JP4362847B2 - Drawing device - Google Patents

Description

  The present invention relates to a drawing apparatus that draws a pattern on a mask (reticle), a pattern-forming substrate such as a sheet-like substrate or a glass substrate, or a photosensitive material such as recording paper, and in particular, when relatively moving the photosensitive material for drawing. The present invention relates to a process for correcting the positional deviation of the photosensitive material that occurs in the above.

In a drawing apparatus using laser beam scanning or a drawing apparatus using a light modulation unit such as a DMD (Digital Micro-mirror Device) in which light modulation elements such as micromirrors are two-dimensionally arranged, a glass substrate or a sheet-like substrate is fixed. Then, the exposure operation (drawing) is performed according to the pattern. In the case of laser beam scanning, the substrate is continuously conveyed at a constant speed, and the beam is scanned along a direction (scanning direction) perpendicular to the moving direction of the substrate. While the substrate is moved, due to the accuracy of the transport mechanism such as a roller or a stage, a positional deviation occurs along the direction orthogonal to the moving direction of the substrate. In the case of the laser beam scanning method, the scanning start position of the laser beam is shifted in accordance with the amount of deviation in order to correct the positional deviation during substrate conveyance (see Patent Document 1).
Japanese Patent Laid-Open No. 2000-227661

  When the light modulation unit is used to improve the pattern resolution, the exposure area, which is the irradiation area of the light modulation unit, is displaced from the original position when the transported substrate is misaligned. Deviation occurs. In particular, when performing an exposure operation using a plurality of light modulation units, there is a possibility that the exposure circuit area overlaps or becomes discrete and the formed circuit pattern is short-circuited.

  The drawing apparatus of the present invention is a drawing apparatus for drawing a pattern on a pattern forming substrate such as a sheet-like printed wiring board or a glass substrate, or a photosensitive material such as recording / printing paper. As a drawing apparatus, a drawing apparatus that directly draws a sheet-like substrate having a considerable length in a continuously conveyed state, a drawing apparatus that draws a pattern on a mask (reticle), and a pattern forming substrate directly on the stage There are a drawing apparatus to be mounted and an image forming apparatus such as a copying machine for forming a pattern on an image recording sheet.

  The drawing apparatus of the present invention includes a light source that emits light for pattern formation, a light modulation unit, and drawing means. The light modulation unit regularly arranges a plurality of light modulation elements, and projects the light from the light source onto the light-sensitive material according to the positions of the plurality of light modulation elements. For example, a DMD or LCD is applied as a light modulation unit, and can be selectively switched between an ON state for guiding light to the substrate and an OFF state for guiding light to the outside of the substrate, and is composed of a light beam corresponding to a pattern to be formed at that location. Light is irradiated onto the substrate. In the case of a drawing apparatus or the like on which a substrate is mounted on a stage, scanning means for moving the exposure area relative to the photosensitive material in the scanning direction is provided.

  The drawing means independently controls the plurality of light modulation elements based on drawing data having a data arrangement corresponding to the arrangement of the plurality of light modulation elements. For example, the drawing data is raster data, and the mirror is controlled according to the raster data binarized according to each dot position on the substrate. In the drawing apparatus, CAD pattern data, which is vector data, is generated in advance. In this case, the drawing apparatus may be provided with a data conversion processing unit. The data conversion processing unit converts the drawing pattern data into raster data, the memory that can store the drawing data as raster data, and sequentially writes and outputs the drawing data to the memory according to the relative position of each of the plurality of exposure areas. Data conversion processing means.

  The exposure area along the displacement direction orthogonal to the scanning direction while the exposure area by the light modulation unit moves relative to the photosensitive material due to the accuracy of a transport mechanism such as a roller and a stage for feeding the substrate. There may be a relative displacement of. The drawing apparatus of the present invention is configured to correct in real time a positional shift that occurs while the exposure area moves relatively. The drawing means defines a drawing area having a size smaller than the entire irradiation area of the light modulation unit, and draws with a light modulation element arranged in the drawing area. That is, the positional deviation is predicted in advance, drawing data that is wider than the actual exposure area or equivalent to the actual exposure area is prepared, and drawing processing is performed based on the partial data. The drawing apparatus includes drawing correction means for shifting the drawing data and the drawing area respectively in a direction for correcting the position shift based on the displacement amount of the position shift.

  The drawing area is shifted along the direction on the light modulation unit corresponding to the direction in which the positional deviation of the exposure area occurs, that is, the direction orthogonal to the relative movement direction. In addition, since the divided drawing data corresponds to the arrangement of a plurality of light modulation elements and is associated with the position along the orthogonal direction, the data is shifted so as to be associated with the position by being shifted by the amount of displacement. do it. For example, in a drawing apparatus, when pattern data is converted into raster data as drawing data and written to the memory, the drawing correction unit writes the drawing data to be corrected to the memory with a shift by a displacement amount. That is, the raster data is stored with the address shifted by an amount corresponding to the amount of displacement. Regarding the shift of the drawing area, each micromirror other than the drawing area may be turned off.

  When the substrate is displaced, the drawing area is shifted in accordance with the displacement, so that the position of the exposure area varies. For this reason, the exposure area relatively moves along the corresponding scanning band, the passing areas of the adjacent exposure areas do not overlap, and an area where no light is irradiated does not occur. In addition, since the drawing data is also shifted in accordance with the positional deviation, the pattern deviation does not occur at the joint portion between the adjacent scanning bands.

  If the substrate position deviation is periodic and can be predicted in advance, the position deviation is stored as data in advance, and when the exposure area is relatively moved, a drawing correction process may be performed according to the position. However, when the positional deviation is aperiodic and cannot be predicted in advance, the drawing apparatus detects the displacement amount of the positional deviation of the photosensitive material using the scanning direction of the substrate as a reference line while the exposure area is relatively moved. A detection unit is provided.

  If the time taken to execute the drawing correction process after detecting the amount of positional deviation is taken into consideration, the position correction is detected at a position before the relative position of the exposure area, that is, the position immediately before drawing, and the drawing correction process is performed. It is good to do. In this case, the misregistration detection unit detects misregistration at a location near the exposure area and separated by a predetermined distance in the scanning direction.

  According to the present invention, even when a relative positional shift occurs in the exposure area while the exposure area is moved relative to the substrate, a pattern to be formed at that location can be drawn as it is with high accuracy. .

  Below, the drawing system which is embodiment of this invention is demonstrated with reference to drawings.

  FIG. 1 is a perspective view schematically showing a drawing system according to the present embodiment.

  The drawing apparatus 10 is a drawing apparatus that directly draws the substrate SW, and is connected to a pattern data processing unit 14 such as a workstation. The drawing apparatus is disposed in the transport path of the substrate SW coated with a photosensitive material such as a photoresist. The substrate SW is formed in a sheet shape made of a copper-clad laminate and has a length of several hundred meters. The substrate SW is installed in a rolled state, and is continuously transported at a substantially constant speed along the direction of the arrow M by transport rollers CR1 to CR3 and the like outside the drawing apparatus 10. During this time, the substrate SW passes from the entrance 10A of the drawing apparatus 10 through the exit 10B.

  The drawing apparatus 10 continuously draws continuously and continuously on the substrate SW entering at a constant speed. The substrate SW that has passed through the drawing apparatus 10 is conveyed as it is to an apparatus that performs other processes such as development and etching. The rollers CR1 to CR3 are disposed in a housing (not shown).

  FIG. 2 is a perspective view schematically showing the internal configuration of the drawing apparatus 10. FIG. 3 is a diagram schematically showing the internal configuration of one exposure head.

  The drawing apparatus 10 includes four exposure heads 12 </ b> A to 12 </ b> D, and is regularly arranged at a position vertically away from the substrate SW by a predetermined distance. The four exposure heads 12 </ b> A to 12 </ b> D are arranged in a row in an oblique direction with respect to the transport direction M of the substrate SW, and are spaced apart from each other along the transport direction M by a fixed interval. The width B of the substrate SW here is in the range of about 100 to 600 mm, and the distance interval along the transport direction of the adjacent exposure heads in each row is in the range of about 200 to 600 mm. Hereinafter, the direction along the transport direction M is represented by “X”, and the width direction of the substrate SW perpendicular to the transport direction M is represented by “Y”.

  For the four exposure heads 12A to 12D, four semiconductor lasers (not shown here) and a reflection mirror (not shown) are arranged above the substrate SW, and the light emitted from each semiconductor laser is Each is guided to a corresponding exposure head via a corresponding reflecting mirror. Each of the exposure heads 12A to 12D includes a DMD (Digital Micro-mirror Device) in which a plurality of micromirrors are two-dimensionally arranged.

As shown in FIG. 3, the exposure head 12C of the four exposure heads includes a DMD 13C, an illumination optical system 24, and an imaging optical system 26, and the beam LB emitted from the semiconductor laser is guided to the illumination optical system 24. It is burned. The illumination optical system 24 shapes the light beam of the laser beam LB into a parallel light beam, and the light that has passed through the illumination optical system 24 irradiates the entire irradiation area AM of the DMD 13C. In the DMD 13C, M × N micromirrors having a height h and a width w are arranged in a matrix, and the micromirrors are arranged according to the position (i, j) by X _ij (1 ≦ i ≦ M, 1 ≦ j ≦ N).

The micromirror X _ij is selectively positioned in either a first posture for guiding light onto the substrate SW or a second posture for guiding light out of the substrate SW, and each mirror is controlled independently. When the micromirror X _ij is in the first posture (ON state), the light reflected by the micromirror X _ij is guided onto the substrate SW via the imaging optical system 26. On the other hand, when the micromirror X _ij is in the second posture (OFF state), the light reflected by the micromirror X _ij is guided to the light absorbing plate 29. Here, the imaging magnification of the imaging optical system 26 is set to 1. The other exposure heads 12A, 12B, and 12D have the same configuration.

  Drawing regions defined by dividing the substrate SW into four along the transport direction M are assigned to the exposure heads 12A to 12D, respectively, and scanning bands S1 to S4 are defined for the exposure heads 12A to 12D. (See FIG. 2). Exposure areas EA1 to EA4, which are irradiation areas (beam spots) of light from the exposure heads 12A to 12D, are formed according to the widths of the scanning bands S1 to S4, respectively, and light is irradiated to the entire substrate by the four exposure areas EA1 to EA4. Is done. Adjacent exposure areas are positioned apart from each other along the transport direction M by a predetermined distance interval DL.

  The DMD 13C in the exposure head 12C has a size that can irradiate the substrate SW beyond the width EB of the assigned scanning band S3. As shown in FIG. 3, the light exposure area EA′3 by the entire irradiation area AM of the DMD 13C exceeds the width EB along the Y direction of the scanning band S3 along the width direction (Y direction). A drawing area EM for forming an exposure area EA3 corresponding to the scanning bandwidth EB is defined in the entire irradiation area AM of the DMD 13C. The micromirror outside the drawing area EM is normally positioned in the second posture (OFF state) so as not to irradiate the substrate SW. The DMDs in the other exposure heads 12A, 12B, and 12D are similarly configured.

  Sprocket holes PR are formed in the substrate SW along the transport direction M, and are formed at a very short distance interval compared to the distance interval DL of the exposure area. For example, when the distance interval DL is about several hundred millimeters, the sprocket holes PR are formed at a distance interval of about several millimeters. The substrate SW engages with the rollers CR2 and CR3 to which sprockets (not shown) are attached, and moves in the transport direction M at a substantially constant speed by the rotation of the rollers CR2 and CR3. With this movement, the exposure areas EA1 to EA4 move relative to the substrate SW along the scanning bands S1 to S4. The encoder (not shown here) detects the amount of movement of the substrate SW by measuring the amount of rotation of the motor MK that rotates the roller CR2, and measures the relative positions of the exposure areas EA1 to EA4 with respect to the substrate SW. Each DMD is controlled in accordance with the relative position of the exposure areas EA1 to EA4, and the substrate SW is irradiated with light composed of a light beam corresponding to the pattern to be formed at that position.

  The four positional deviation measurement sensors 17A to 17D are arranged at equal intervals on one side of the substrate SW along the transport direction M of the substrate SW, and the positional deviations of the substrate SW at the relative positions of the exposure areas EA1 to EA4, respectively. Is detected. Each measurement sensor is arranged at a predetermined distance from the exposure area to be measured toward the substrate entrance 10B with respect to the transport direction of the substrate SW. The measurement sensors 17A to 17D are U-shaped sensors. A CCD (not shown) is disposed on one of the protrusions 19A1 to 19D1 above the substrate SW, and the other protrusions 19A2 to 19D2 emit light. A diode (not shown) is arranged to face the CCD. Along with the movement of the substrate SW, the light emitted from the light emitting diodes of the misalignment measurement sensors 17A to 17D passes through the sprocket holes PR at regular time intervals and reaches the CCD.

  The misregistration measurement sensors 17A to 17D are sensors that measure misregistration along the width direction (Y direction) of the substrate SW with reference to a line along the transport direction M (X direction) of the substrate SW. The positional deviation is measured with reference to the line passing through the sprocket hole PR. That is, when the light receiving position of each measurement sensor is detected, the deviation of the substrate SW corresponding to the position of each measurement sensor is detected based on the light receiving position. When the misregistration is detected, as will be described later, drawing correction processing such as drawing data shift processing along the corresponding scanning band and corresponding DMD drawing area shift processing is performed. The positional deviation measurement sensors 17A to 17D independently detect positional deviations at different locations on the substrate SW, and the drawing correction processing is separately executed based on the detected positional deviation amounts.

  FIG. 4 is a block diagram of the drawing apparatus 10.

  The drawing apparatus 10 includes first to fourth data conversion units 14A to 14D, first to fourth exposure control units 16A to 16D, and a light source driving unit 33. A system control circuit 32 including a CPU includes the entire drawing apparatus 10. To control. The light source driving unit 33 controls light emission of the semiconductor lasers 11A to 11D and sends current to the semiconductor lasers 11A to 11D based on a control signal from the system control circuit 32. Light emitted from the semiconductor lasers 11A to 11D is guided to exposure heads 12A to 12D provided with DMDs 13A to 13D, respectively.

  In the data processing unit 14, pattern data that is CAD data (vector data) is generated and sent to the drawing apparatus 10. As the pattern data, a series of divided drawing data is generated according to the four scanning bands S1 to S4. As will be described later, each divided drawing data is generated so as to include a part of adjacent drawing data by overlapping corresponding scanning bands. The division pattern data is sent to the first to fourth data conversion units 14A to 14D via the system control circuit 32, respectively.

  Among the four data conversion units 14A to 14D, the third data conversion unit 14C performs data conversion processing for converting the division pattern data corresponding to the scanning band S3 from vector data to raster data. The converted raster data is sequentially written into the bitmap memory 15C and sequentially output to the exposure control unit 16C. The raster data is bit data binarized according to the pattern along the scanning band S3, and corresponds to each dot position on the substrate SW. The data value of the raster data defines the ON / OFF state of the micromirror.

The system control circuit 32 performs third data conversion on the control clock pulse for counting the ON / OFF control timing of each micromirror of the DMD 13C and the exposure clock pulse for counting the exposure timing according to the relative position of the exposure area EA3. Output to the unit 14C and the exposure control unit 16C. The exposure control unit 16C, on the basis of the transmitted raster data and clock pulses, a signal for ON / OFF control of each micromirror X _ij of DMD13C are sequentially output to the exposure head 12C. In the present embodiment, a so-called multiple exposure operation is performed, and a control signal is output in accordance with the relative position of each micromirror X _ij . The first, second, and fourth data conversion units 14A, 14B, and 14D, and the first, second, and fourth exposure control units 16A, 16B, and 16D, which include the bitmap memories 15A, 15B, and 15D, respectively, are also third. The data conversion unit 14C and the third exposure control unit 16C have the same configuration.

  While the substrate SW is moving, a detection signal corresponding to the light receiving position is sent from the displacement measuring sensor 17 to the system control circuit 32, and a displacement along the width direction (Y direction) of the substrate SW is detected. A light receiving position serving as a reference when no positional deviation occurs is determined in advance, and the positional deviation of the substrate SW is detected based on the deviation from the reference position. Based on the detected amount of displacement, a control signal for shifting data is sent to the third data converter 14C. Further, a drawing area shift control signal for shifting the drawing area EA3 is sent to the third exposure control unit 16C. The first, second, and fourth misregistration measurement sensors 17A, 17B, and 17D have the same configuration, and each measurement sensor independently detects the misregistration of the substrate SW that has passed through the corresponding exposure area. To do.

  FIG. 5 is a diagram showing pattern deviation. FIG. 6 is a diagram showing the state of the substrate SW at a predetermined time. With reference to FIG. 5 and FIG. 6, the pattern shift accompanying the positional shift of the substrate SW will be described.

  In the case where no positional deviation occurs in the substrate SW, there is no pattern deviation in the pattern near the boundary line of the scanning band. For example, when a character “A” type pattern is formed in the predetermined area J of the substrate SW, the pattern K1 is the timing (time T1) at which the exposure area EA4 at the head position among the exposure areas EA1 to EA4 is located in the area J. A drawing process is performed so as to form. Then, when the substrate SW is conveyed as it is and the exposure area EA3 is positioned in the region J (time T2), the drawing process is performed so as to form the pattern K2. As a result, no pattern deviation occurs in the vicinity of the boundary line N that becomes the joint between the scanning bands S3 and S4 with respect to the “A” type pattern (see FIG. 5).

  On the other hand, when the substrate SW moves while meandering slightly in a non-periodic manner due to the feeding accuracy of the transport mechanism such as the rollers CR2 and CR3, the substrate SW slightly shifts along the width direction (Y direction) (for example, Hundreds of micrometers). In addition, since the exposure areas EA1 to EA4 are at different positions along the transport direction (X direction), the amount of displacement (displacement amount) at a predetermined time differs depending on the location of the substrate SW.

  For example, when there is no displacement in the vicinity of the exposure areas EA4 and EA3 at time T1, and relative displacement by a displacement amount Δy toward the measurement sensor 17C at time T2 (see FIG. 6), exposure is performed. A gap region PK is generated between the area EA3 and the exposure area EA4 where light is not irradiated by the displacement amount Δy. The formed pattern PA 'does not become an "A" type pattern, and pattern deviation occurs (see FIG. 5). Therefore, in the present embodiment, the following drawing correction process is performed.

  FIG. 7 is a flowchart showing a drawing process accompanied with a drawing correction process executed in the system control circuit 32. FIG. 8 is a diagram showing raster data in the bitmap memory 15C, and FIG. 9 is a diagram showing drawing correction processing. 7, 8, and 9, the drawing process for the exposure area EA <b> 3 corresponding to the scanning band S <b> 3, that is, the drawing by the third exposure head 13 </ b> C, the third data conversion unit 14 </ b> C, and the third exposure control unit 16 </ b> C. Indicates processing. Further, FIG. 9 shows a drawing correction process when the positional deviation of the substrate SW shown in FIG. 6 occurs. Similar drawing processing is performed for other scanning bands.

  When a drawing start command is detected, in step S101, the rollers CR2 and CR3 rotate so as to move the substrate SW at a constant speed. Then, when the substrate SW reaches a constant speed, an exposure operation is executed to start drawing.

  In step S102, a control signal (clock pulse) is sent to the third data converter 14C so that the divided pattern data corresponding to the scanning band S3 sent from the data processor 14 is converted into raster data at a predetermined timing. Sent. In step S103, a positional deviation amount (displacement amount) Δy in the vicinity of the exposure area EA3 is detected based on a detection signal sent from the positional deviation detection sensor 17C.

  As described above, the DMD 13C has a size that exceeds the width EB of the scanning band S3, and the overall length of the DMD 13 along the width direction (Y direction) of the substrate SW is “H ′”. When the length is expressed as “H”, the length EB ′ of the exposure area EA′3 of the entire DMD 13 corresponds to the total length H (see FIG. 8). However, here, H = EB and H ′ = EB ′.

  Then, raster data corresponding to all the micromirrors of the DMD 13C is stored in the bitmap memory 15C. That is, the divided raster data PD3 that overlaps a part of the scan bands S2 and S4 is generated in the bitmap memory 15C in accordance with the width EB 'exceeding the scan band width EB, and sequentially written into the bitmap memory 15C. Here, the data width U corresponds to the scanning band width EB, and the data width U ′ corresponds to the width EB ′.

  In step S104, based on the control signal from the system control circuit 32, the raster data in the bitmap memory 15C is shifted according to the displacement amount Δy. That is, each bit data of the raster data is written into the bitmap memory 15C with the address shifted as much as Δy as a whole. A pattern formed when drawing without data shift and a pattern formed when drawing with data shift are represented by reference characters “JK1” and “JK2” (see FIG. 9). When the displacement amount Δy is 0, that is, when there is no position shift, the data shift process is not performed.

  In step S105, a control signal is sent to the exposure processing unit 16C so that the drawing area EM is shifted by a distance Δy ′ corresponding to the displacement amount Δy. As a result, the micromirrors other than the shifted drawing area EM are positioned in the OFF state. Here, Δy ′ = Δy. In step S105, the micromirror is ON / OFF controlled according to the pattern. As a result, a pattern PA that does not cause pattern deviation is formed at the joint portion of the scanning band.

  When the position shift occurs in the direction opposite to that shown in FIG. 6, that is, when the exposure area EA3 moves relative to the scanning band S4, the raster data is shifted in the reverse direction, and the drawing area is also shifted in the reverse direction. The

  The positional deviation detection sensor 17C is arranged on the entrance 10A side of the drawing apparatus 10 with respect to the exposure area EA3, and the positional deviation is detected after a predetermined time has elapsed since the positional deviation detection sensor 17C actually detected the positional deviation. Passes through the exposure area EA3. However, the displacement amount of the substrate SW does not change extremely in a nearby location. Accordingly, the difference in time T2 when the exposure operation is performed at time T2 'when the displacement amount Δy is detected can be ignored with respect to the drawing correction process.

  Steps S102 to S106 are repeatedly executed, and the division pattern data PD3 is sequentially written and output to the bitmap memory 15C as the substrate SW moves. Then, the sequential displacement amount Δy is detected, and the drawing correction process is performed.

  As described above, according to the present embodiment, the four exposure heads 12A to 12D are arranged above the substrate SW, and the exposure areas EA1 to EA4 by the exposure heads 12A to 12D are defined as the scanning bands S1 to S1 defined on the substrate SW. Relatively moves along S4. Then, DMD 13A to DMD 13D are independently controlled according to the relative positions of exposure areas EA1 to EA4, respectively, and an exposure operation corresponding to the pattern is executed. The positional deviation measurement sensors 17A to 17D detect positional deviations at the respective locations of the substrate SW. When the displacement amount Δy is detected in the scanning band S3, the divided pattern data is shifted by Δy and written to the bitmap memory for output. Then, the drawing area EA is shifted by a length Δy ′ corresponding to Δy.

  The magnification of the imaging optical system provided in the exposure head can be arbitrarily set. In this case, the data shift amount and the drawing area shift amount are determined according to the reduction ratio and magnification. The misregistration measurement sensors 17A to 17D may be arranged at the same positions as the exposure areas EA1 to EA4 with respect to the transport direction M. Moreover, when using the board | substrate in which the sprocket hole is not formed, you may measure the position shift by measuring the end surface of a board | substrate. Further, it is only necessary to arrange an arbitrary number of arbitrary positions so that the positional deviation can be measured without preparing the number corresponding to each exposure area.

  When both surfaces of the substrate SW are covered with copper foil, the exposure head irradiates light to the entire back surface of the substrate SW in order to prevent peeling due to processing such as etching.

  Next, a second embodiment will be described. In the second embodiment, unlike the first embodiment, the exposure operation by one exposure head is executed. Further, the substrate moves on the stage. About another structure, it is the same as 1st Embodiment.

  FIG. 10 is a diagram showing the displacement along the time series of the exposure area, and FIG. 11 is a diagram showing the drawing correction process.

  Glass substrate SW 'is mounted on a stage (not shown) and moves as the stage moves. Thereby, the exposure area EA5 by the DMD 53 in the exposure head 52 moves relative to the substrate SW along the moving direction of the stage. Here, the movement direction is “X” and the vertical direction is “Y”.

  The exposure area EA5 is relatively displaced along the Y direction while the stage is moving due to the accuracy of a transport mechanism such as a stage. As a result, the locus EA′5 of the exposure area EA5 meanders (see FIG. 10).

  In the present embodiment, the measurement sensor 67 detects a positional deviation along the Y direction of the substrate SW while the substrate SW is moving. Here, the positional deviation is detected by detecting the edge of the substrate SW.

  As in the first embodiment, the raster data is shifted and the drawing area is shifted. As a result, the exposure operation is performed in accordance with the meandering locus of the exposure area EA'5 (see FIG. 11). When the exposure operation in the predetermined X direction is performed, the stage moves so that the substrate SW moves by a predetermined amount in the Y direction, and then the exposure operation is performed along the next line. By sequentially performing such scanning, drawing processing is performed on the entire substrate SW.

  Instead of moving the stage, the exposure head may be relatively moved. Further, when the positional deviation at each position is clear in advance, such as when a positional deviation occurs periodically, the deviation amount may be stored in advance without using the measurement sensor, and the drawing correction process may be performed according to the position of the exposure area. .

  In the first and second embodiments, drawing data is generated according to the overall size of the DMD, but there is no pattern in the exposed portion corresponding to the periphery of the DMD, and pattern formation is performed only with drawing data near the center of the exposure area. If possible, only drawing data corresponding to the exposure area may be created. In this case, the drawing data is simply shifted in the direction of eliminating the deviation.

It is the perspective view which showed typically the drawing system which is 1st Embodiment. It is the perspective view which showed typically the internal structure of the drawing apparatus. FIG. 3 is a diagram schematically showing an internal configuration of one exposure head. It is a block diagram of a drawing apparatus. It is a figure showing pattern shift. It is the figure which showed the state of the board | substrate in predetermined time. It is the flowchart which showed the drawing process with the drawing correction process performed in a system control circuit. It is the figure which showed the raster data in a bitmap memory. It is the figure which showed the drawing correction process. It is the figure which showed the displacement along the time series of the exposure area in 2nd Embodiment. It is the figure which showed the drawing correction process in 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Drawing apparatus 11A-11D Semiconductor laser (light source)
12A to 12D Exposure head 13A to 13D DMD (light modulation unit)
14 Data processing unit 14A-14D Data conversion unit (data conversion processing unit)
15A to 15D Bitmap memory (memory)
16A-16D Exposure control part (drawing means)
17A to 17D Misalignment measurement sensor (Misalignment detector)
32 System control circuit SW Substrate M Transport direction AM Total irradiation area (total irradiation area)
EM drawing area EA1 to EA4 Exposure area S1 to S4 Scan band PD3 Division pattern data

Claims (8)

A light source that emits light to form a pattern;
A light modulation unit that regularly arranges a plurality of light modulation elements, and projects light from the light source onto a light-sensitive material according to the positions of the plurality of light modulation elements;
Drawing means for independently controlling each of the plurality of light modulation elements based on drawing data having a data arrangement corresponding to the arrangement of the plurality of light modulation elements;
When the exposure area by the light modulation unit moves relative to the photosensitive material, a drawing correction process is performed according to a relative positional shift of the exposure area with respect to the photosensitive material that occurs along a displacement direction orthogonal to a scanning direction. Drawing correction means to be executed,
The drawing means defines a drawing area having a size smaller than the entire irradiation area of the light modulation unit, and draws with a light modulation element arranged in the drawing area;
The drawing apparatus, wherein the drawing correction means shifts the drawing data and the drawing area in a direction for correcting the position shift based on a displacement amount of the position shift.   The drawing apparatus according to claim 1, further comprising a scanning unit that moves the exposure area relative to the photosensitive material in a scanning direction.   2. The drawing according to claim 1, further comprising a misregistration detection unit configured to detect a displacement amount of the misregistration of the photosensitive material with the scanning direction of the substrate as a reference line while the exposure area is relatively moved. apparatus.   The drawing apparatus according to claim 1, wherein the position shift detection unit detects a position shift at a location near the exposure area and separated by a predetermined distance in the scanning direction. A memory capable of storing the drawing data as raster data;
A data conversion processing unit for converting design pattern data into the drawing data, sequentially writing to the memory according to the relative position of the exposure, and outputting the data;
The drawing apparatus according to claim 1, wherein the drawing correction unit writes the drawing data in the memory while shifting by a displacement amount. A light modulation unit that regularly arranges a plurality of light modulation elements and projects light from a light source onto a light-sensitive material according to the position of the plurality of light modulation elements, according to the arrangement of the plurality of light modulation elements Drawing means for independently controlling each of the plurality of light modulation elements based on drawing data having a data array;
When the exposure area by the light modulation unit moves relative to the photosensitive material, a drawing correction process is performed according to a relative positional shift of the exposure area with respect to the photosensitive material that occurs along a displacement direction orthogonal to a scanning direction. Drawing correction means to be executed,
The drawing means defines a drawing area having a size smaller than the entire irradiation area of the light modulation unit, and draws with a light modulation element arranged in the drawing area;
The drawing unit, wherein the drawing correction unit shifts the drawing data and the drawing area in a direction for correcting the position shift based on a displacement amount of the position shift. A light modulation unit that regularly arranges a plurality of light modulation elements and projects light from a light source onto a light-sensitive material according to the position of the plurality of light modulation elements, according to the arrangement of the plurality of light modulation elements Based on drawing data having a data array, each of the plurality of light modulation elements is independently controlled,
When the exposure area by the light modulation unit moves relative to the photosensitive material, a drawing correction process is performed according to a relative positional shift of the exposure area with respect to the photosensitive material that occurs along a displacement direction orthogonal to a scanning direction. A drawing method to be executed,
A drawing area having a size smaller than the entire irradiation area of the light modulation unit is defined, and drawing is performed by a light modulation element arranged in the drawing area.
A drawing method characterized by shifting the drawing data and the drawing area respectively in a direction for correcting the position deviation based on a displacement amount of the position deviation. A program of a drawing apparatus including a light modulation unit that regularly arranges a plurality of light modulation elements and projects light from a light source onto a photosensitive material according to the positions of the plurality of light modulation elements,
Drawing means for independently controlling each of the plurality of light modulation elements based on drawing data having a data arrangement corresponding to the arrangement of the plurality of light modulation elements;
When the exposure area by the light modulation unit moves relative to the photosensitive material, a drawing correction process is performed according to a relative positional shift of the exposure area with respect to the photosensitive material that occurs along a displacement direction orthogonal to a scanning direction. The drawing correction means to be executed functions and
A drawing area having a size smaller than the entire irradiation area of the light modulation unit is defined, and the drawing means functions so as to draw with the light modulation element arranged in the drawing area,
A program for causing the drawing correction means to function so as to shift the drawing data and the drawing area in a direction for correcting the position deviation based on a displacement amount of the position deviation.

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