JP2007058207A - Plotting method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plotting device which relatively moves a plotting head for forming image dots on a substrate against the substrate and plots an image with the plotting head according to the movement, wherein degradation of image quality due to influences of vibration of the setting environment is suppressed without increasing the cost. <P>SOLUTION: A relative positional difference between the substrate and the plotting head during plotting an image is acquired, and the position of forming a dot by the plotting head is corrected according to the acquired positional difference. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention moves a drawing head for forming a drawing point on a substrate based on input drawing point data relative to the substrate, and sequentially draws the drawing point on the substrate by the drawing head according to the movement. The present invention relates to a drawing method and apparatus for forming and drawing an image.

  Conventionally, various exposure apparatuses using a photolithographic technique have been proposed as apparatuses for recording a predetermined pattern on a printed wiring board or a flat panel display substrate.

  As an exposure apparatus as described above, for example, a light beam is scanned in a main scanning direction and a sub scanning direction on a substrate coated with a photoresist, and the light beam is modulated based on exposure image data representing a wiring pattern. An exposure apparatus that forms a wiring pattern by doing so has been proposed.

  Further, as the above exposure apparatus, for example, a spatial light modulation element such as a digital micromirror device (hereinafter referred to as “DMD”) is used, and a light beam is emitted by the spatial light modulation element in accordance with exposure image data. There has been proposed an exposure apparatus that performs exposure with modulation.

  As an exposure apparatus using the DMD as described above, for example, the DMD is moved relative to the exposure surface, and a lot of exposure point data corresponding to a number of micromirrors of the DMD according to the movement. An exposure apparatus has been proposed that forms a desired exposure image on an exposure surface by sequentially forming time-series exposure point groups corresponding to DMD micromirrors (see, for example, Patent Document 1).

  Here, when exposing a predetermined wiring pattern or the like on the substrate using the exposure apparatus as described above, it is necessary to expose the desired wiring pattern at a desired position on the substrate. Will be needed.

  However, for example, the relative position of the DMD with respect to the exposure surface may be temporarily shifted due to the influence of vibration transmitted from the installation environment to the exposure apparatus, and there is a problem that the quality of the exposure image is deteriorated.

  In order to solve this problem, a method is known in which an exposure head having a DMD and a stage on which a substrate is placed are placed on an active or passive vibration isolator (see, for example, Patent Document 2). ).

Japanese Patent Laid-Open No. 2004-233718 JP-A-11-327657

  However, when the exposure apparatus becomes large and heavy, there is a problem that the cost of the vibration isolator becomes very high.

  In view of the above circumstances, the present invention provides a drawing method and apparatus that can suppress degradation of image quality due to the influence of vibration as described above, without causing an increase in cost, in the drawing method and apparatus such as the exposure apparatus. Is intended to provide.

  According to the drawing method of the present invention, a drawing head for forming a drawing point on a substrate based on inputted drawing point data is moved relative to the substrate, and drawing is performed on the substrate by the drawing head according to the movement. In a drawing method in which dots are sequentially formed to draw an image, a relative positional deviation between the substrate and the drawing head during image drawing is acquired, and a drawing point of the drawing head is formed based on the acquired positional deviation. The position is corrected.

  In the drawing method of the present invention, a relative positional shift in the moving direction of the substrate and the drawing head during image drawing is acquired, and a direction orthogonal to the moving direction of the substrate and the drawing head is obtained. It is possible to acquire the relative positional deviation of the. Further, during the image drawing, the position of the stage on which the substrate is placed in the moving direction and the position of the drawing head in the moving direction are acquired, and the position of the stage in the moving direction and the position of the drawing head are acquired. Based on the position in the movement direction, the relative displacement in the movement direction can be acquired.

  In addition, during the image drawing, the result of acquiring the position of the stage on which the substrate is placed in the moving direction is used for both the position control of the stage and the acquisition of the relative positional deviation in the moving direction. Can be used.

  Further, during the image drawing, the position of the stage on which the substrate is placed is obtained in a direction perpendicular to the moving direction and the position of the drawing head in the direction perpendicular to the moving direction, and the stage is moved. Based on the position in the direction orthogonal to the direction and the position in the direction orthogonal to the moving direction of the drawing head, the relative positional deviation in the direction orthogonal to the moving direction can be acquired.

  Further, during the image drawing, the result of acquiring the position in the direction orthogonal to the moving direction of the stage on which the substrate is placed is obtained as a result of the relative position control in the direction orthogonal to the moving direction. It can be used for both acquisition of misalignment.

  Further, the drawing point formation position can be corrected by controlling the drawing point formation timing of the drawing head based on the relative positional deviation in the moving direction.

  Further, the stage on which the substrate is placed can be controlled so as to suppress a relative positional shift in the moving direction.

  Further, based on the relative displacement in the direction orthogonal to the moving direction, the drawing point is obtained by performing shift processing in the direction corresponding to the orthogonal direction on the image data representing the image made up of the drawing point data. It is possible to correct the formation position.

  In addition, the stage on which the substrate is placed can be controlled so as to suppress relative displacement in the direction orthogonal to the moving direction.

  Further, the drawing head emits light beam and irradiates the beam light on the substrate to form a drawing point, and the irradiation position of the light beam emitted from the drawing head is orthogonal to the moving direction. By providing an optical system that can move in the direction to be moved, and by moving the irradiation position of the beam light in the direction orthogonal to the moving direction by the optical system based on the relative positional deviation in the direction orthogonal to the moving direction. The formation position of the drawing point can be corrected.

  In addition, a plurality of drawing heads can be provided, and the relative positional deviation for each drawing head can be acquired based on the relative positional relationship between each drawing head and the substrate.

  The drawing apparatus of the present invention moves a drawing head for forming a drawing point on a substrate based on inputted drawing point data relative to the substrate, and draws on the substrate by the drawing head according to the movement. In a drawing apparatus that sequentially forms dots and draws an image, a position shift acquisition unit that acquires a relative position shift between the substrate and the drawing head during image drawing, and a position shift acquired by the position shift acquisition unit And a correction means for correcting the formation position of the drawing point of the drawing head.

  In the drawing apparatus of the present invention, the positional deviation acquisition means acquires the relative positional deviation in the movement direction of the substrate and the drawing head during image drawing, and the movement of the substrate and the drawing head. It is possible to acquire a relative displacement in a direction orthogonal to the direction. Further, the position deviation acquisition means acquires the position in the moving direction of the stage on which the substrate is placed and the position in the moving direction of the drawing head during the drawing of the image. Based on the position and the position of the drawing head in the moving direction, the relative displacement in the moving direction can be acquired.

  In addition, during the image drawing, the result of acquiring the position of the stage on which the substrate is placed in the moving direction is used for both the position control of the stage and the acquisition of the relative positional deviation in the moving direction. Can be used.

  Further, the position shift acquisition means acquires the position in the direction orthogonal to the moving direction of the stage on which the substrate is placed and the position in the direction orthogonal to the moving direction of the drawing head during image drawing. And obtaining a relative positional deviation in the direction orthogonal to the moving direction based on the position in the direction orthogonal to the moving direction of the stage and the position in the direction orthogonal to the moving direction of the drawing head. It can be.

  Further, during the image drawing, the result of acquiring the position in the direction orthogonal to the moving direction of the stage on which the substrate is placed is obtained as a result of the relative position control in the direction orthogonal to the moving direction. It can be used for both acquisition of misalignment.

  Further, the correction means can correct the drawing point formation position by controlling the drawing point formation timing of the drawing head based on the relative positional deviation in the moving direction. Further, the correction means can control the stage on which the substrate is placed so as to suppress relative displacement in the moving direction.

  Further, the correction means performs a shift process in the direction corresponding to the orthogonal direction on the image data representing the image made up of the drawing point data based on the relative positional deviation in the direction orthogonal to the moving direction. Thus, the drawing point formation position can be corrected. Further, the correction means can control the stage on which the substrate is placed so as to suppress a relative positional shift in the direction orthogonal to the moving direction.

  Further, the drawing head emits light beam and irradiates the beam light on the substrate to form a drawing point, and the irradiation position of the light beam emitted from the drawing head is orthogonal to the moving direction. An optical system that is movable in the direction of movement, and the correction means uses the optical system to make the irradiation position of the beam light orthogonal to the movement direction based on the relative positional deviation in the direction orthogonal to the movement direction. The drawing point formation position can be corrected by moving in the direction of movement.

  Further, it is assumed that there are a plurality of drawing heads, and the positional deviation acquisition means acquires the relative positional deviation for each drawing head based on the relative positional relationship between each drawing head and the substrate. it can.

  According to the drawing method and apparatus of the present invention, the relative positional deviation between the substrate and the drawing head during image drawing is obtained, and the drawing point formation position of the drawing head is corrected based on the obtained positional deviation. So, for example, even if the relative position of the substrate and the drawing head is displaced due to the influence of vibration from the installation environment, the formation position of the drawing point is corrected in real time according to the displacement, An image can be drawn at a desired position on the substrate, and deterioration of the image quality as described above can be suppressed.

  Hereinafter, an exposure apparatus using the first embodiment of the drawing method and apparatus of the present invention will be described in detail with reference to the drawings.

  In the exposure apparatus using the first embodiment of the present invention, the displacement amount of the moving stage that transports the substrate is determined in advance, and the movement caused by, for example, disturbance during exposure onto the substrate is obtained. The displacement amount of the stage is measured in real time, and the desired exposure image is exposed at a desired position on the substrate in consideration of both the previously measured displacement amount and the displacement amount measured in real time. It is a thing.

  First, a schematic configuration of an exposure apparatus using the first embodiment of the present invention will be described. FIG. 1 is a perspective view showing a schematic configuration of an exposure apparatus using the first embodiment of the present invention.

  As shown in FIG. 1, the exposure apparatus 10 includes a flat moving stage 14 that holds the substrate 12 by adsorbing the substrate 12 to the surface. Two guides 20 extending along the stage moving direction are installed on the upper surface of the thick plate-like installation table 18 supported by the four legs 16. The moving stage 14 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by the guide 20 so as to be reciprocally movable. The exposure apparatus 10 includes a moving mechanism (not shown) that moves the moving stage 14 in the stage moving direction, and a linear encoder (not shown) that outputs a pulse signal as the moving stage 14 moves. By detecting the pulse signal of the linear encoder, the position information and scanning speed of the moving stage 14 can be detected.

  The substrate 12 is positioned on the upper surface of the moving stage 14, and further, on one side of the substrate 12 on the upper surface of the moving stage 14, a predetermined interval along the Y direction (this embodiment) In this case, a marking 13 is provided every 50.0 mm).

  In addition, a U-shaped gate 22 is provided at the center of the installation table 18 so as to straddle the moving path of the moving stage 14. Each end of the U-shaped gate 22 is fixed to both side surfaces of the installation base 18. A scanner 24 is provided on one side across the gate 22, and a plurality of cameras 26 are provided on the other side for imaging the front and rear ends of the substrate 12 and the marking 13 on the moving stage 14. It has been.

  The scanner 24 and the camera 26 are respectively attached to the gate 22 and fixedly arranged above the moving path of the moving stage 14.

  As shown in FIGS. 2 and 3B, the scanner 24 includes ten exposure heads 30 (30A to 30J) arranged in a substantially matrix of 2 rows and 5 columns.

  Inside each exposure head 30, a digital micromirror device (DMD) 36, which is a spatial light modulation element (SLM) that spatially modulates an incident light beam, is provided as shown in FIG. In the DMD 36, a plurality of micromirrors 38 are two-dimensionally arranged in a direction orthogonal to each other, and the column direction of the micromirrors 38 is at a predetermined set inclination angle θ (0 ° <θ <90 °) with respect to the scanning direction. It is attached to make. Therefore, the exposure area 32 by each exposure head 30 is a rectangular area inclined with respect to the scanning direction. As the moving stage 14 moves, each exposure head 30 irradiates a plurality of light beams onto the substrate 12 at a predetermined timing, and as shown in FIG. An exposed area 34 is formed. Although a light source that makes a light beam incident on each exposure head 30 is not shown, for example, a laser light source or the like can be used.

  The DMD 36 provided in each of the exposure heads 30 is on / off controlled in units of micromirrors 38, and the substrate 12 is exposed to a dot pattern (black / white) corresponding to the micromirrors 38 of the DMD 36. The aforementioned strip-shaped exposed region 34 is formed by two-dimensionally arranged dots corresponding to the micromirrors 38 shown in FIG. In addition, by inclining the DMD 36 with respect to the scanning direction as described above, the interval between the exposure points arranged in the direction orthogonal to the scanning direction can be narrowed, and high resolution can be achieved. Note that there may be a dot that is not used due to variations in the adjustment of the tilt angle. For example, in FIG. 4, the hatched dot is a dot that is not used, and the micromirror 38 in the DMD 36 corresponding to this dot is always in the OFF state. It becomes.

  Further, as shown in FIGS. 3A and 3B, the exposure heads of the respective rows arranged in a line so that each of the strip-shaped exposed areas 34 partially overlaps the adjacent exposed areas 34. Each of 30 is arranged at a predetermined interval in the arrangement direction. For this reason, for example, the portion that cannot be exposed between the exposure area 32A located on the leftmost side of the first row and the exposure area 32C located on the right side of the exposure area 32A is the exposure area located on the leftmost side of the second row. It is exposed by 32B. Similarly, the portion that cannot be exposed between the exposure area 32B and the exposure area 32D located on the right side of the exposure area 32B is exposed by the exposure area 32C.

  Next, the electrical configuration of the exposure apparatus 10 will be described.

  As shown in FIG. 5, the exposure apparatus 10 exposes exposure image data input unit 40 to which exposure image data representing an exposure image to be exposed is input, and exposure image data input to the exposure image data input unit 40. An exposure image data dividing unit 41 that divides the image data into divided exposure image data for each head 30; a divided image storage memory 42 that stores the divided exposure image data for each exposure head 30 divided by the exposure image data dividing unit 41; An image shift processing unit 43 that performs a shift process on each divided exposure image data stored in the divided image storage memory 42, and each divided exposure image data that has been subjected to the shift process by the image shift processing unit 43, for each micromirror of the DMD 36 A dot pattern conversion unit 44 for converting into frame data composed of dot patterns corresponding to 38 beam positions; An exposure head controller that outputs a control signal to each DMD 36 of each exposure head 30 based on the frame data for each exposure head 30 converted by the turn converter 44 and a reset timing calculated by a reset timing calculator 95 described later. 45. The reset timing is a timing at which a control signal is output from the exposure control unit 45 to the DMD 36 of the exposure head 30, and at this timing, data in the DMD 36 is rewritten, and the state of the micromirror 38 of the DMD 36 is switched. To do.

  Further, the exposure apparatus 10 is based on an X-direction displacement amount storage memory 50 in which the displacement amount of the movement stage 14 in the X direction measured in advance is stored, and a displacement amount of the movement stage 14 in the Y direction measured in advance. The real time of the moving stage 14 during the exposure to the substrate 12 is obtained based on the pulse correction number memory 60 in which the pulse correction number described later is stored and the measurement information measured by the stage posture measuring unit 70 described later. A real-time displacement amount calculation unit 80 that calculates the displacement amount, a real-time displacement amount of the moving stage 14 in the X direction calculated by the real-time displacement amount calculation unit 80, and a displacement amount stored in advance in the X-direction displacement amount storage memory 50 X direction displacement amount addition unit 90 for calculating the actual displacement amount in the X direction of the moving stage 14 based on Each exposure head is based on the pulse correction number corresponding to the real-time displacement amount of the moving stage 14 in the Y direction calculated by the time displacement amount calculation unit 80 and the pulse correction number stored in the pulse correction number storage memory 60 in advance. A reset timing calculation unit 95 that calculates 30 reset timings.

Further, as shown in FIG. 6, the stage posture measuring unit 70 measures the X-direction position information measuring unit 71 that measures the position information of the moving stage 14 in the X direction and the position information of the moving stage 14 in the Y direction. Based on the position information measured by the Y-direction position information measuring unit 72, the position information measured by the X-direction position information measuring unit 71, and the position information measured by the Y-direction position information measuring unit 72, A stage posture calculation unit 73 for obtaining a real-time displacement amount and a rotation amount with respect to the direction is provided.

  Further, the real-time displacement amount calculation unit 80 is based on the real-time displacement amount and the rotation amount in the X direction obtained by the stage attitude measurement unit 70, and the real-time displacement amount in the X direction of the moving stage 14 with respect to each exposure head 30. Based on the X-direction displacement amount calculation unit 81 that calculates the above-described values and the real-time displacement amount and rotation amount in the Y direction obtained by the stage attitude measurement unit 70, the real-time direction in the Y direction of the moving stage 14 with respect to each exposure head 30 A reset timing correction amount calculating unit 82 that calculates a displacement amount and calculates a pulse correction number of the reset timing for each exposure head 30 based on the real time displacement amount; In the present embodiment, the stage attitude measurement unit 70 and the real-time displacement amount calculation unit 80 constitute a positional deviation acquisition unit in the claims. In this embodiment, it is assumed that the exposure head 30 and the stage attitude measurement unit 70 are fixed to the same casing, and the positional deviation in the claims is acquired as the real-time displacement amount.

  The X-direction position information measuring unit 71 shown in FIG. 6 emits laser light to the side mirror 71a installed on the side surface of the moving stage 14 extending in the moving direction, and the side mirror 71a, and detects the reflected light. And an X-direction laser length measuring unit 71b for measuring the distance to the side mirror 71a. The Y-direction position information measuring unit 72 emits laser light to the cube mirrors 72a and 72b installed on the side surfaces of the moving stage 14 extending in the direction orthogonal to the moving direction, and the reflected light is emitted to the cube mirror 72a. A first Y-direction laser length measuring unit 72c that detects and measures the distance to the cube mirror 72a, and emits laser light to the cube mirror 72b and detects the reflected light to measure the distance to the cube mirror 72b. And a second Y-direction laser length measuring unit 72d. In FIG. 6, only one X-direction laser length measuring unit 71b is provided. However, in reality, a sufficient number of X-direction laser length measuring units 71b for obtaining the real-time displacement amount in the X direction of the moving stage 14 during the exposure. It is assumed that an X-direction laser length measurement unit 71b is provided. Alternatively, only one X-direction laser length measurement unit 71b may be provided, and the length of the side mirror 71a may be long enough to obtain the real-time displacement amount.

  The exposure apparatus 10 includes a controller (not shown) that controls the entire exposure apparatus.

  The detailed operation of each component will be described in detail later.

  Next, the operation of the exposure apparatus 10 will be described with reference to the drawings.

  As described above, the exposure apparatus 10 measures and sets in advance the amount of displacement of the moving stage 14 that conveys the substrate 12, and moves, for example, during the exposure onto the substrate 12 due to a disturbance or the like. 14 displacement amounts are measured in real time, and a desired exposure image is exposed at a desired position on the substrate 12 in consideration of both the previously measured displacement amount and the displacement amount measured in real time. It is a thing.

  First, a method for measuring and setting the displacement amount of the moving stage 14 in advance will be described.

  First, the moving stage 14 is moved upstream from the position shown in FIG. 1 by the moving mechanism. The upstream side is the right side in FIG. 1, that is, the side where the scanner 24 is installed with respect to the gate 22, and the downstream side is the left side in FIG. 26 is the side where it is installed.

  The moving stage 14 moves to the upstream end and then moves downstream at a desired constant speed. As the moving stage 14 moves, a pulse signal is output from the linear encoder and input to the controller.

  Then, the controller counts the pulse signal from the linear encoder, and outputs a control signal to the camera 26 every time 1000000 pulses are counted, and images the marking 13 provided on the moving stage 14 by the camera 26. The linear encoder in the present embodiment outputs a pulse signal every time the moving stage 14 moves 0.1 μm. In order to increase the adjustment resolution, the pulse of 0.1 μm pitch is doubled to 0.05 μm. Outputs a pitch pulse signal. Therefore, by imaging the marking 13 with the camera 26 every 1 million pulses as described above, it is possible to perform imaging in accordance with the interval of the marking 13 (0.05 μm / 1 pulse × 1000000 pulses = 50 mm).

  And the picked-up image data which imaged marking 13 with the camera 26 as mentioned above is output to a controller, and a controller calculates | requires the displacement amount about the X direction of the movement stage 14 based on the input picked-up image data.

  Specifically, as shown in FIG. 7, the controller sets an X-direction reference line (X = 0 line) that can determine the position of the marking image in the X direction in the captured image captured by the camera 26. Thus, the amount of displacement of the marking 13 in the X direction can be obtained by obtaining the amount of displacement of the marking image from the X direction reference line. Note that the amount of positional deviation of the marking image can be obtained, for example, by obtaining the deviation of the center of gravity of the marking image from the X-direction reference line.

  Then, the displacement amount of each marking 13 is sequentially acquired based on the captured image data of each marking 13 captured by the camera 26. Then, the displacement amount of each marking 13 is plotted as shown in FIG. 8, and a meandering curve as shown in FIG. 8 is obtained by interpolating the plotted displacement amount (x mark). The meandering curve obtained as described above is stored in the X-direction displacement amount storage memory 50.

  Further, the controller obtains the displacement amount in the X direction of the moving stage 14 as described above based on the captured image data of the marking 13 and also obtains the displacement amount in the Y direction of the moving stage 14.

  Specifically, as shown in FIG. 9, the controller sets a Y-direction reference line (Y = 0 line) that can determine the position of the marking image in the Y direction in the captured image captured by the camera 26. The amount of displacement of the marking image from the Y-direction reference line is obtained. Note that the amount of positional deviation of the marking image can be obtained, for example, by obtaining the deviation of the center of gravity of the marking image from the Y-direction reference line.

  Then, the amount of misalignment of each marking image is obtained as described above, and the amount of misalignment of each marking image is increased or decreased with respect to the amount of misalignment of the marking image captured one time before. The number of doubled pulses by the linear encoder required to correct the increased and decreased positional deviation amount is calculated. That is, as shown in FIG. 10, for example, when a marking 13 at a position of 50 mm is imaged, a displacement amount of +4.5 μm is calculated, and when a marking 13 at a position of 100 mm is imaged, +5.3 μm When the amount of displacement is calculated, only 5.5 μm−4.5 μm = 0.8 μm is increased in the section of 50 mm to 100 mm. That is, the displacement amount of the moving stage 14 in the section of 50 mm to 100 mm is 0.8 μm. In the linear encoder of the present embodiment, a pulse multiplied by 2 is detected every time it moves by 0.05 μm. Therefore, by correcting by 0.8 μm / 0.05 μm = 16 pulses, a 50-100 mm section is obtained. It is possible to correct the amount of displacement in the Y direction generated in the meantime.

  As described above, the number of pulse corrections corresponding to the amount of displacement of the moving stage 14 is obtained for each section of the marking 13 based on the amount of misalignment in the Y direction of each marking image. And stored in the pulse correction number storage memory 60. The table of pulse correction numbers is corrected in accordance with the relative positional relationship based on the positional information about the X direction of the camera 26 that captured the marking 13 and the positional information of each exposure head 30. A table of pulse correction numbers for each exposure head 30 is obtained and stored in the pulse correction number storage memory 60.

  Then, the displacement amount of the moving stage 14 in the X direction is obtained in advance as described above, and the pulse correction number is obtained based on the displacement amount of the moving stage 14 in the Y direction. 1 moves upstream from the position shown in FIG. 1, moves to the upstream end, and then moves downstream at a desired constant speed.

  As the moving stage 14 moves downstream, exposure on the substrate 12 is started by each exposure head 30 and a real-time displacement amount of the moving stage 14 during the exposure is measured. First, a method for measuring the real-time displacement will be described.

  As described above, the moving stage 14 moves to the downstream side, and the first Y-direction laser length measuring unit 72c and the second Y-direction laser length measuring unit 72d shown in FIG. 6 respectively apply laser beams to the cube mirrors 72a and 72b. Is emitted, and laser light is emitted from the X-direction laser length measuring unit 71b to the side mirror 71a.

  The laser beams emitted from the first and second Y-direction laser length measuring units 72c and 72d are reflected by the cube mirrors 72a and 72b, and the reflected lights are respectively the first and second Y-direction laser length measuring units. The distances to the cube mirrors 72a and 72b are measured by 72c and 72d, respectively. The laser light emitted from the X-direction laser length measuring unit 71b is reflected by the side mirror 71a, and the reflected light is detected by the X-direction laser length measuring unit 71b to measure the distance to the side mirror 71a.

  Then, the measurement result is output to the stage attitude calculation unit 73. The stage attitude calculation unit 73 measures the position information X1 of the moving stage 14 in the X direction based on the measurement result of the X direction laser measurement unit 71b. Based on the measurement results of the direction laser length measuring units 72c and 72d, position information Y1 and Y2 of the moving stage 14 in the Y direction are measured.

  The stage attitude calculation unit 73 is preset with position information serving as a reference when the moving stage 14 is ideally moved, and the position information and the position information X and Y1 acquired as described above. , Y2, the real-time displacement amount X in the X direction of the moving stage 14, the real-time displacement amount Y in the Y direction, and the rotation amount θ of the moving stage 14 are obtained.

  The real-time displacement amount X in the X direction and the real-time displacement amount Y and the rotation amount θ in the Y direction are acquired in advance by, for example, outputting a reset timing from the exposure control unit 45 to the exposure head 30. What is necessary is just to perform it for every set pulse number (this embodiment 40 pulse number).

  As the moving stage 14 moves, the real-time displacement amounts X and Y and the rotation amount θ are sequentially obtained as described above, and the real-time displacement amount Y and the rotation amount θ in the Y direction are calculated as a reset timing correction amount calculation unit. The real-time displacement amount X and the rotation amount θ in the X direction are output to the X-direction displacement amount calculation unit 81.

  The reset timing correction amount calculation unit 82 sequentially obtains real-time displacement amounts Y1 to YN of the moving stage 14 with respect to each exposure head 30 based on the real-time displacement amount Y and the rotation amount θ in the Y direction that are sequentially input. It is done. Note that the real-time displacement amounts Y1 to YN are obtained based on the positional information with respect to the moving stage 14 for each exposure head 30 and the real-time displacement amount Y and the rotation amount θ of the moving stage 14.

  Based on the real-time displacement amounts Y1 to YN for each exposure head 30, the pulse correction numbers are sequentially calculated for each exposure head 30 in the same manner as described above, and the pulse correction numbers for each exposure head 30 are sequentially calculated. It is output to the reset timing calculation unit 95.

  On the other hand, the X-direction displacement amount calculation unit 81 sequentially obtains real-time displacement amounts X1 to XN of the moving stage 14 with respect to each exposure head 30 based on the sequentially input real-time displacement amount X and rotation amount θ in the X direction. It is done. Note that the real-time displacement amounts X1 to XN are obtained based on the positional information with respect to the moving stage 14 for each exposure head 30 and the real-time displacement amount X and the rotation amount θ of the moving stage 14.

  The real-time displacement amounts X1 to XN for each exposure head 30 obtained sequentially as described above are sequentially output to the X-direction displacement amount adding unit 90.

  Next, the real-time displacement amounts X1 to XN of the moving stage 14 for each exposure head 30 calculated by the X-direction displacement amount calculation unit 81 as described above, and the meandering curve stored in the X-direction displacement amount storage memory 50, Based on the above, the exposure position in the X direction of each exposure head 30 is corrected and stored in the pulse correction number storage memory 60 and the pulse correction number calculated by the reset timing correction amount calculation unit 82 as described above. A method of exposing an exposure image at a desired position on the substrate 12 by controlling the reset timing of each exposure head 30 based on the number of pulse corrections will be described.

  First, exposure image data representing an exposure image to be exposed on the substrate 12 is input to the exposure image data input unit 40. The exposure image data is output from the exposure image data input unit 40 to the exposure image data division unit 41.

  Then, the exposure image data dividing unit 41 divides the inputted exposure image data into divided exposure image data for each exposure head 30 as shown in FIG. 12, and the divided exposure image data for each exposure head 30 is divided. Each is stored in the divided image storage memory 42.

  Then, the divided exposure image data for each exposure head 30 is stored in the divided image storage memory 42 as described above, and the moving stage 14 on which the substrate 12 is installed has a desired constant value from the upstream side toward the downstream side. Move by speed.

  When the leading edge of the substrate 12 is detected by the camera 26, exposure to the substrate 12 is started by each exposure head 30 at a predetermined reset timing. At this time, the following processing is performed.

  When the front end of the substrate 12 is detected, the image shift processing unit 43 reads out the divided exposure image data corresponding to the position of each exposure head 30 with respect to the moving stage 14 from the divided image storage memory 42. Then, a shift process is performed on the divided exposure image data read for each exposure head 30 as described above.

  Specifically, the X-direction displacement amount adding unit 90 determines the position of the moving stage 14 (40 pulses × 0.05 μm = 0 in the present embodiment) based on the meandering curve stored in the X-direction displacement amount storage memory 81. .2 μm), the displacement amount of the moving stage 14 in the X direction is obtained, and the displacement amount is added to the real-time displacement amounts X1 to XN of the exposure heads 30 calculated in the X direction displacement amount calculation unit 81. The amount is obtained, and the added displacement amount is output to the image shift processing unit 43, respectively.

  Then, the image shift processing unit 43 performs a shift process on the input divided exposure image data for each exposure head 30 based on the added displacement amount for each exposure head 30.

  More specifically, the image shift processing unit 43 applies a margin image corresponding to the width of the added displacement amount as shown in FIG. 13B to the input divided exposure image data shown in FIG. As shown in FIG. 13C, shift processing is performed on the divided image data to which the margin image data is added based on the added displacement amount, and the divided exposure image subjected to the shift processing is added. Trimming processing is performed on the data at the joint position, and the divided exposure image data subjected to the trimming processing is output to the dot pattern conversion unit 44.

  Then, the dot pattern conversion unit 44 performs exposure corresponding to the beam position of the micromirror 38 of each DMD 36 of each exposure head 30 from the divided exposure image data for each exposure head 30 subjected to the shift processing as described above. The point data is extracted, and frame data composed of the exposure point data is generated.

  Then, the exposure control unit 45 sends a control signal based on the frame data generated by the dot pattern conversion unit 44 as described above to each exposure head at the reset timing obtained by the reset timing calculation unit 95 as follows. Output to 30 DMDs 36.

  The reset timing calculation unit 95 is preset to output the reset timing to each exposure head 30 every time the pulse signal output from the linear encoder is counted by 40 pulses. That is, the reset timing is set in advance so as to be output once every time the moving stage 14 moves 2.0 μm.

  Then, the reset timing is obtained by increasing / decreasing the preset 40 pulse number based on the pulse correction number stored in the pulse correction number storage memory and the pulse correction number obtained in the reset timing correction amount calculation unit 82. Is controlled for each exposure head 30 so that a desired exposure image is exposed at a desired position in the Y direction on the substrate 12.

  Specifically, for example, when calculating the reset timing in the section of 50 mm to 100 mm shown in FIG. 10, each exposure head 30 is set to 50 mm to 50 mm based on the table stored in the pulse correction number storage memory 60. The number of pulse corrections in the 100 mm section is read out. For example, when the number of pulse corrections in the section of 50 mm to 100 mm is -16, the reset timing is 1000000 pulses / 40 pulses = 25000 times during the section of 50 mm to 100 mm, so this 25000 times of resetting Correction is made from 40 pulses to 39 pulses for 16 predetermined reset timings in the timing. Further, the number of pulses for outputting the reset timing is corrected based on the number of pulse corrections calculated by the reset timing correction amount calculation unit 82. Specifically, the reset timing correction amount calculation unit 82 outputs, for each exposure head 30, the number of pulse corrections obtained for every 40 pulses to the reset timing calculation unit 95, and the pulses corrected as described above. The number is further increased or decreased by the number of pulse corrections calculated by the reset correction amount calculation unit 82, and reset timing is output for each exposure control unit 45 at a timing corresponding to the increased or decreased number of pulses.

  As the moving stage 14 moves, the reset timing is output from the reset timing calculation unit 95 to each exposure control unit 45 for each number of pulses for each exposure control unit 45 corrected as described above, and each exposure control unit 45 is exposed. The control unit 45 outputs a control signal to each exposure head 30 according to the reset timing.

  Each exposure head 30 turns on / off the micromirror based on the control signal output from each exposure control unit 45 to expose the exposure image on the substrate 12.

  FIG. 14 shows an example of an exposure image when the divided exposure image data is shifted and the reset timing is controlled for each exposure head 30 as described above. 14 indicates the position of the exposure image when the shift processing and reset timing control are not performed, and the thin portion indicates the position of the exposure image when shift processing and reset timing control are performed. Yes.

  Then, when the rear end of the substrate 12 is imaged by the camera 26, the exposure process is completed, and the moving stage 14 moves again to the upstream end.

  According to the exposure apparatus using the first embodiment, the relative displacement between the substrate 12 and the exposure head 30 during exposure of the exposure image is acquired as the real-time displacement amount of the moving stage 14, and the acquired real-time is obtained. Since the exposure point formation position of the exposure head 30 is corrected based on the amount of displacement, the relative positions of the substrate 12 and the exposure head 30 are temporarily changed due to, for example, the influence of vibration from the installation environment. Even in the case of misalignment, the exposure point formation position can be corrected in real time in accordance with the misalignment, and the exposure image can be exposed to a desired position on the substrate 12, and the deterioration of the image quality due to the vibration is suppressed. Can do.

  In the exposure apparatus using the first embodiment, correction processing is performed in consideration of not only the real-time displacement amount of the moving stage 14 but also the displacement amount of the moving stage 14 measured in advance. Correction processing can be performed not only for temporary positional deviation due to vibration from the installation environment, but also for positional deviation due to pitching vibration or meandering of the moving stage 14, so that the exposure image can be aligned with higher accuracy. Can do.

  Further, since the exposure position of the exposure image is corrected by controlling the reset timing based on the real-time displacement amount in the Y direction, for example, a shift process is performed on the exposure image data in a direction corresponding to the Y direction. Compared with the case where correction is performed, high-resolution correction can be performed without being restricted by the resolution of the exposure image data.

  Further, since the real-time displacement amount is obtained for each exposure head 30, and correction is performed based on the real-time displacement amount for each exposure head 30, the same real-time displacement amount is obtained and corrected for all the exposure heads 30. Compared with the case, alignment with higher accuracy can be performed.

  Next, an exposure apparatus using the second embodiment of the drawing method and drawing apparatus of the present invention will be described.

  The exposure measure 15 using the second embodiment of the present invention is different from the exposure apparatus 10 using the first embodiment of the present invention in a correction method according to the real-time displacement amount of the moving stage 14 in the X direction. Is different. In the exposure apparatus using the first embodiment of the present invention, the divided exposure image data for each exposure head 30 is subjected to shift processing based on the real-time position of the moving stage in the X direction. In the exposure measure 15 of the present embodiment, the shift processing for the divided exposure image data is performed based only on the meandering curve stored in the X-direction displacement amount storage memory 50. The real-time displacement amounts X1 to XN for each exposure head 30 calculated by the X-direction displacement amount calculation unit 81 are corrected as follows.

  In the exposure unit 15, as shown in FIG. 15, a parallel plate 100 made of glass or the like is installed for each exposure head 30. The parallel plate 100 is supported so as to be rotatable about an axis perpendicular to the optical axis of the exposure head 30 and parallel to the Y direction. A plate spring 101 is provided at one end of the parallel plate 100 in the X direction, and one end of the plate spring 101 is fixed to a part of the casing of the exposure unit 15. Further, the leaf spring 101 is provided with a strain gauge 102, and a piezoelectric actuator 103 is provided at the other end of the parallel plate 100. In the present embodiment, the parallel plate 100, the leaf spring 101, the strain gauge 102, and the piezo actuator 103 constitute an optical system in the claims.

  Then, the piezo actuator 103 expands and contracts in the direction of arrow A shown in FIG. 15B based on the input control signal and the output result from the strain gauge 102, and the piezo actuator 103 expands and contracts in the direction of arrow A. 100 rotates in the direction of arrow B.

  Then, by rotating the parallel plate 100 in the arrow B direction as described above, the irradiation position on the substrate 12 in the X direction of the laser light emitted from the exposure head 30 is shown in FIG. It can be moved as shown.

  Therefore, in the exposure measure 15, based on the real-time displacement amounts X1 to XN obtained for each exposure head, the control signal of the piezo actuator 103 corresponding to the real-time displacement amounts X1 to XN is obtained for each exposure head 30. The generated control signals are sequentially input to the piezo actuator 103.

  Then, each piezo actuator 103 expands and contracts according to the control signal generated as described above, thereby moving the laser light emitted from the exposure head 3 in the X direction by an amount corresponding to the real-time displacement amounts X1 to XN. be able to.

  By performing the processing as described above, the same effect as that of the exposure apparatus 10 using the first embodiment of the present invention can be obtained.

  Further, in the case where the correction in the X direction is performed using the optical system as in the exposure apparatus 15 using the second embodiment, the exposure apparatus 10 using the first embodiment is used. As compared with the case where the exposure image data is subjected to the shift process and correction is performed as described above, high-resolution correction can be performed without being restricted by the resolution of the exposure image data.

  In the above embodiment, the amount of displacement in the X direction and the Y direction of the moving stage 14 is obtained in advance by imaging the marking 13 provided on the moving stage 14 in advance. However, the marking 13 is provided. Rather, the displacement amount in the X direction and the Y direction of the moving stage 14 is obtained in advance by the laser length measuring device, the displacement amount in the X direction is stored in the X direction displacement amount storage memory 50, and the pulse correction number storage memory 60 is stored. The number of pulse corrections may be stored.

  In the above embodiment, the displacement amount of the moving stage 14 in the X direction is stored in the X direction displacement amount storage memory 50 in advance, and the pulse correction number is stored in the pulse correction number storage memory 60 in advance. Although correction processing is performed based on the stored information and the real-time displacement amount of the moving stage 14 during exposure of the substrate 12, the displacement amount and the number of correction pulses of the moving stage 14 are not necessarily acquired in advance in the X direction. The correction process may be performed using only the real-time displacement amount of the moving stage 14 during the exposure of the substrate 12.

  In the above embodiment, the real-time displacement amount in the Y direction of the moving stage 14 is corrected by controlling the reset timing of each exposure head 30. However, the movement stage 14 is divided according to the real-time displacement amount in the Y direction. You may make it perform the shift process about a Y direction with respect to exposure image data.

  In the first and second embodiments, the real-time displacement amount is acquired based on the position information of the moving stage 14 and the correction is performed based on the real-time displacement amount. In addition to the information, the position information of the exposure head 30 is also measured, and the relative real-time displacement amount in the X direction and the Y direction is acquired based on the position information of the moving stage 14 and the position information of the exposure head 30, Correction may be performed based on the relative real-time displacement amount.

  Specifically, as shown in FIG. 16, the exposure head X-direction laser length measuring unit 75 that acquires position information about the X direction of the exposure head 30 and the exposure that acquires position information about the Y direction of the exposure head 30. The head Y-direction laser length measuring units 74 a and 74 b may be provided, and the position information of the exposure head 30 in the X direction and the Y direction may be acquired by the exposure head position information acquisition unit 76. In FIG. 16, the mirrors corresponding to the laser length measuring units are not shown.

  For the X direction, based on the position information of the exposure head 30 acquired by the exposure head position information acquisition unit 76 and the position information of the moving stage 14 acquired by the stage attitude calculation unit 73, relative real time is obtained by the following equation. The displacement amount X is calculated, and correction processing may be performed as in the first embodiment or the second embodiment.

X = (X1-XH) × A
X1: Position information about the X direction of the moving stage 14 measured by the X direction laser length measuring unit 71b XH: Position information about the X direction of the exposure head 30 measured by the X direction laser length measuring unit 75 for the exposure head A: Arbitrary constant For the Y direction, based on the position information of the exposure head 30 acquired by the exposure head position information acquisition unit 76 and the position information of the moving stage 14 acquired by the stage attitude calculation unit 73, the relative real-time displacement amount Y calculated in the exposure head 30 per the following equation, based on their relative real time displacement amount Y, as shown in FIG. 17, and slower or faster exposure timing of each exposure heads 30 _N For example, the correction process may be performed. The pulse waveform of FIG. 17 shows the exposure timing of each exposure heads 230 _N, the dotted line in FIG. 17, the exposure head 30 _N in the case where there is no relative displacement between the moving stage 14 and the exposure head It represents the exposure timing, and the solid line indicates the exposure timing of the exposure heads 30 _N when there is positional displacement.

Y = (Y1 + Y2) / 2 + (Y1-Y2) * A (N) + (YH1-YH2) * B (N)
Y1: Position information about the Y direction of the moving stage 14 measured by the Y direction laser length measuring unit 72d Y2: Position information about the Y direction of the moving stage 14 measured by the Y direction laser length measuring unit 72c YH1: Exposure head Position information YH2 about the Y direction of the exposure head 30 measured by the Y direction laser length measuring unit 74a: Position information about the Y direction of the exposure head 30 measured by the Y direction laser length measuring unit 74b for the exposure head Incidentally, a (N), B ( N) is a constant given for each of the exposure heads 30 _N, with respect to the central position between the exposure heads 30 ₁ to the exposure head 30 _N, the position of the exposure head 30 _N to be calculated It is a constant determined based on the value. The closer to the center position, the smaller the value and the farther the value becomes.

  In the above embodiment, the image data is shifted or the exposure timing is controlled based on the relative displacement between the moving stage 14 and the exposure head 30, but the present invention is not limited to this. For example, the moving stage 14 may be moved in the X direction, the Y direction, and the θ direction so as to suppress the relative displacement.

  The position information about the X direction of the moving stage 14 acquired by the X direction laser length measuring unit 71b and the position information about the Y direction of the moving stage 14 acquired by the Y direction laser length measuring units 72d and 72c are: As described above, it may be used to acquire the relative real-time displacement amount, or may be used to control the position of the moving stage 14.

  In the above-described embodiment, the exposure apparatus including the DMD as the spatial light modulation element has been described. However, in addition to the reflective spatial light modulation element, a transmissive spatial light modulation element can also be used.

  In the above embodiment, a so-called flood bed type exposure apparatus has been described as an example. However, a so-called outer drum type exposure apparatus having a drum around which a photosensitive material is wound may be used.

  Moreover, the board | substrate 12 which is the exposure object of the said embodiment may be not only a printed wiring board but the board | substrate of a flat panel display. The shape of the substrate 12 may be a sheet shape or a long shape (flexible substrate or the like).

  The drawing method and apparatus according to the present invention can also be applied to drawing in a printer such as an inkjet method.

The perspective view which shows schematic structure of the exposure apparatus using 1st and 2nd embodiment of the drawing method and apparatus of this invention The perspective view which shows the structure of the scanner of exposure apparatus (A) is a plan view showing an exposed region formed on the exposure surface of the substrate, and (B) is a plan view showing an array of exposure areas by each exposure head. The figure which shows DMD in the exposure head of exposure apparatus Block diagram showing the electrical configuration of the exposure apparatus The figure which shows the X direction position information measurement part and Y direction position information measurement part of exposure apparatus The figure for demonstrating the method of calculating | requiring the displacement amount about the X direction of a movement stage. The figure which shows the meandering curve calculated | required from the displacement amount about the X direction of a movement stage The figure for demonstrating the method of calculating | requiring the displacement amount about the Y direction of a movement stage. The figure which shows the displacement amount about the Y direction of a movement stage The figure which shows the pulse correction number of the reset timing calculated | required based on the displacement amount about the Y direction of a movement stage Diagram showing divided exposure image data The figure for demonstrating the method to perform a shift process to division exposure image data The figure which shows an example of the exposure image at the time of performing a shift process to division exposure image data for every exposure head, and controlling the reset timing The figure which shows a part of exposure apparatus using 2nd Embodiment of the drawing method and apparatus of this invention The figure which shows a part of exposure apparatus using other embodiment of the drawing method and apparatus of this invention The figure which shows the exposure timing of the exposure head

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,15 Exposure apparatus 12 Board | substrate 13 Marking 14 Moving stage 18 Installation stand 20 Guide 22 Gate 24 Scanner 26 Camera 30 Exposure head (drawing head)
32 Exposure area 36 DMD
38 Micromirror 70 Stage posture measurement unit (positional deviation acquisition means)
80 Real-time displacement calculation unit (positional deviation acquisition means)
43 Image shift processing unit (correction means)
95 Reset timing calculation unit (correction means)

Claims (24)

A drawing head for forming a drawing point on the substrate based on the inputted drawing point data is moved relative to the substrate, and the drawing point is sequentially formed on the substrate by the drawing head according to the movement. In the drawing method of drawing an image,
Obtaining a relative positional shift between the substrate and the drawing head during drawing of the image;
A drawing method, wherein the drawing point formation position of the drawing head is corrected based on the acquired positional deviation.   While drawing the image, the relative positional shift in the direction perpendicular to the moving direction of the substrate and the drawing head is obtained while acquiring the relative positional shift in the moving direction of the substrate and the drawing head. The drawing method according to claim 1, wherein:   During drawing of the image, the position of the stage on which the substrate is placed in the moving direction and the position of the drawing head in the moving direction are acquired, and the position of the stage in the moving direction and the drawing head The drawing method according to claim 2, wherein a relative positional shift in the movement direction is acquired based on the position in the movement direction.   During drawing of the image, the result of acquiring the position of the stage on which the substrate is placed in the moving direction is used for both the position control of the stage and the acquisition of the relative positional deviation in the moving direction. The drawing method according to claim 3, wherein the drawing method is used.   During drawing of the image, a position in a direction perpendicular to the moving direction of the stage on which the substrate is placed and a position in a direction perpendicular to the moving direction of the drawing head are acquired, and the movement of the stage The relative positional shift in the direction orthogonal to the moving direction is acquired based on the position in the direction orthogonal to the direction and the position in the direction orthogonal to the moving direction of the drawing head. The drawing method according to any one of 2 to 4.   During drawing of the image, the result of acquiring the position in the direction orthogonal to the moving direction of the stage on which the substrate is placed is obtained as a result of relative control in the direction orthogonal to the moving direction and the position control of the stage. 6. The drawing method according to claim 5, wherein the drawing method is used for both of acquisition of misalignment.   7. The drawing point formation position is corrected by controlling the drawing point formation timing of the drawing head based on a relative positional shift in the movement direction. The drawing method according to item 1.   The drawing method according to claim 1, wherein a stage on which the substrate is placed is controlled so as to suppress a relative positional shift in the moving direction.   Based on the relative displacement in the direction orthogonal to the moving direction, the drawing is performed by performing shift processing in the direction corresponding to the orthogonal direction on the image data representing the image composed of the drawing point data. The drawing method according to claim 1, wherein a point formation position is corrected.   The drawing method according to claim 1, wherein the stage on which the substrate is placed is controlled so as to suppress a relative displacement in a direction orthogonal to the moving direction. The drawing head is configured to emit the beam light and irradiate the beam light on the substrate to form the drawing point, and the irradiation position of the beam light emitted from the drawing head is set to the moving direction. An optical system movable in a direction perpendicular to the
Based on the relative displacement in the direction orthogonal to the moving direction, the optical system corrects the drawing point formation position by moving the irradiation position of the beam light in a direction orthogonal to the moving direction. The drawing method according to claim 1, wherein the drawing method is performed. A plurality of the drawing heads;
The drawing method according to claim 1, wherein the relative positional deviation for each drawing head is acquired based on a relative positional relationship between each drawing head and the substrate. . A drawing head for forming a drawing point on the substrate based on the inputted drawing point data is moved relative to the substrate, and the drawing point is sequentially formed on the substrate by the drawing head according to the movement. In a drawing device for drawing an image,
A positional deviation acquisition means for acquiring a relative positional deviation between the substrate and the drawing head during drawing of the image;
A drawing apparatus comprising: correction means for correcting the drawing point formation position of the drawing head based on the positional deviation acquired by the positional deviation acquisition means.   The positional deviation acquisition means acquires a relative positional deviation in the movement direction of the substrate and the drawing head during drawing of the image, and a direction orthogonal to the movement direction of the substrate and the drawing head. The drawing apparatus according to claim 13, wherein a relative positional shift is acquired.   The positional deviation acquisition means acquires a position in the moving direction of the stage on which the substrate is placed and a position in the moving direction of the drawing head during drawing of the image, and the moving direction of the stage The drawing apparatus according to claim 14, wherein a relative positional shift with respect to the moving direction is acquired based on a position with respect to the position and a position with respect to the moving direction of the drawing head.   During drawing of the image, the result of acquiring the position of the stage on which the substrate is placed in the moving direction is used for both the position control of the stage and the acquisition of the relative positional deviation in the moving direction. The drawing apparatus according to claim 15, wherein the drawing apparatus is used.   The positional deviation acquisition means determines a position in a direction orthogonal to the movement direction of the stage on which the substrate is placed and a position in a direction orthogonal to the movement direction of the drawing head during drawing of the image. And obtaining a relative positional shift in the direction orthogonal to the moving direction based on the position in the direction orthogonal to the moving direction of the stage and the position in the direction orthogonal to the moving direction of the drawing head. The drawing apparatus according to claim 14, wherein the drawing apparatus is one.   During drawing of the image, the result of acquiring the position in the direction orthogonal to the moving direction of the stage on which the substrate is placed is obtained as a result of relative control in the direction orthogonal to the moving direction and the position control of the stage. The drawing apparatus according to claim 17, wherein the drawing apparatus is used for both acquisition of misalignment.   The correction means corrects the drawing point formation position by controlling the drawing point formation timing of the drawing head based on a relative positional shift in the movement direction. The drawing apparatus according to any one of claims 13 to 18.   The drawing according to any one of claims 13 to 18, wherein the correction unit controls the stage on which the substrate is placed so as to suppress a relative positional shift in the moving direction. apparatus.   The correction means shifts the image data representing the image made up of the drawing point data in a direction corresponding to the orthogonal direction based on a relative positional shift in the direction orthogonal to the moving direction. 21. The drawing apparatus according to claim 13, wherein the drawing position is corrected by performing the correction.   The said correction | amendment means controls the stage in which the said board | substrate was mounted so that the relative position shift about the direction orthogonal to the said moving direction might be suppressed. The drawing apparatus according to item. The drawing head emits beam light and irradiates the beam light on the substrate to form the drawing point, and the irradiation position of the beam light emitted from the drawing head is set in the moving direction. Further having an optical system movable in a direction perpendicular to
The correction means moves the irradiation position of the beam light in the direction orthogonal to the movement direction by the optical system based on the relative positional deviation in the direction orthogonal to the movement direction. 21. The drawing apparatus according to claim 13, wherein the drawing position is corrected. A plurality of the drawing heads;
14. The misregistration acquisition unit acquires the relative misregistration for each of the drawing heads based on a relative positional relationship between the drawing heads and the substrate. The drawing apparatus according to any one of 1 to 23.

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