JP2009237255A - Exposure apparatus and exposure method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve figure accuracy even when deformation such as local (partial) warpage occurs. <P>SOLUTION: A photosensitive layer 16a is exposed in such a manner that, based on the height and image data in each site (site P<SB>K-1</SB>to site P<SB>K</SB>) detected at a predetermined interval of distance, an exposure quantity per unit area D<SB>K</SB>(K=1, 2, to N-1) of the exposure light in each photosensitive layer 16a between the detected adjoining sites (a segment between the site P<SB>K-1</SB>and the site P<SB>K</SB>, wherein K is 2, 3, ..., N) is controlled to be equal to a reference exposure quantity per unit area D<SB>K</SB>(K=1, 2, to N-1) in each segment between reference sites (a segment between a reference site P'<SB>K-1</SB>and a reference site P'<SB>K</SB>, wherein K is 2, 3, ..., N) of a substrate 16' having a photosensitive layer 16'a with a constant height. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus and an exposure method.

  Conventionally, an exposure apparatus is known as an image forming apparatus for forming a wiring pattern on a printed wiring board or the like.

  As an exposure apparatus, for example, an exposure apparatus that corrects a pitching component of exposure stage scanning by image output timing modulation for each head is known (for example, Patent Document 1).

  In general, a plurality of alignment marks for performing alignment processing (correction processing) is provided on the substrate, each alignment mark is detected by a detection means such as a camera, and the position of the detected alignment mark is used as a reference. An exposure apparatus that performs exposure so as to match the position is known. In such an exposure apparatus, for example, the center of gravity position between the detected alignment marks is aligned with the position of the center of gravity serving as a reference, or each detected alignment mark is used as a reference using processing by the least square method. Exposure according to the position.

  Further, based on the scale ratio scx calculated from the displacement of the alignment mark (alignment hole), the drawing data of each drawing area is corrected, and the corrected drawing data (each corrected drawing data) is integrated to draw An exposure apparatus that draws the surface of a body is known (for example, described in Patent Document 2).

Here, the printed circuit board may be warped or swelled in a lamination process or the like. For this reason, in the exposure apparatus, the generated warp or undulation may be alleviated by bringing the printed circuit board into close contact with the exposure stage using an adsorption pump or the like. However, depending on the state of warping or waviness that has occurred, normal exposure may not be possible even if the warping or waviness is alleviated using an adsorption pump or the like. The warped substrate will shrink in the projected area on the exposure stage, and if an uncorrected image is drawn as it is, it will be greatly drawn on the surface of the substrate, which will lead to deterioration in figure accuracy, resulting in alignment accuracy. (Positioning accuracy) is a factor that deteriorates. Here, in order to further reduce the warpage of the substrate, it may be possible to uniformly press the substrate against the exposure stage with a clamp function or the like. However, such a clamp function is relatively expensive, and the clamp The use of the function leads to an increase in cost and a process of pressing the substrates one by one, which causes a problem that this process takes time and the productivity of the substrate deteriorates. Therefore, in order to cope with such a case, for example, in the exposure apparatus described in Patent Document 2, the expansion / contraction state of the substrate is measured from the alignment hole, and so-called scaling is performed.
JP 2005-283896 A JP-A-2005-300628

  However, in the exposure apparatus described in Patent Document 2, the scaling is performed by measuring the alignment hole provided at the end of each drawing region. However, local (partial) scaling is performed in a smaller portion of the substrate. Therefore, there is a problem that the accuracy of graphics (graphic accuracy) deteriorates when deformation such as warpage occurs in a local portion of the substrate.

  The present invention has been made in order to solve the above-described problems, and even when deformation such as local (partial) warpage occurs in a smaller area of the substrate, the figure accuracy is improved. It is an object of the present invention to provide an exposure apparatus and an exposure method that can be used.

  In order to achieve the above object, the exposure apparatus of the present invention comprises an exposure means for irradiating light to the photosensitive layer of the substrate provided with the photosensitive layer and exposing the photosensitive layer, and the exposure apparatus being conveyed at a predetermined conveyance speed. Detection means for detecting the height of a plurality of parts along a predetermined direction of the photosensitive layer of the substrate at predetermined distance intervals, and the height and image data of each part detected by the detection means at the predetermined distance intervals The exposure amount per unit area for exposing each of the photosensitive layers between the adjacent portions detected is based on the reference substrate having a constant height of the photosensitive layer, and is transported at the predetermined transport speed. , Each of the photosensitive layers between reference portions adjacent to each of the reference portions whose heights are detected at predetermined distance intervals by the detecting means is exposed between the reference portions when the exposure means is exposed based on the image data. Standard dew per unit area In exposure consistent with each amount, the photosensitive layer is formed and a control means for controlling said exposure means so as to be exposed.

  According to the exposure apparatus of the present invention, the exposure amount per unit area for exposing each of the photosensitive layers between adjacent parts detected based on the height of each part and image data detected at a predetermined distance interval. Each of the photosensitive layer is exposed with an exposure amount corresponding to each of the reference exposure amounts per unit area between the reference portions of the reference substrate where the height of the photosensitive layer is constant. Thereby, even when an exposure image having an appropriate size is formed between the respective parts and deformation such as local (partial) warpage occurs, the figure accuracy can be improved.

  In order to achieve the above-mentioned object, the exposure method of the present invention includes the heights of a plurality of portions along a predetermined direction of the photosensitive layer of the substrate provided with the photosensitive layer transported at a predetermined transport speed. Detecting the exposure amount per unit area for detecting each photosensitive layer between adjacent parts detected based on the height and image data of each part detected at a predetermined distance interval. Each of the photosensitive layers between reference portions adjacent to each of the reference portions whose height is detected at the predetermined distance interval by transporting a reference substrate having a constant height of the photosensitive layer at the predetermined transport speed. Are exposed by irradiating light to the photosensitive layer with an exposure amount that matches each of the reference exposure amounts per unit area between the reference portions when each is exposed based on the image data.

  According to the exposure method of the present invention, the exposure amount per unit area for exposing each of the photosensitive layers between adjacent parts detected based on the height of each part and image data detected at predetermined distance intervals. Each of the photosensitive layer is exposed with an exposure amount corresponding to each of the reference exposure amounts per unit area between the reference portions of the reference substrate where the height of the photosensitive layer is constant. Thereby, even when an exposure image having an appropriate size is formed between the respective parts and deformation such as local (partial) warpage occurs, the figure accuracy can be improved.

  As described above, according to the present invention, the effect that the productivity of the substrate can be improved is obtained.

  Hereinafter, embodiments of the present invention applied to an exposure apparatus will be described with reference to the drawings.

[First Embodiment]
First, the first embodiment will be described. As shown in FIGS. 1 and 2, the exposure apparatus 10 includes a rectangular thick plate-shaped installation base 12 supported by four legs 9. Two guides 13 are extended along the longitudinal direction on the upper surface of the installation base 12, and a rectangular flat plate-like stage (base) 14 is provided on the two guides 13. . The stage 14 is arranged so that the longitudinal direction thereof faces the extending direction of the guide 13, is supported by the guide 13 so as to be reciprocally movable on the installation table 12, and a driving device 15 for moving the stage 14 (FIG. 2). And is reciprocated along the guide 13. When the substrates (photosensitive materials) 16 provided with the photosensitive layer 16a are conveyed one by one from a carry-in conveyor (IN conveyor) 90 (see FIG. 2), the AC conveyor 92 (see FIG. 2) uses the IN conveyor 90. The upper substrate 16 is gripped and sucked and held one by one on the upper surface of the stage 14 in a state where the mounting position is determined. The exposed substrate 16 is held by the AC hand 30 and discharged to a carry-out conveyor (OUT conveyor) 94.

  A gate 17 is disposed on the upstream side in the moving direction of the stage 14 with respect to the center of the installation table 12, and a gate 18 is disposed on the downstream side. These gates 17 and 18 are arranged at a predetermined interval. The gate 17 and the gate 18 are formed in a U shape so as to straddle the moving path of the stage 14, and both tip portions are fixed to both side surfaces of the installation table 12.

  Three displacement sensors 19 are provided on the gate 17 disposed on the upstream side in the moving direction of the stage 14 at the upper portion of the front surface facing the upstream side (above the moving path of the stage 14). Are fixedly arranged at predetermined intervals along a direction orthogonal to the direction. The sensor unit 20 of the displacement sensor 19 is directed downward.

  In the gate 18 disposed on the downstream side in the moving direction of the stage 14, a scanner 21 is fixedly disposed on the upper portion of the rear surface facing the downstream side (above the moving path of the stage 14). In the present embodiment, the distance between the scanner 21 and the displacement sensor 19 is such that the distance between an exposure start position by an exposure head 22 (described later) provided in the scanner 21 and a detection position by the displacement sensor 19 is the length of the substrate 16. It is set to be a little longer than the dimension in the direction.

  Here, the exposure head of the present embodiment will be described with reference to FIG. As shown in FIG. 3, the scanner 21 includes a plurality of (for example, eight) exposure heads 22 arranged in an approximately matrix of m rows and n columns (for example, 2 rows and 4 columns).

  As shown in FIG. 3, the exposure area 23 which is an area exposed by the exposure head 22 has a rectangular shape with a short side along the scanning direction, and is inclined at a predetermined inclination angle θ with respect to the scanning direction. . Along with the movement of the stage 14, a strip-shaped exposed region 24 is formed on the substrate 16 for each exposure head 22. As shown in FIGS. 1 and 3, the scanning direction is opposite to the stage moving direction.

  As shown in FIGS. 4A and 4B, the exposure heads 22 are arranged in a line, and each of the strip-shaped exposed areas 24 partially overlaps the adjacent exposed areas 24. Further, they are arranged at a predetermined interval (natural number times the long side of the exposure area, 1 time in the present embodiment) in the arrangement direction. Therefore, for example, the unexposed portion between the image region 23A located on the leftmost side of the first row and the image region 23C located on the right side of the image region 23A is the image located on the leftmost side of the second row. The region 23B is exposed. Similarly, the portion that cannot be exposed between the image region 23B and the image region 23D located on the right side of the image region 23B is exposed by the image region 23C.

  5 and 6 show the optical system of the exposure head according to the embodiment of the present invention.

  Each of the exposure heads 22A to 22H as exposure means for irradiating the photosensitive layer 16a of the substrate 16 with light is exposed to incident light as shown in FIGS. 5 and 6A, 6B. A digital micromirror device (DMD) 25 is provided as a spatial light modulation element that modulates the beam for each pixel in accordance with image data (image information). The DMD 25 is connected to the controller 11 described above. The controller 11 controls the angle of the reflection surface of each micromirror (not shown) in the region to be controlled by the DMD 25 for each exposure head 22 based on the input image data. Therefore, by controlling the tilt of the micromirror in each pixel of the DMD 25 according to the image data, the light incident on the DMD 25 is reflected in the tilt direction of each micromirror. The on / off control of each micromirror is performed by the controller 11 connected to the DMD 25, and the light reflected by the micromirror in the on state is modulated into the exposure state, and the projection optics provided on the light exit side of the DMD 25 Incident into the system. The light reflected by the off-state micromirror is modulated into a non-exposure state and enters a light absorber (not shown).

  On the light incident side of the DMD 25, a fiber array light source 26 including a laser emitting portion in which an emitting end portion (light emitting point) of an optical fiber is arranged in a line along a direction corresponding to the long side direction of the exposure area 23, a fiber A lens system 27 that corrects the laser light emitted from the array light source 26 and collects it on the DMD 25, and a reflecting mirror 28 that reflects the laser light transmitted through the lens system 27 toward the DMD 25 are arranged in this order.

  The lens system 27 includes a pair of combination lenses 27a for collimating the laser light emitted from the fiber array light source 26, and a pair of combination lenses for correcting the light quantity distribution of the collimated laser light to be uniform. 27b and a condensing lens 27c that condenses the laser light with the corrected light quantity distribution on the DMD 25. With respect to the arrangement direction of the laser emitting ends, the combination lens 27b expands the light flux at a portion close to the optical axis of the lens and contracts the light flux at a portion away from the optical axis, and with respect to a direction orthogonal to the arrangement direction. Has a function of allowing light to pass through as it is, and corrects the laser light so that the light quantity distribution is uniform.

  Further, on the light reflection side of the DMD 25, the laser light reflected by the DMD 25 is imaged on the scanning surface (exposed surface) 16 a of the substrate 16, and the laser light transmitted through the lens systems 29, 30 is transmitted. A focus mechanism 31 that adjusts the focal length within a predetermined range is arranged in this order.

  The lens systems 29 and 30 are arranged so that the DMD 25 and the exposed surface 16a have a conjugate relationship. In this embodiment, the laser light emitted from the fiber array light source 26 is made uniform and incident on the DMD 25. Then, each pixel is set to be magnified by about 5 times by these lens systems 29 and 30 and condensed.

  In the present embodiment, the exposure apparatus 10 includes a detection sensor 32 (see FIG. 2) disposed at a position where the substrate 16 on the IN conveyor 90 can be detected. For example, an optical sensor is used as the detection sensor 32. In the present embodiment, the detection sensor 32 outputs an ON-state detection signal indicating that the substrate 16 has been detected when the substrate 16 is detected, and is OFF when the substrate 16 is not detected. The detection signal is output.

  In the present embodiment, the exposure apparatus 10 is provided with a linear encoder (not shown) for detecting the amount of movement displacement of the stage 14. This linear encoder is provided at a position where the amount of displacement of the stage 14 can be detected.

  Also, a linear encoder (not shown), a drive device 15 for the stage 14, each DMD 25 for each exposure head 22 of the scanner 21, a displacement sensor 19, a detection sensor 32, an IN conveyor 90, an AC hand 92, and an OUT conveyor 94 are It is connected to a controller 11 that controls these. For example, during the exposure operation of the exposure apparatus 10 to be described later, the controller 11 controls the stage 14 to move at a predetermined speed, the displacement sensor 19 is controlled to detect the substrate 16 at a predetermined timing, and the exposure head 22. Is controlled to expose the substrate 16 at a predetermined timing.

  The controller 11 includes an I / O (input / output) port 11a, a ROM (Read Only Memory) 11b, an HDD (Hard Disk Drive) 11c, a CPU (Central Processing Unit) 11d, a RAM (Random Access Memory) 11e, and these I / Os. The bus 11f includes an O port 11a, a ROM 11b, an HDD 11c, a CPU 11d, and a RAM 11e.

  A basic program such as an OS is stored in the ROM 11b as a storage medium.

  The HDD 11c as a storage medium stores programs for executing each processing routine of exposure processing and scale rate calculation processing, which will be described in detail below. Further, the HDD 11c stores a scale rate table whose details will be described below.

  Next, a processing routine of exposure processing executed by the CPU 11d of the controller 11 will be described with reference to FIG. In the present embodiment, an input device such as a keyboard (not shown) is connected to the controller 11, an instruction for performing an exposure process is input from the operator from the input device, and the substrate 16 is supplied from an external PC (not shown). The exposure processing is executed when image data (image information) for exposing the photosensitive layer 16a provided on the substrate is input.

  First, in step 100, it is determined whether the substrate 16 to be exposed exists by determining whether the detection signal from the detection sensor 32 has changed from the OFF state to the ON state. In step 100 of the present embodiment, if the detection signal from the detection sensor 32 is in the OFF state for a predetermined time or longer, it is assumed that the substrate 16 to be exposed does not exist and the exposure process is terminated. .

  If it is determined in step 100 that the detection signal from the detection sensor 32 has changed from the OFF state to the ON state, the process proceeds to the next step 102.

  In step 102, a scale rate calculation process is executed. Here, the details of the processing routine of the scale ratio calculation process in step 102 will be described with reference to FIG.

  First, in step 200, the stage 14 is moved by the AC hand 92 from the IN conveyor 90 to the upper surface of the stage 14, and the substrate 16 held on the stage 14 is placed in a state where the placement position is determined. Controls the driving device 15 of the stage 14 so as to move downstream at a predetermined transport speed (for example, 10 mm per second). Thereby, the board | substrate 16 moves to the downstream side with the predetermined conveyance speed with the stage 14. FIG.

  In the next step 202, it is determined based on the detection signal from the displacement sensor 19 whether or not the tip of the stage 14 has been detected. There are various methods for detecting the tip of the stage 14 using the displacement sensor 19. For example, the distance indicated by the detection signal from the displacement sensor 19 is reduced by the thickness of the stage 14. By determining whether or not, it is possible to detect the tip of the stage 14.

  If it is determined in step 202 that the tip of the stage 14 has been detected, the process proceeds to the next step 204. In step 204, taking in the detection signal from the displacement sensor 19 is started every time the stage 14 moves a predetermined distance L (for example, 10 mm) based on the detection signal from the linear encoder.

  In the next step 206, based on the detection signal from the displacement sensor 19, it is determined whether or not the rear end of the stage 14 has been detected. There are various methods for detecting the rear end of the stage 14 using the displacement sensor 19. For example, the distance indicated by the detection signal from the displacement sensor 19 is increased by the thickness of the stage 14. It is possible to detect the rear end of the stage 14 by determining whether or not.

  If it is determined in step 206 that the rear end of the stage 14 has not been detected, the process returns to step 204 and continues to capture detection signals from the displacement sensor 19 at the predetermined distance intervals.

  As described above, by repeatedly performing the processing in steps 204 to 206, the height of a plurality of portions along a predetermined direction (scanning direction, Y direction) of the photosensitive layer 16a of the substrate 16 is set in the moving direction of the stage 14. Data detected at predetermined distance intervals can be captured.

On the other hand, if it is determined in step 206 that the rear end of the substrate 16 has been detected, the process proceeds to the next step 208. In step 208, based on the detection signals captured at the predetermined distance intervals in step 204, the distances between the respective portions detected at the predetermined distance intervals and the sensor unit 20 of the displacement sensor 19 are calculated. From the distance from the sensor unit 20 of the displacement sensor 19, the heights of a plurality of portions along a predetermined direction (scanning direction, Y direction) of the photosensitive layer 16a of the substrate 16 are calculated. Note that a method for calculating the heights of the plurality of parts from the calculated distances between the parts and the sensor unit 20 of the displacement sensor 19 is, for example, by using the height of the stage 14 as a reference height. The height based on 14 can be calculated. As a result, when the stage 14 moves downstream, for example, at a speed of 10 mm per second, and the detection signals from the displacement sensor 19 are captured at intervals of 10 mm, for example, as shown in FIGS. A plurality of portions along a predetermined direction (Y direction in the present embodiment) of the photosensitive layer of the substrate 16 having L intervals (L = 10 mm in this case) in the Y direction (scanning direction) on the projected area of the stage 14 The height of (P _{1 to} P _N : N parts) is calculated. In FIG. 9B, the horizontal axis Y represents the position of each part of the substrate 16 in the Y direction on the stage 14, and the vertical axis Z represents the height from the stage 14, and each adjacent part. An example is shown in which the height of the interval (P _{K to} P _{K + 1} ) (where K = 1, 2,..., N−1) is calculated by linear interpolation. Hereinafter, the position of the part P _K (K = 1, 2,..., N) in the Y direction on the stage 14 is represented as Y _K, and the height of the part P _{K from} the stage 14 is represented as M _K.

  In the next step 210, the value of the variable K is set to 1, and in the next step 212, the value of the variable K is incremented by 1.

In the next step 214, as shown in FIG. 10, by the following equation (1), it calculates the warp angle theta _K of the substrate 16 relative to the stage 14 in the section of the site _{P K-1} ~ site _{P K.}
θ _K = (M _K−1 −M _K ) ÷ L (1)

In step 214, the warpage angle θ _K may be calculated by the following equation (2).
θ _K = arctan ((M _K−1 −M _K ) ÷ L) Expression (2)

In the next step 216, the length L _K of the substrate 16 in the section from the part P _K-1 to the part P _K is calculated by the following equation (3).
L _K = L ÷ cos θ _K (3)

In the next step 218, the _{L K} calculated in step 216 divided by L value _{(L K} ÷ L) a (= 1 / cosθ _K), the substrate in the section of the site _{P K-1} ~ site _{P K} 16 The scale rate as shown in FIG. 11 stored in the HDD 11c is calculated by associating the calculated scale rate (L _K ÷ L) with the section P _K−1 to the section P _K. Register in table 70.

  In the next step 220, it is determined whether or not the value of the variable K has become larger than N, and in step 218, the corresponding scale rate is calculated and registered in the scale rate table 70 in all the sections. Determine whether.

  If it is determined in step 220 that the value of the variable K is N or less, it is determined that the corresponding scale rate has not been calculated and registered in the scale rate table 70 in all the sections, and the above step Returning to 212, the processing described above is performed.

  On the other hand, if it is determined in step 220 that the value of the variable K is greater than N, the scale rate calculation process is terminated.

  As described above, in the scale ratio calculation process, the processes in steps 212 to 218 are repeated until it is determined in step 220 that the value of the variable K is greater than N, thereby obtaining the scale ratio as shown in FIG. In the table 70, the scale rate in each section is registered.

In the next step 104, each section (section P _K-1 to section P _K : K = 2, 3,..., N of the photosensitive layer provided on the substrate 16 transported at the predetermined transport speed. ) Is read from the scale rate registration table 70 stored in the HDD 11c, and each section of the photosensitive layer 16a provided on the substrate 16 transported at the predetermined transport speed is set to the corresponding scale rate. The DMD 25 of each exposure head 22 is controlled so as to perform exposure accordingly. As a method for performing exposure according to the scale ratio, for example, there is a method described in JP-A-10-199794. Thus, as shown in FIG. 12A, each of the photosensitive layers between the detected adjacent parts (section P _K-1 to part P _K : K = 2, 3,..., N). As shown in FIG. 12B, the exposure amount per unit area D _K (K = 1, 2,..., N−1) for exposing the photosensitive layer 16′a is constant. Is the reference substrate 16 ′ (in the example of FIG. 12B), the height H ′ of the photosensitive layer 16′a of the substrate 16 ′ is parallel to the stage 14. That is, the substrate 16 ′ is deformed such as warping. (Not generated)) is transported at the predetermined transport speed, and adjacent to each of the reference parts (reference parts P ′ ₁ to P ′ _K ) whose height is detected by the displacement sensor 19 at the predetermined distance intervals. Each of the photosensitive layers 16 ′ a between the reference parts (sections of the reference parts P ′ _K−1 to the parts P ′ _K : K = 2, 3,..., N) Matches each of the reference exposure amounts per unit area D _K (K = 1, 2,..., N−1) between the reference portions when exposed by the exposure heads 22 based on the input image data. The photosensitive layer of the substrate 16 is exposed with the exposure amount. That is, an exposure image having an appropriate size is formed on the photosensitive layer 16 a of the substrate 16 in accordance with the deformation of the substrate 16 by the processing in step 104.

The first embodiment has been described above. According to exposure apparatus 10 of the present embodiment, based on the height and image data of each part (part P _K-1 to part P _K ) detected at predetermined distance intervals, the distance between adjacent parts ( A unit area D _K (K = 1, 2,..., N−) for exposing each of the photosensitive layers 16a in the section P _K-1 to the part P _K : K = 2, 3,. 1) Each exposure amount is between the reference portions of the substrate 16 ′ serving as a reference where the height of the photosensitive layer 16′a is constant (section from the reference portion P ′ _K−1 to the portion P ′ _K : K) = 2,3, ..., with an exposure amount consistent with each of the reference exposure amount per unit area _{D K} in N), the photosensitive layer 16a is exposed. As a result, an exposure image having an appropriate size is formed between each part (section P _K-1 to part P _K : K = 2, 3,..., N), and is locally (partial). Even when deformation such as warping occurs, the figure accuracy can be improved.

[Second Embodiment]
Next, an exposure apparatus according to the second embodiment will be described. The difference from the first embodiment is that a pitching correction circuit for correcting the pitching component of exposure stage scanning as described in Japanese Patent Application Laid-Open No. 2005-283896 and the like by image output timing modulation for each head is provided. It is the point with which the exposure apparatus of embodiment is equipped. This pitching correction circuit can adjust the image output timing at a predetermined value, for example, an interval of 10 mm, and when the actual stage moves 10.1 mm when controlling the stage as 10 mm, the pitching correction circuit is set to 10.1 mm. Is set, a scaling process of 10 / 10.1 mm is performed. In such a case, using a scale factor that is registered on the scale rate table 70 in the above step 218, for each section, a pitching correction value PH _K inclusive scaling by warping using Equation (4) below Calculate.
PH _K = current pitching correction value ÷ scale ratio of the corresponding section (formula 4)
And in all the sections (section P _K-1 to section P _K : K = 2, 3,..., N), PH _K is calculated, and the pitching correction circuit uses the calculated PH _K. By performing the scaling process, exposure correction can be performed not only in the pitching direction but also in the height direction.

[Third Embodiment]
Next, an exposure apparatus according to the third embodiment will be described. The exposure apparatus of the present embodiment is different from the first embodiment in that a plurality of alignment marks for performing alignment processing (correction processing) are provided on the substrate, and each alignment mark is detected by detection means such as a camera. The point of exposure is to detect and align the position of the detected alignment mark with the reference position. In the exposure apparatus of the present embodiment, for example, exposure is performed by aligning the center of gravity position serving as a reference with the center of gravity position between the detected alignment marks. In the present embodiment, when the substrate is warped, an error occurs because the position of the measured alignment mark is shifted due to the warp as shown in FIG. Therefore, the measurement result is offset as shown in FIG. 13B so as not to be affected by the warp. The offset amount in this case is an amount obtained by accumulating an increase / decrease amount with respect to the interval L (for example, L = 10 mm) using correction data between distances in the Y direction of alignment. At this time, when the position of the center of gravity is between the pitching data, it is obtained by performing linear interpolation, for example. Here, the position in the Y direction of the alignment mark may be shifted due to a rotation component or the like, but the position in the Y direction of the alignment mark may be an intermediate value in the Y direction of two alignment marks in the X direction. Half of this difference is a shift in the center of gravity.

  In addition, since warping scaling is corrected at the drawing timing after the start of exposure, in the case of control to shrink the entire substrate, if the exposure start position is the same, as shown in FIG. And exposure is started. In order to prevent this, the cumulative deviation from the exposure start position to the alignment mark centroid position is calculated, and as shown in FIG. 13D, the exposure start position is offset by this cumulative deviation and drawing is started. To do.

It is the schematic which shows the exposure apparatus which concerns on 1st Embodiment. It is a block diagram which shows the structure of the exposure apparatus which concerns on 1st Embodiment. It is a perspective view which shows the structure of the scanner which concerns on 1st Embodiment. It is a figure which shows the arrangement | sequence of the exposure area | region by the exposure head which concerns on 1st Embodiment. 1 is a perspective view showing a configuration of an exposure head according to a first embodiment. 1 is a perspective view showing a configuration of an exposure head according to a first embodiment. It is a figure which shows the flowchart of the process routine of the exposure process which the exposure apparatus which concerns on 1st Embodiment performs. It is a figure which shows the flowchart of the process routine of the scale rate calculating process which the exposure apparatus which concerns on 1st Embodiment performs. It is a figure for demonstrating a scale rate calculating process. It is a figure for demonstrating a scale rate calculating process. It is a schematic diagram of the scale rate table which concerns on 1st Embodiment. It is a figure for demonstrating the effect which concerns on 1st Embodiment. It is a figure for demonstrating 3rd Embodiment.

Explanation of symbols

10 Exposure Device 11 Controller 11c HDD
11d CPU
14 Stage 16 Substrate 16a Photosensitive layer 19 Displacement sensor 21 Scanner

Claims (2)

Exposure means for irradiating the photosensitive layer of the substrate provided with the photosensitive layer with light for exposure;
Detecting means for detecting the heights of a plurality of portions along a predetermined direction of the photosensitive layer of the substrate being transported at a predetermined transport speed at predetermined distance intervals;
Based on the height and image data of each part detected by the detection means at the predetermined distance interval, each of the exposure amounts per unit area for exposing each of the photosensitive layers between the adjacent parts detected is a photosensitive amount. A reference substrate having a constant layer height is transported at the predetermined transport speed, and the photosensitive layer between each reference portion adjacent to each reference portion whose height is detected at a predetermined distance interval by the detection means. The exposure means is controlled such that the photosensitive layer is exposed with an exposure amount that matches each of the reference exposure amounts per unit area between the reference portions when each is exposed by the exposure means based on the image data. Control means to
Exposure apparatus. Detecting the height of a plurality of portions along a predetermined direction of the photosensitive layer of the substrate provided with the photosensitive layer being conveyed at a predetermined conveyance speed at predetermined distance intervals;
Based on the height of each part detected at the predetermined distance interval and the image data, the exposure amount per unit area for exposing each photosensitive layer between adjacent parts detected is the height of the photosensitive layer. A reference substrate having a constant is transported at the predetermined transport speed, and each of the photosensitive layers between the reference portions adjacent to each reference portion whose height is detected at the predetermined distance interval is based on the image data. An exposure method in which exposure is performed by irradiating the photosensitive layer with light at an exposure amount that matches each of the reference exposure amounts per unit area between the respective reference sites when exposed.

Images