JP4398500B2 - 樹脂組成物及び光学部材 - Google Patents
樹脂組成物及び光学部材 Download PDFInfo
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- JP4398500B2 JP4398500B2 JP2008095069A JP2008095069A JP4398500B2 JP 4398500 B2 JP4398500 B2 JP 4398500B2 JP 2008095069 A JP2008095069 A JP 2008095069A JP 2008095069 A JP2008095069 A JP 2008095069A JP 4398500 B2 JP4398500 B2 JP 4398500B2
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| US8674038B2 (en) | 2007-09-27 | 2014-03-18 | Nippon Skokubai Co., Ltd. | Curable resin composition for molded bodies, molded body, and production method thereof |
| JP4406465B2 (ja) * | 2008-03-27 | 2010-01-27 | 株式会社日本触媒 | 成型体用硬化性樹脂組成物、成型体及びその製造方法 |
| CN102388078B (zh) * | 2009-04-17 | 2013-09-25 | 三井化学株式会社 | 密封用组合物以及密封用片 |
| WO2011102288A1 (ja) * | 2010-02-16 | 2011-08-25 | ダイセル化学工業株式会社 | 硬化性組成物及び硬化物 |
| JP2012077257A (ja) * | 2010-10-06 | 2012-04-19 | Daicel Corp | 硬化物の製造方法及び硬化物 |
| JP2013234231A (ja) * | 2012-05-07 | 2013-11-21 | Nippon Shokubai Co Ltd | カチオン硬化性樹脂組成物 |
| JP6022302B2 (ja) * | 2012-10-30 | 2016-11-09 | 株式会社トクヤマ | 乾式シリカ微粒子 |
| KR102131193B1 (ko) | 2013-02-19 | 2020-07-07 | 주식회사 다이셀 | 웨이퍼 레벨 렌즈용 경화성 조성물, 웨이퍼 레벨 렌즈의 제조 방법 및 웨이퍼 레벨 렌즈, 및 광학 장치 |
| EP3480828A4 (en) * | 2016-07-01 | 2020-03-04 | Nissan Chemical Corporation | METHOD FOR PREVENTING THE ARRANGEMENT OF A RAMPANT ELECTRIC SHOCK |
| JP6658923B2 (ja) * | 2017-02-14 | 2020-03-04 | 荒川化学工業株式会社 | 組成物、絶縁コーティング剤、硬化物及び電子回路基板 |
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| JP2005263869A (ja) * | 2004-03-16 | 2005-09-29 | Nagase Chemtex Corp | 光半導体封止用樹脂組成物 |
| JP2005272672A (ja) * | 2004-03-25 | 2005-10-06 | Toray Ind Inc | 難燃剤マスターバッチ、熱硬化性樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP4452683B2 (ja) * | 2005-01-26 | 2010-04-21 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置 |
| JP5176290B2 (ja) * | 2005-06-15 | 2013-04-03 | 東レ株式会社 | ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 |
| JP4810911B2 (ja) * | 2005-07-26 | 2011-11-09 | パナソニック電工株式会社 | エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス |
| JP4812364B2 (ja) * | 2005-08-18 | 2011-11-09 | ダイセル化学工業株式会社 | 硬化性樹脂組成物及び光導波路 |
| JP4788457B2 (ja) * | 2006-04-18 | 2011-10-05 | 三菱瓦斯化学株式会社 | プリプレグ並びに銅張積層板 |
| JP5072309B2 (ja) * | 2006-09-29 | 2012-11-14 | 株式会社日本触媒 | 樹脂組成物及びその製造方法 |
| JP5000261B2 (ja) * | 2006-10-20 | 2012-08-15 | 株式会社ダイセル | エポキシ樹脂組成物及びエポキシ樹脂硬化物 |
| JP5480469B2 (ja) * | 2006-10-31 | 2014-04-23 | 株式会社日本触媒 | 樹脂組成物、光学材料、及び、該光学材料の制御方法 |
| JP4390826B2 (ja) * | 2006-10-31 | 2009-12-24 | 株式会社日本触媒 | 有機無機複合樹脂組成物及び光学部材 |
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| JP4398500B2 (ja) * | 2007-04-06 | 2010-01-13 | 株式会社日本触媒 | 樹脂組成物及び光学部材 |
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