JP2008274260A5 - - Google Patents

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Publication number
JP2008274260A5
JP2008274260A5 JP2008095069A JP2008095069A JP2008274260A5 JP 2008274260 A5 JP2008274260 A5 JP 2008274260A5 JP 2008095069 A JP2008095069 A JP 2008095069A JP 2008095069 A JP2008095069 A JP 2008095069A JP 2008274260 A5 JP2008274260 A5 JP 2008274260A5
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JP
Japan
Prior art keywords
resin composition
molecular weight
organic resin
composition according
optical member
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JP2008095069A
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English (en)
Japanese (ja)
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JP2008274260A (ja
JP4398500B2 (ja
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Priority to JP2008095069A priority Critical patent/JP4398500B2/ja
Priority claimed from JP2008095069A external-priority patent/JP4398500B2/ja
Publication of JP2008274260A publication Critical patent/JP2008274260A/ja
Publication of JP2008274260A5 publication Critical patent/JP2008274260A5/ja
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Publication of JP4398500B2 publication Critical patent/JP4398500B2/ja
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JP2008095069A 2007-04-06 2008-04-01 樹脂組成物及び光学部材 Active JP4398500B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008095069A JP4398500B2 (ja) 2007-04-06 2008-04-01 樹脂組成物及び光学部材

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007100963 2007-04-06
JP2008095069A JP4398500B2 (ja) 2007-04-06 2008-04-01 樹脂組成物及び光学部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009243570A Division JP5037584B2 (ja) 2007-04-06 2009-10-22 樹脂組成物及び光学部材

Publications (3)

Publication Number Publication Date
JP2008274260A JP2008274260A (ja) 2008-11-13
JP2008274260A5 true JP2008274260A5 (enExample) 2009-07-02
JP4398500B2 JP4398500B2 (ja) 2010-01-13

Family

ID=40052635

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008095069A Active JP4398500B2 (ja) 2007-04-06 2008-04-01 樹脂組成物及び光学部材
JP2009243570A Expired - Fee Related JP5037584B2 (ja) 2007-04-06 2009-10-22 樹脂組成物及び光学部材

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009243570A Expired - Fee Related JP5037584B2 (ja) 2007-04-06 2009-10-22 樹脂組成物及び光学部材

Country Status (1)

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JP (2) JP4398500B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4398500B2 (ja) * 2007-04-06 2010-01-13 株式会社日本触媒 樹脂組成物及び光学部材
US8674038B2 (en) 2007-09-27 2014-03-18 Nippon Skokubai Co., Ltd. Curable resin composition for molded bodies, molded body, and production method thereof
JP4406465B2 (ja) * 2008-03-27 2010-01-27 株式会社日本触媒 成型体用硬化性樹脂組成物、成型体及びその製造方法
CN102388078B (zh) * 2009-04-17 2013-09-25 三井化学株式会社 密封用组合物以及密封用片
WO2011102288A1 (ja) * 2010-02-16 2011-08-25 ダイセル化学工業株式会社 硬化性組成物及び硬化物
JP2012077257A (ja) * 2010-10-06 2012-04-19 Daicel Corp 硬化物の製造方法及び硬化物
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
JP6022302B2 (ja) * 2012-10-30 2016-11-09 株式会社トクヤマ 乾式シリカ微粒子
KR102131193B1 (ko) 2013-02-19 2020-07-07 주식회사 다이셀 웨이퍼 레벨 렌즈용 경화성 조성물, 웨이퍼 레벨 렌즈의 제조 방법 및 웨이퍼 레벨 렌즈, 및 광학 장치
EP3480828A4 (en) * 2016-07-01 2020-03-04 Nissan Chemical Corporation METHOD FOR PREVENTING THE ARRANGEMENT OF A RAMPANT ELECTRIC SHOCK
JP6658923B2 (ja) * 2017-02-14 2020-03-04 荒川化学工業株式会社 組成物、絶縁コーティング剤、硬化物及び電子回路基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4450151B2 (ja) * 2003-02-19 2010-04-14 Ｔｏｔｏ株式会社 エポキシ樹脂成形体からなる人工大理石
JP2005263869A (ja) * 2004-03-16 2005-09-29 Nagase Chemtex Corp 光半導体封止用樹脂組成物
JP2005272672A (ja) * 2004-03-25 2005-10-06 Toray Ind Inc 難燃剤マスターバッチ、熱硬化性樹脂組成物、プリプレグおよび繊維強化複合材料
JP4452683B2 (ja) * 2005-01-26 2010-04-21 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
JP5176290B2 (ja) * 2005-06-15 2013-04-03 東レ株式会社 ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板
JP4810911B2 (ja) * 2005-07-26 2011-11-09 パナソニック電工株式会社 エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス
JP4812364B2 (ja) * 2005-08-18 2011-11-09 ダイセル化学工業株式会社 硬化性樹脂組成物及び光導波路
JP4788457B2 (ja) * 2006-04-18 2011-10-05 三菱瓦斯化学株式会社 プリプレグ並びに銅張積層板
JP5072309B2 (ja) * 2006-09-29 2012-11-14 株式会社日本触媒 樹脂組成物及びその製造方法
JP5000261B2 (ja) * 2006-10-20 2012-08-15 株式会社ダイセル エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP5480469B2 (ja) * 2006-10-31 2014-04-23 株式会社日本触媒 樹脂組成物、光学材料、及び、該光学材料の制御方法
JP4390826B2 (ja) * 2006-10-31 2009-12-24 株式会社日本触媒 有機無機複合樹脂組成物及び光学部材
JP5305707B2 (ja) * 2007-03-29 2013-10-02 株式会社日本触媒 樹脂組成物及び光学部材
JP4398500B2 (ja) * 2007-04-06 2010-01-13 株式会社日本触媒 樹脂組成物及び光学部材

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