiped shape.
[0050]
The first guide 33 is positioned at a position read by the lower line CCD sensor 17 in the lower image reading area 27, and the apex β of the arc (see FIG. 7) is located near the center of the first guide 33. The parts are arranged so as to coincide with the locus L (see FIG. 8). The second guides 34 are provided at a predetermined interval that advances in the transport direction relative to the first guide 33, and are arranged so that the upper end surfaces thereof coincide with the locus L.
[0051]
That is, the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 are pressed by the first guide 33 from the upper side slightly below the locus L from the left side in FIGS. The guide 34 is supported from below. At this time, the upper end surface of the second guide 34 is located on the trajectory L, but the arc surface of the first guide 33 is displaced below the trajectory L. Therefore, the lower transport belts 11 and 11 and the upper transport surface are transported. The belts 13 and 13 form an arcuate conveyance path that protrudes downward with the apex β of the arc surface of the first guide 31 as the apex.
[0052]
Therefore, the first guide 33 and the second guide 34 are configured to suppress displacement in the thickness direction over the width direction of the substrate 15 by curving the substrate 15 to be conveyed.
[0053]
As a result, when the lower conveyor belts 11 and 11 and the upper conveyor belts 13 and 13 pass through the upper image reading area 25 and pass through the lower image reading area 27, the conveying path has a gentle waveform in a side view. Form. Then, the substrate 15 is transported along a waveform trajectory along this waveform transport path (see FIG. 8).
[0054]
The operation of the second embodiment will be described below.
[0055]
6 and 7, when the substrate 15 is carried in from the left side, the lower conveyance belts 11 and 11 are driven, and the substrate 15 is moved in the width direction to the upper conveyance belts 13 and 13 and the lower conveyance belts 11 and 11. By sandwiching both ends, the sheet is transported from the left side to the right side in FIGS. 6 and 7 and unloaded to the right side in FIGS. 6 and 7 (see arrow A in FIG. 6). Since the lower conveyance belts 11 and 11 and the upper conveyance belts 13 and 13 are guided by the first guides 31 and 33 and the second guides 32 and 34, the substrate 15 passes through the upper image reading area 25. An arc locus that passes below the second guide 32 and passes above the first guide 31 and protrudes upward is drawn. Subsequently, when the substrate 15 passes through the lower image reading area 27, the substrate 15 passes under the first guide 33, and further passes through the upper side of the second guide 34 and draws an arc locus protruding downward. As a result, when the substrate 15 passes through the upper image reading region 25 and the lower image reading region 27, the substrate 15 is conveyed along a gentle waveform locus.
[0056]
In the process of transporting the substrate 15, when the tip of the substrate 15 passes through the apex α of the first guide 31, the passing portion becomes an inspection target by the upper line CCD sensor 16. That is, when it is determined by detection of a sensor (not shown) that the front end of the substrate 15 passes through the upper image reading area 25, the upper image reading area 25 is irradiated with light by an illumination device (not shown), and the upper line CCD sensor 16 is driven. Is done. Then, the apex α of the arc of the substrate 15 (see FIG. 7) is read as an image along the width direction of the substrate 15 by the upper line CCD sensor 16.
[0057]
Subsequently, when the tip of the substrate 15 passes the apex β (see FIG. 7) of the first guide 34, that is, when the tip of the substrate 15 passes the lower image reading area 27, it is determined by detection of a sensor (not shown). Then, the lower image reading area 27 is irradiated with light by an illuminating device (not shown), and the lower line CCD sensor 18 is driven. Then, the apex β of the arc of the substrate 15 is read as an image by the lower line CCD sensor 18 along the width direction of the substrate 15.
[0058]
Further, when the rear end portion of the substrate 15 passes through the upper image reading area 25, the image reading by the upper line CCD sensor 16 is finished, and subsequently, the rear end portion of the substrate 15 passes through the lower image reading area 27. When this is done, image reading by the lower line CCD sensor 18 is completed. Then, when the images of the entire front and back surfaces of the substrate 15 are read, the presence or absence of defects such as chipped patterns or holes in the substrate 15 is inspected based on the read images.
[0059]
Thus, in the second embodiment, in the upper image reading area 25 and the lower image reading area 27, the substrate 15 is curved in the substrate transport direction by the first guides 31, 33 and the second guides 32, 34. Since it is conveyed by the circular arc locus, the displacement in the thickness direction is suppressed over the width direction of the substrate. Accordingly, there is no difference in the depth of field between the upper line CCD sensor 16 and the lower line CCD sensor 18 in the upper image reading area 25 and the lower image reading area 27, and the vertices α and β of the arcs of the substrate are not changed. By reading the image, the substrate 15 is appropriately reflected in the image read by the upper line CCD sensor 16 and the lower line CCD sensor 18. As a result, the defect inspection of the substrate 15 can be performed with high accuracy based on the read image.
[0060]
In the substrate inspection apparatus according to the above-described two embodiments, the line CCD sensors 16 and 18 are provided on the upper side and the lower side, so that both front and back surfaces of the substrate 15 can be inspected, and workability is improved. . Furthermore, by arranging the guide roller 20 and the guides 31, 32, 33, and 34 so that the conveyance belt forms a corrugated conveyance path, the substrate 15 is conveyed in a waveform locus. In other words, the substrate 15 is bent so as to protrude once upward, but subsequently bent so as to protrude downward, so that the substrate 15 after the inspection is maintained in the original flat plate shape.
[0061]
The substrate inspection apparatus according to the above-described two embodiments further stores a regular pattern of the substrate 15 such as a computer in advance, and compares the regular pattern with the results detected by the line CCD sensors 16 and 18. By providing the means, it is possible to inspect defects and the like of the substrate 15 more accurately and more accurately than manual operations by humans.
[0062]
The substrate 15 is sandwiched between the lower conveyance belts 11 and 11 and the upper conveyance belts 13 and 13 at both ends in the width direction (shaded portions in FIG. 9), while the substrate 15 and the lower conveyance belts 11 and 11 The conveyor belts 13 and 13 are integrally conveyed. Therefore, the substrate 15 does not directly contact the guide roller 20 or the guides 31, 32, 33, and 34, and it is possible to prevent damage at both ends in the width direction of the substrate 15 (shaded portions in FIG. 9). is there. Furthermore, when detecting the front surface or the back surface of the substrate 15, the substrate 15 is scanned along the width direction of the substrate using the line CCD sensors 16 and 18. Accordingly, it is not necessary to stop the substrate 15 at the time of detection, that is, at the time of image reading, and the entire surface of the substrate 15 can be inspected, thereby improving workability. Furthermore, the lower conveyor belts 11 and 11 are formed longer than the upper conveyor belts 13 and 13 and can serve as a loading table and a loading table when the substrate 15 is conveyed. This also improves workability. In addition, since the substrate 15 is being read in the image reading region 25 or the image reading region 27 and the next substrate can be transported even when the processing is not finished, This also improves workability.
[0063]
In the two embodiments described above, as the conveyance guide means, the conveyance belt is guided by a guide or a roller that is a rotator to bend the substrate. However, the substrate is curved by another rotator such as a sphere or a bearing. The substrate can be curved by guiding the conveyor belt.
[0064]
【The invention's effect】
As described above, according to the present invention, the substrate is conveyed by suppressing the displacement in the thickness direction over the width direction of the substrate in the inspection region by preventing the substrate from being bent, bent, warped, etc. There is an excellent effect that the defect of the substrate can be inspected with high accuracy in the inspection region.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an overall configuration of a substrate inspection apparatus according to a first embodiment of the present invention.
FIG. 2 is a side view showing the overall configuration of the substrate inspection apparatus according to the first embodiment of the present invention.
FIG. 3 is a perspective view showing a configuration of an inspection region of the substrate inspection apparatus according to the first embodiment of the present invention.
FIG. 4 is a side view showing a configuration of an inspection region of the substrate inspection apparatus according to the first embodiment of the present invention.
FIG. 5 is a schematic side view showing the locus and the arrangement of guide rollers when the substrate is linearly conveyed in the inspection region of the substrate inspection apparatus according to the first embodiment of the present invention.
FIG. 6 is a perspective view showing a configuration of an inspection area of a substrate inspection apparatus according to a second embodiment of the present invention.
FIG. 7 is a side view showing a configuration of an inspection area of a substrate inspection apparatus according to a second embodiment of the present invention.
FIG. 8 is a schematic side view showing a locus when a substrate is conveyed linearly and an arrangement of guide rollers in an inspection region of a substrate inspection apparatus according to a second embodiment of the present invention.
FIG. 9 is a plan view showing a substrate to be transferred in the substrate inspection apparatus according to the embodiment of the present invention.
[Explanation of symbols]
10 Board inspection equipment
11 Lower conveyor belt
13 Upper conveyor belt
15 Substrate
16 line CCD sensor
18 line CCD sensor
20 Guide roller
25 Upper image reading area
27 Lower image reading area
31, 33 First Guide
32, 34 Second guide

Claims (4)

  1. A conveying means for conveying the substrate on which the wiring pattern is formed by sandwiching at least both ends in the width direction of the substrate with respective narrow belts;
    Consists of a plurality of rotating bodies whose axes are translated in the thickness direction of the substrate with respect to the trajectory when the substrate is linearly transferred by the transfer means, and the substrate is bent by the rotating body, Each rotating body is disposed such that the displacement amount in the thickness direction of the substrate from the locus becomes the largest in the inspection region provided in the transport path, and at least in the inspection region, the width direction of the substrate Conveyance guide means for guiding conveyance so that there is no displacement in the thickness direction over
    In the inspection region, a line sensor that detects the substrate surface by scanning the substrate surface along the width direction of the substrate guided by the conveyance guide means;
    A substrate inspection apparatus.
  2. The line sensor is provided on both front and back sides of the substrate in the transport path of the substrate, inspection areas are provided on the front and back sides of the substrate, and both the front and back sides of the substrate are detected by the line sensor. The substrate inspection apparatus according to claim 1 .
  3. 3. The substrate inspection apparatus according to claim 1 , further comprising a comparison unit that stores an appropriate wiring pattern on the substrate in advance and compares the appropriate wiring pattern with a detection result.
  4. By the conveyance guide means is conveying path waveform formation, the thickness direction of any one of claims 1 to 3 in which each of the line sensors on the convex side of the characterized in that it is located Board inspection equipment.
JP2000111298A 2000-04-12 2000-04-12 Board inspection equipment Expired - Lifetime JP4403229B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000111298A JP4403229B2 (en) 2000-04-12 2000-04-12 Board inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000111298A JP4403229B2 (en) 2000-04-12 2000-04-12 Board inspection equipment

Publications (2)

Publication Number Publication Date
JP2001296254A JP2001296254A (en) 2001-10-26
JP4403229B2 true JP4403229B2 (en) 2010-01-27

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003252343A1 (en) * 2003-07-30 2005-02-15 Nec Machinery Corporation Work carrying equipment and die bonder using the equipment
JP2006017481A (en) * 2004-06-30 2006-01-19 Fuji Photo Film Co Ltd Flaw inspection device of magnetic tape and flaw inspection method using it
US8502967B2 (en) * 2011-02-01 2013-08-06 Cooper S. K. Kuo Apparatus for optical inspection
CN104154947B (en) * 2014-08-29 2017-02-15 苏州正豪塑胶电子有限公司 USB terminal detection device

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