JP4401655B2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置 Download PDF

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Publication number
JP4401655B2
JP4401655B2 JP2003003803A JP2003003803A JP4401655B2 JP 4401655 B2 JP4401655 B2 JP 4401655B2 JP 2003003803 A JP2003003803 A JP 2003003803A JP 2003003803 A JP2003003803 A JP 2003003803A JP 4401655 B2 JP4401655 B2 JP 4401655B2
Authority
JP
Japan
Prior art keywords
bonding
capillary
recognition lens
temperature difference
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003003803A
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English (en)
Japanese (ja)
Other versions
JP2004221144A (ja
JP2004221144A5 (enExample
Inventor
剛充 安本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP2003003803A priority Critical patent/JP4401655B2/ja
Publication of JP2004221144A publication Critical patent/JP2004221144A/ja
Publication of JP2004221144A5 publication Critical patent/JP2004221144A5/ja
Application granted granted Critical
Publication of JP4401655B2 publication Critical patent/JP4401655B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP2003003803A 2003-01-10 2003-01-10 ワイヤボンディング装置 Expired - Fee Related JP4401655B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003003803A JP4401655B2 (ja) 2003-01-10 2003-01-10 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003003803A JP4401655B2 (ja) 2003-01-10 2003-01-10 ワイヤボンディング装置

Publications (3)

Publication Number Publication Date
JP2004221144A JP2004221144A (ja) 2004-08-05
JP2004221144A5 JP2004221144A5 (enExample) 2005-06-30
JP4401655B2 true JP4401655B2 (ja) 2010-01-20

Family

ID=32894964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003003803A Expired - Fee Related JP4401655B2 (ja) 2003-01-10 2003-01-10 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JP4401655B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
JP7536344B1 (ja) * 2023-04-24 2024-08-20 株式会社新川 ワイヤボンディング装置、ワイヤボンディング方法及びワイヤボンディングプログラム

Also Published As

Publication number Publication date
JP2004221144A (ja) 2004-08-05

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