JP2008215976A - Substrate inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection device high in detection capacity capable of placing a substrate by avoiding the contact of a substrate feed arm and an inspection stage. <P>SOLUTION: The substrate inspection device is equipped with a transparent placing stand (inspection stage 20) on which the substrate to be inspected (wafer 10) is placed, a placing mechanism A for placing the substrate to be inspected on the placing stand at a predetermined position and an inspection part 40 (illumination light 41, an optical fiber 43 and an imaging element 44) for irradiating the back of the substrate to be inspected with light through the placing stand to inspect the substrate to be inspected. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an apparatus for inspecting the back side of a substrate such as a semiconductor substrate (silicon wafer) or a substrate of a liquid crystal display device, and more particularly to a substrate inspection apparatus applied to an automatic macro inspection apparatus that automatically detects pattern defects.

  2. Description of the Related Art There is known an apparatus that irradiates light on the back surface of a silicon wafer and detects particles such as dust adhering to the back surface of the wafer and crushed pieces of the wafer using scattered light from the back surface.

  When using an inspection stage with a structure that supports only the periphery of the wafer in the backside macro inspection of a thin wafer that has been ground or a large-diameter wafer, the wafer drops from the inspection stage. Or the wafer may be bent in the gravity direction by its own weight or warped.

  For this reason, an inspection apparatus has been proposed in which the entire back surface of the wafer is supported by a transparent inspection stage to prevent the wafer from dropping, bending, and warping (see FIG. 12 in Patent Document 1).

JP 2004-69580 A

  In an inspection apparatus equipped with an inspection stage that supports the entire back surface of the wafer, when the wafer is placed on the inspection stage from a transfer means such as a robot arm, the robot arm and the stage come into contact with each other to rub and damage the stage surface. It has been pointed out that it causes generation of particles.

  An object of the present invention is to provide a substrate inspection apparatus that can place a substrate while avoiding contact between a substrate transfer arm and an inspection stage and has high detection performance.

  A substrate inspection apparatus according to claim 1 of the present invention that achieves the above object is a transparent mounting table on which a substrate to be inspected is mounted, and a mounting for mounting the substrate to be inspected at a predetermined position on the mounting table. It is characterized by comprising a placement mechanism and an inspection section that inspects the surface on which the substrate to be inspected is placed by irradiating light through the placement table (for example, see FIG. 1).

  The substrate inspection apparatus according to claim 2 of the present invention is characterized in that the placement mechanism tilts the placement table and places the substrate to be inspected at a predetermined position (see, for example, FIG. 2). ).

  The substrate inspection apparatus according to claim 3 of the present invention is characterized in that the above-described mounting mechanism combines a plurality of the above-described mounting tables with each other to place the substrate to be inspected at a predetermined position (for example, FIG. 3 or FIG. 4).

  In the substrate inspection apparatus according to a fourth aspect of the present invention, the placement mechanism includes a plurality of arm members and an arm drive mechanism that moves the plurality of arm members, and the plurality of arm members are arranged in gravity. The arm drive mechanism is arranged so that the thickness in the direction is smaller than the amount of bending of the board to be inspected due to its own weight, and the arm driving mechanism is configured so that the part of the board to be inspected is placed on the mounting table. The plurality of arm members are moved in a direction to release the support of the substrate to be inspected (see, for example, FIG. 5).

  According to a fifth aspect of the present invention, there is provided a substrate inspection apparatus according to a fifth aspect of the present invention, wherein a substrate to be inspected is placed, a transparent placement table in which a predetermined portion is depressed, and a press for bringing the entire back surface of the substrate to be inspected into contact with the placement table A mechanism and an inspection unit that inspects the back surface of the substrate to be inspected by irradiating light through the mounting table (see, for example, FIG. 6).

  The substrate inspection apparatus according to claim 6 of the present invention is characterized in that the mounting table is formed of a plurality of transparent materials of different materials (for example, see FIG. 7).

  The substrate inspection apparatus according to claim 7 of the present invention is characterized in that light that illuminates the back surface of the substrate to be inspected is incident on the mounting table at an angle that is greater than or equal to an angle that totally reflects the surface of the mounting table. (For example, see FIG. 8).

  According to the present invention, the substrate can be placed while avoiding the contact between the substrate transfer arm and the inspection stage, and the detection performance is high.

  Hereinafter, an embodiment of a substrate inspection apparatus of the present invention will be described with reference to FIGS.

  FIG. 1 is an overall schematic diagram showing an embodiment of a substrate inspection apparatus of the present invention, and FIGS. 2A to 2D are first embodiments of a mounting mechanism A which is a characteristic part of the substrate inspection apparatus of the present invention. 3 is a plan view showing a second embodiment of the placement mechanism A, FIGS. 4A to 4C are views showing a third embodiment of the placement mechanism A, and FIG. FIG. 6 is a front view showing a fifth embodiment of the mounting mechanism A, FIG. 7 is a side view showing another embodiment of the inspection stage, and FIG. It is explanatory drawing in the case of test | inspecting the test | inspection stage surface using the board | substrate test | inspection apparatus of FIG.

  As shown in FIG. 1, the substrate inspection apparatus of the present embodiment includes an inspection stage 20 as a transparent mounting table on which a wafer 10 as a substrate to be inspected is placed, and the wafer 10 at a predetermined position on the inspection stage 20. A mounting mechanism A (see FIGS. 2 to 6) and an inspection unit 40 that inspects the back surface of the wafer 10 by irradiating light through the inspection stage 20.

  The inspection unit 40 includes an optical fiber 42 that guides illumination light 41 from a light source (not shown) to the inspection stage 20, a collimator lens 43 that collimates the illumination light 41 from the optical fiber 42, and a back surface of the wafer 10. An image pickup device 44 that detects scattered light and an air injection device 45 that blows compressed air 46 for bringing the wafer 10 into close contact with the surface of the inspection stage 20 are provided.

  The illumination light 41 enters the inspection stage 20 from one side surface of the inspection stage 20 via the optical fiber 42 and the collimating lens 43, and illuminates the back surface of the wafer 10 placed on the surface of the inspection stage 20. If there are no particles or chips on the back surface of the wafer 10, the illumination light 41 is reflected on the back surface of the wafer 10, and passes through a side surface opposite to the incident side surface of the inspection stage 20 as specularly reflected light. Although the light is emitted, if there is a defect such as particle adhesion or chipping on the back surface of the wafer 10, scattered light 47 is generated in the defective part such as particle or chipping, and most of the scattered light 47 is different from specular reflection light. The light is emitted from the back surface of the inspection stage 20 opposite to the surface on which the wafer 10 is placed. The image sensor 44 is disposed on the back side of the inspection stage 20 and receives and detects the scattered light 47.

  In FIG. 1, reference numeral 48 denotes a processing / control device that controls the air ejection device 45 and the image sensor 44 and inputs a photographic image signal from the image sensor 44 to perform image processing.

  2A to 2D show a first embodiment of the mounting mechanism A. The inspection stage 20 is configured to be tiltable, and the inspection stage 20 is tilted to inspect the robot arm 30. The wafer 10 transferred to the delivery position 20a of the stage 20 is configured to slide to the inspection position 20b of the inspection stage 20 that inspects the back surface of the wafer 10.

  A U-shaped notch 21 that avoids contact with the robot arm 30 is formed at the end of the inspection stage 20 on the delivery position 20a side (the left side in FIG. 2A). After entering the notch 21, the robot arm 30 is lowered by a drive mechanism (not shown) and placed on the delivery position 20a (see FIGS. 2A and 2B). The robot arm 30 moves backward when the wafer 10 is placed on the delivery position 20 a, leaves the wafer 10, and exits from the notch 21.

  A cylinder 31 for lifting the inspection stage 20 is disposed on the back side of the inspection stage 20 at the end of the inspection stage 20 on the delivery position 20a side. A pair of fall prevention pins 32 that prevent the wafer 10 from dropping from the surface of the inspection stage 20 are provided on the surface of the inspection stage 20 on the delivery position 20a side.

  Both side surfaces of the inspection stage 20 on the inspection position 20b side are rotatably supported by detachable pivots 33, and when the cylinder 31 is driven to lift the delivery position 20a side of the inspection stage 20, the inspection stage 20 pivots. It rotates about the part 33 as a fulcrum and enters an inclined state.

  A pair of positioning pins 34 for positioning the wafer 10 at the inspection position 20b are provided on the surface of the inspection stage 20 on the inspection position 20b side.

  Although not shown, both side surfaces of the inspection stage 20 on the delivery position 20a side are also rotatably supported by detachable pivoting portions. A cylinder for lifting the inspection stage 20 is also arranged on the back side of the end of the inspection stage 20 on the inspection position 20b side. After the inspection is finished, the inspection position 20b side of the inspection stage 20 is lifted so that the wafer 10 is returned to the delivery position 20a of the inspection stage 20, and the inspection stage 20 is opposite to the previous time with the delivery position 20a side as a fulcrum. This is because the wafer 10 is slid back to the delivery position 20a from the inspection position 20b by rotating in the direction.

  According to the mounting mechanism A of the first embodiment, as shown in FIGS. 2A and 2B, the wafer 10 transferred by the robot arm 30 is mounted at the delivery position 20 a of the inspection stage 20. . At this time, the robot arm 30 enters the notch 21 of the inspection stage 20. After the wafer 10 is placed on the inspection stage 20, the robot arm is temporarily retracted. Then, as shown in FIG. 6C, when the cylinder 31 is driven to lift the delivery position 20a side of the inspection stage 20 and the inspection stage 20 is rotated with the pivoting portion 33 as a fulcrum, the wafer 10 is inspected. Due to friction with the surface of the stage 20, it slides and moves to the inspection position 20 b side at an appropriate speed. The outer peripheral surface of the wafer 10 hits the positioning pin 34 at the inspection position 20b and is positioned at the inspection position 20b.

  Thereafter, the cylinder 31 is driven to lower the delivery position 20a side of the inspection stage 20 to return the inspection stage 20 to a horizontal state, and the illumination light 41 (FIG. 5) is applied to the back surface of the wafer 10 at the inspection position 20b via the inspection stage 20. 1). The inspection position 20b has no cutout, and the illumination light 41 does not cause irregular reflection due to the space between the wafer 10 and the inspection stage 20 generated by the cutout, so that the back surface of the wafer 10 can be inspected. Further, the entire back surface of the wafer 10 is supported by the inspection stage 20 and does not bend in the direction of gravity due to its own weight.

  After the inspection is completed, the pivot portion 33 on the inspection position 20b side is removed from the inspection stage 20, while the inspection stage 20 is rotatably supported by the pivot portion on the delivery 20a side. When the inspection stage 20 is lifted by the cylinder on the inspection position 20b side, the inspection stage 20 rotates around the pivoting portion on the delivery position 20a side, and the wafer 10 slides from the inspection position 20b to the delivery position 20a side. . When the wafer 10 hits the fall prevention pin 32, the wafer 10 stops at the delivery position 20a. Then, the cylinder on the inspection position 20b side is driven to return the inspection stage 20 to a horizontal state, the wafer 10 at the delivery position 20a is taken out by the robot arm 30, and a new wafer 10 is again transferred to the delivery position 20a and described above. Repeat the operation.

  Alternatively, after the inspection is completed, the cylinder 31 may be further contracted than in FIG. 5B, and the inspection stage 20 may be rotated in the opposite direction to that in FIG. 5C to move the wafer 10 from the inspection position 20b to the delivery position 20a. .

  FIG. 3 shows a second embodiment of the mounting mechanism A, in which the inspection stage 20 is divided into left and right stage pieces 22a and 22b, and the stage pieces 22a and 22b are horizontally aligned with each other when the wafer 10 is transferred. And a space for the robot arm 30 to enter between the stage pieces 22a and 22b is formed, and after the wafer 10 is placed, the stage pieces 22 are brought close to each other and united.

  The stage pieces 22a and 22b are equipped with drive mechanisms 35a and 35b, respectively, and the stage pieces 22a and 22b are moved toward and away from each other along the guide shaft 36.

  According to the mounting mechanism A of the second embodiment, when the wafer 10 is mounted on the inspection stage 20 and inspected, a space for the robot arm 30 is secured as shown in FIG. Then, the drive mechanisms 35 a and 35 b are driven to separate the stage pieces 22 a and 22 b from each other along the guide shaft 36. Then, the robot arm 30 is moved into a space between the stage pieces 22a and 22b so that both side portions of the wafer 10 are placed on the stage pieces 22a and 22b. Next, the robot arm 30 is retracted from between the stage pieces 22 a, 22 b, and the drive mechanisms 35 a, 35 b are driven to bring the stage pieces 22 a, 22 b closer to each other along the guide shaft 36.

  Thereafter, the illumination light 41 (see FIG. 1) is irradiated onto the back surface of the wafer 10 through the inspection stage 20, but the stage pieces 22a and 22b are united and there is no space between the stage pieces 22a and 22b. There is no space between the inspection stage 20 and the inspection stage 20, and the back surface of the wafer 10 can be inspected without causing the illumination light 41 to diffusely reflect. Further, the entire back surface of the wafer 10 is supported by the inspection stage 20 and does not bend in the direction of gravity due to its own weight. The illumination light 41 is irradiated in a direction parallel to the contact surface between the stage pieces 22a and 22b, and is not reflected at the position of the contact surface.

  After the inspection is completed, the stage pieces 22a and 22b are separated from each other along the guide shaft 36 by the driving mechanisms 35a and 35b, and a space for the robot arm 30 to enter between the stage pieces 22a and 22b is secured. Is taken out from the inspection stage 20, a new wafer 10 is transferred, and the above-described operation is repeated.

  FIGS. 4A to 4C show a third embodiment of the mounting mechanism A. The inspection stage 20 is divided into left and right stage pieces 23a and 23b, and any one of them when the wafer 10 is delivered. One stage piece 23a, 23b (the left stage piece 23a in FIGS. 4A to 4C) is lowered with respect to the other stage piece 23b to create a space for the robot arm 30 to enter, and the wafer 10 is placed on the other side. After being placed on the stage piece 23b, the one stage piece 23a is raised and united.

  One stage piece 23 a is disposed on the lift mechanism 37 and is lifted and lowered by the lift mechanism 37.

  According to the mounting mechanism A of the third embodiment, when the wafer 10 is mounted on the inspection stage 20 for inspection, a space for the robot arm 30 is provided as shown in FIG. In order to ensure, the lift mechanism 37 is driven, and one stage piece 23a is lowered with respect to the other stage piece 23b to secure a space for the robot arm 30 on the stage piece 23a. Then, as shown in FIG. 5B, the robot arm 30 is moved into an empty space on the stage piece 23a so that a part of the wafer 10 is placed on the stage piece 23bb so that the wafer 10 does not fall. Next, the robot arm 30 is retracted from the space on the stage 23a, the lift mechanism 37 is driven to raise the stage piece 23a to the same height as the stage piece 23b, and the stage pieces 23a and 23b are combined. Thereby, the stage pieces 23a and 23b have the same surface position without a step between the surfaces.

  Thereafter, the back surface of the wafer 10 is irradiated with illumination light 41 (see FIG. 1) via the inspection stage 20, but the stage pieces 23a and 23b are united so that there is no step between the surfaces of the stage pieces 23a and 23b. There is no space between the wafer 10 and the inspection stage 20, and the back surface of the wafer 10 can be inspected without causing irregular reflection of the illumination light 41 due to a step or space. Further, the entire back surface of the wafer 10 is supported by the inspection stage 20 and does not bend in the direction of gravity due to its own weight. The illumination light 41 is irradiated in a direction parallel to the contact surface between the stage pieces 23a and 23b, and is not reflected at the position of the contact surface.

  After completion of the inspection, the stage piece 23a is lowered by the lift mechanism 37 to secure a space for the robot arm 30 to enter on the stage piece 23a. The wafer 10 is taken out from the inspection stage 20 by the robot arm 30, and a new wafer 10 is removed. Transport and repeat the above operations.

  FIG. 5 shows a fourth embodiment of the mounting mechanism A, and the distance between the pair of left and right arm members 38a, 38b of the robot arm 30 that transports the wafer 10 onto the inspection stage 20 is determined. The amount of deflection in the gravitational direction of the wafer 10 supported by the arm members 38a and 38b is set to be larger than the thickness in the gravitational direction of 38b. That is, if the distance between the arm members 38a and 38b is increased, the amount of bending of the wafer 10 increases, and if the distance between the arm members 38a and 38b is decreased, the amount of bending of the wafer 10 decreases. Therefore, the distance between the arm members 38a and 38b is adjusted. The amount of bending of the wafer 10 is made larger than the thickness of the wafer 10.

  When the wafer 10 is supported by the arm members 38a and 38b, transferred onto the inspection stage 20, and lowered, the maximum deflection portion of the wafer 10 contacts the surface of the inspection stage 20 and is placed on the inspection stage 20. In this state, when the arm members 38a and 38b are retracted by an arm drive mechanism (not shown), the wafer 10 can be placed without bringing the arm members 38a and 38b into contact with the surface of the inspection stage 20 at all.

  The wafer 10 placed on the inspection stage 20 returns to a flat state. If necessary, compressed air 46 (see FIG. 1) may be blown by the air injection device 45 to bring the wafer 10 into close contact with the inspection stage 20.

  According to the mounting mechanism A of the fourth embodiment, when the wafer 10 is placed on the inspection stage 20 and inspected, the wafer 10 is supported on the inspection stage 20 while being supported by the arm members 38a and 38b. By transporting and lowering, the wafer 10 can be placed on the surface of the inspection stage 20 without the arm members 38a and 38b touching the surface of the inspection stage 20 as shown in FIG.

  Thereafter, the back surface of the wafer 10 is irradiated with illumination light 41 (see FIG. 1) via the inspection stage 20, but there is no space between the wafer 10 and the inspection stage 20, and the illumination light 41 is irregularly reflected by this space. The back surface of the wafer 10 can be inspected without causing any problems. Further, the entire back surface of the wafer 10 is supported by the inspection stage 20 and does not bend in the direction of gravity due to its own weight.

  FIG. 6 shows a fifth embodiment of the mounting mechanism A, in which the surface 24 of the inspection stage 20 is recessed in a curved shape so that the center of the surface is deepest, and the surface of the wafer 10 and the inspection stage 20 is shown. A gap is formed between the robot arm 30 and the robot arm 30.

  According to the mounting mechanism A of the fifth embodiment, when the wafer 10 is mounted on the inspection stage 20 and inspected, the wafer 10 and the robot arm 30 together with the robot arm 30 are inspected as shown in FIG. When lowered onto the surface 24, the peripheral portion of the wafer 10 is placed on the outer peripheral portion of the surface 24 of the inspection stage 20. At this time, the robot arm 30 is positioned at the center of the surface 24 of the inspection stage 20 that is most depressed. When the robot arm 30 is moved backward by an arm drive mechanism (not shown), the wafer 10 can be placed on the surface 24 of the inspection stage 20 without bringing the robot arm 30 into contact with the surface 24 of the inspection stage 20 at all. I can do it. Next, when the compressed air 46 is blown onto the wafer 10 by the air injection device 45, the wafer 10 bends following the surface 24 of the inspection stage 20, and no space is created between the wafer 10 and the surface 24 of the inspection stage 20. The wafer 20 is in close contact with the surface 24 of the inspection stage 20.

  Thereafter, the back surface of the wafer 10 is irradiated with illumination light 41 (see FIG. 1) via the inspection stage 20. The wafer 20 is brought into close contact with the surface 24 of the inspection stage 20 by the compressed air 46, and the wafer 10 and the inspection stage 20. There is no space between and the back surface of the wafer 10 can be inspected without causing the illumination light 41 to diffusely reflect. In addition, by performing distortion correction on the output of the image sensor 44 from the curvature of the surface 24 by image processing, an accurate inspection can be performed even if the wafer 10 is bent.

  After the inspection is completed, the driving of the air injection device 45 is stopped, so that the wafer 10 returns to an almost flat shape, and a space is generated between the wafer 10 and the surface 24 of the inspection stage 20. The robot arm 30 is inserted therein, the wafer 10 is taken out from the inspection stage 20, a new wafer 10 is transferred, and the above-described operation is repeated.

  FIG. 7 shows another embodiment of the inspection stage 20, in which the surface partial layer 25a of the inspection stage 20 that the robot arm 30 may come into contact with is composed of a glass material having an appropriate hardness, and the like. The base portion 25b is made of an inexpensive plastic material.

  In this manner, by configuring the inspection stage 20 from a glass material having an appropriate hardness only at necessary portions, it is possible to reduce the cost as compared with a case where the entire inspection stage 20 is configured from a glass material.

  FIG. 8 shows a case where the surface of the inspection stage 20 is inspected for the adhesion of particles, the presence or absence of scratches, etc. for the inspection of the next wafer 10 before or after the inspection of the wafer 10.

  In this case, the incident angle θ of the illumination light 41 to the inspection stage 20 is incident at an angle greater than the total reflection angle. When the angle is less than the total reflection angle, the illumination light 41 penetrates the surface of the inspection stage 20, hits hardware around the apparatus, and is reflected and reflected light (noise) may be incident on the image sensor 44. This is to avoid it.

  At an incident angle θ greater than the total reflection, the illumination light 41 travels substantially along the surface of the inspection stage 20. If particles P or the like are attached to the surface of the inspection stage 20, scattered light 47 is generated at the contact portion between the particles P and the surface of the inspection stage 20 due to the difference in refractive index, and a part of the scattered light is captured by the image sensor. 44 is detected.

  The present invention is not limited to the one shown in the above embodiment. The mounting mechanism A is not limited to those shown in FIGS. 2A to 2D, FIG. 3, FIG. 4A to FIG. 5C, FIG. 5 and FIG. When the substrate is transferred onto the inspection stage 20, it is only necessary to prevent the inspection stage 20 from contacting anything other than the wafer 10, such as a robot arm.

BRIEF DESCRIPTION OF THE DRAWINGS It is the whole schematic which shows one Embodiment of the board | substrate inspection apparatus of this invention. FIG. 1 shows a first embodiment of a mounting mechanism A provided in the substrate inspection apparatus of FIG. 1, and FIG. 1A is a plan view immediately before the substrate is mounted on an inspection stage as a mounting table from the transfer arm. (B) is a side view, FIG. (C) is a side view showing a state in which the inspection stage is tilted and the substrate is slid from the transfer arm onto the inspection stage, and (d) is an inspection of the substrate. It is a top view of the state mounted on the stage. It is a top view which shows 2nd Embodiment of the mounting mechanism A with which the board | substrate inspection apparatus of FIG. 1 is equipped. FIG. 3 shows a third embodiment of the mounting mechanism A equipped in the substrate inspection apparatus of FIG. 1, and FIG. 3A is a side view showing a state where the substrate is transferred to the inspection stage by the transfer arm. FIG. 5B is a side view of a state where a part of the substrate is placed on a part of the inspection stage by the transfer arm, and FIG. 5C is a side view of the state where the entire substrate is placed on the inspection stage. It is a front view which shows 4th Embodiment of the mounting mechanism A with which the board | substrate inspection apparatus of FIG. 1 is equipped. It is a front view which shows 5th Embodiment of the mounting mechanism A with which the board | substrate inspection apparatus of FIG. 1 is equipped. It is a side view which shows other embodiment of a test | inspection stage. It is explanatory drawing in the case of test | inspecting the surface of an inspection stage using the board | substrate inspection apparatus of FIG.

Explanation of symbols

10 Wafer (Subject to be inspected)
20 Inspection stage (mounting table)
20a Delivery position 20b Inspection position 22a, 22b Stage piece 23a, 23b Stage piece 24 Surface 30 Robot arm 31 Cylinder 32 Fall prevention pin 33 Pivoting part 34 Positioning pin 35a, 35b Drive mechanism 36 Guide shaft 37 Lift mechanism 38a, 38b Arm member 40 Inspection Unit 41 Illumination Light 44 Image Sensor 45 Air Injector 47 Scattered Light A Placement Mechanism

Claims (7)

A transparent mounting table on which the substrate to be inspected is mounted;
A mounting mechanism for mounting the substrate to be inspected at a predetermined position on the mounting table;
An inspection unit that irradiates and inspects the surface on which the substrate to be inspected is placed through the mounting table;
A board inspection apparatus comprising: The board inspection apparatus according to claim 1,
The mounting mechanism is a substrate inspection apparatus characterized in that the mounting base is inclined and the substrate to be inspected is mounted at a predetermined position. The board inspection apparatus according to claim 1,
The mounting mechanism includes a plurality of mounting tables that are combined with each other to place the substrate to be inspected at a predetermined position. The board inspection apparatus according to claim 1,
The placement mechanism includes a plurality of arm members and an arm drive mechanism that moves the plurality of arm members, and the thickness of the plurality of arm members bends by the weight of the substrate to be inspected. The plurality of arms are arranged so as to be smaller than a deflection amount, and the arm driving mechanism is configured to release the support of the substrate to be inspected after a part of the substrate to be inspected is placed on the mounting table. A substrate inspection apparatus characterized by moving a member. A transparent mounting table on which a substrate to be inspected is mounted, and a predetermined portion is depressed;
A pressing mechanism for bringing the entire back surface of the substrate to be inspected into contact with the mounting table;
An inspection unit that inspects the back surface of the substrate to be inspected by irradiating light through the mounting table;
A board inspection apparatus comprising: In the board | substrate inspection apparatus as described in any one of Claims 1 thru | or 5,
The board inspection apparatus, wherein the mounting table is formed of a plurality of transparent materials made of different materials. In the board | substrate inspection apparatus as described in any one of Claims 1 thru | or 6,
A substrate inspection apparatus, wherein light for illuminating the back surface of the substrate to be inspected is incident on the mounting table at an angle equal to or greater than an angle at which the surface of the mounting table is totally reflected.

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