JP4368705B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4368705B2 JP4368705B2 JP2004072535A JP2004072535A JP4368705B2 JP 4368705 B2 JP4368705 B2 JP 4368705B2 JP 2004072535 A JP2004072535 A JP 2004072535A JP 2004072535 A JP2004072535 A JP 2004072535A JP 4368705 B2 JP4368705 B2 JP 4368705B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- select
- semiconductor chip
- signal terminal
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
2 電極
3 保護膜
4 有機絶縁膜
5 UBM
6 はんだバンプ
7 UBM用金属膜
8 レジストパターン
9 第1の有機絶縁膜
10 配線パターン
11 第2の有機絶縁膜
12 酸化膜
20 信号端子
21 セレクト回路
22 セレクト信号端子
23 ESD回路
24 レギュレート回路
25 レギュレート信号端子
30 バンプ形成位置
31 配線パターン用金属膜
33 検査用プローブ
Claims (3)
- 半導体チップの電極上にUBMを介してバンプが形成され、あるいは半導体チップの電極形成面上で前記半導体チップの電極に電気的に接続している金属配線上にバンプが形成された半導体装置であって、前記半導体チップの信号端子の電極と前記信号端子のバッファ回路とを接続する配線上にセレクト回路を有し、かつ前記セレクト回路はGNDまたは電源と接続し、前記セレクト回路のセレクト信号端子にセレクト信号が入力されることで前記信号端子から前記セレクト回路を通ってGNDまたは電源に流れる回路が設定されることを特徴とする半導体装置。
- 複数の信号端子にそれぞれ接続された全てのセレクト回路のセレクト信号端子が共通の電極端子に接続している請求項1記載の半導体装置。
- 複数の信号端子にそれぞれ接続された全てのセレクト回路のセレクト信号端子が共通のレギュレート回路に接続している請求項1記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004072535A JP4368705B2 (ja) | 2004-03-15 | 2004-03-15 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004072535A JP4368705B2 (ja) | 2004-03-15 | 2004-03-15 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005260134A JP2005260134A (ja) | 2005-09-22 |
JP4368705B2 true JP4368705B2 (ja) | 2009-11-18 |
Family
ID=35085542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004072535A Expired - Fee Related JP4368705B2 (ja) | 2004-03-15 | 2004-03-15 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4368705B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103064004A (zh) * | 2012-12-17 | 2013-04-24 | 深圳深爱半导体股份有限公司 | 芯片级测试装置 |
JP6155725B2 (ja) * | 2013-03-19 | 2017-07-05 | 富士電機株式会社 | 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法 |
-
2004
- 2004-03-15 JP JP2004072535A patent/JP4368705B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005260134A (ja) | 2005-09-22 |
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