JP4330435B2 - スタッドバンプ形成方法、スタッドバンプを含む半導体装置の製造方法 - Google Patents
スタッドバンプ形成方法、スタッドバンプを含む半導体装置の製造方法 Download PDFInfo
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- JP4330435B2 JP4330435B2 JP2003412640A JP2003412640A JP4330435B2 JP 4330435 B2 JP4330435 B2 JP 4330435B2 JP 2003412640 A JP2003412640 A JP 2003412640A JP 2003412640 A JP2003412640 A JP 2003412640A JP 4330435 B2 JP4330435 B2 JP 4330435B2
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Description
一般にシステム化に用いられる半導体装置は、半導体素子を積層し電気的接続の方法にはリードを介すか、素子同士を直接接続するよう構成されている。図15は従来のスタッドバンプを形成する工程を説明する為の工程断面図であり、図16は従来の半導体装置の断面図、図17はスタッドバンプの拡大断面図である。
(実施の形態1)
以下に、本発明によるスタッドバンプ形成方法の実施形態について説明する。
(実施の形態2)
図3は、実施形態2によるスタッドバンプ8の拡大断面図である。この実施形態2は前述の実施形態1と殆ど変わらないが、図3にもあるように、環状形状部7がワイヤー3A,3Bの進入方向と逆方向側に形成され、かかる環状形状部7(スタッドバンプ8)にワイヤー3A,3Bを接続する。このとき環状形状部7は、ワイヤー3A,3Bとの接続面積の確保、及びワイヤー3A,3Bの滑走距離を確保する為に使用され、強度の確保及びワイヤー3A,3Bの垂れを防止できる。
(実施の形態3)
図4は実施形態1による半導体装置の断面図である。ダイパッド11に接着剤12Aを塗布して、その上にポリィミド9の膜が施された半導体素子4Aを固着し、この半導体素子4A上に接着剤12Bを塗布して、その上にポリィミド9が施された別の半導体素子4Bを積層している。前記半導体素子4Bのボンディングパッド5上にはスタッドバンプ8が形成され、このスタッドバンプ8に、半導体素子4Aからのワイヤー3Aが電気的に接続されるとともに、ダイパッド11の周辺にある複数本のインナーリード13からのワイヤー3Bが電気的に接続されている。
(実施の形態4)
次に、実施の形態3(図4)に示した半導体装置を製造する方法を、図5〜図14に基づいて説明する。
2 キャピラリー
3 スタッドバンプ用ワイヤー
3A ワイヤー(第1のワイヤー)
3B ワイヤー(第2のワイヤー)
4A 半導体素子
4B 半導体素子
5 ボンディングパッド
6 ベース部
7 環状形状部
8 スタッドバンプ
9 ポリィミド
10 封止樹脂体
11 ダイパッド
12A 接着剤
12B 接着剤
13 インナーリード
14 アウターリード
15 リードフレーム
16 ステージ
17 ディスペンサ
18A コレット
18B コレット
19 ヒートステージ
20 リードフレーム重合体
21 上型
22 下型
25 ポット
26 プランジャー
30 逃がし部
Claims (5)
- スタッドバンプの形成方法であって、
キャピラリーから導出されたスタッドバンプ用ワイヤーの先端に、溶融後、再結晶化された球状の膨頭部を形成する工程、
前記膨頭部を前記キャピラリーの先端部で半導体素子上に形成されたボンディングパッドに押し当てて押しつぶすことで、前記膨頭部と前記ボンディングパッドを圧着し、押しつぶされた前記膨頭部によりスタッドバンプのベース部を形成する工程、
前記キャピラリーを前記ベース部へのリード電極からのワイヤーの進入側上方でループ状に動かして、前記ベース部から延びるスタッドバンプ用ワイヤーを前記ベース部に向かって折り返すことで、前記スタッドバンプ用ワイヤーで環状形状部を形成する工程、
前記折り返された前記スタッドバンプ用ワイヤーを、前記スタッドバンプの中心よりずらした位置で前記キャピラリーの先端部を前記ベース部に押し当てて圧着する工程、
前記圧着部からさらに延びる前記スタッドバンプ用ワイヤーを切断する工程、
とからなり、
ベース部を形成した後における前記キャピラリーのループ状の動きが、前記スタッドバンプの中心位置で垂直上方に移動し、水平移動後、ループ状に動き、更に、水平移動後、垂直下方に移動し、続けて垂直上方に移動した後、水平移動し、垂直下方に移動することを特徴とするスタッドバンプの形成方法。 - 請求項1に記載のスタッドバンプの形成方法において、
前記環状形状部が、前記リード電極からのワイヤーの進入方向側に形成されることを特徴とするスタッドバンプの形成方法。 - 請求項1に記載のスタッドバンプの形成方法において、
前記環状形状部が、前記リード電極からのワイヤーの進入方向と逆方向側に形成されることを特徴とするスタッドバンプの形成方法。 - 請求項1に記載のスタッドバンプの形成方法において、
前記スタッドバンプの高さがワイヤー径の2〜3倍に形成されることを特徴とするスタッドバンプの形成方法。 - スタッドバンプを含む半導体装置の製造方法であって、
半導体素子のボンディングパッド上に、請求項1に記載のスタッドバンプの形成方法で、ベース部と前記ベース部上の環状形状部とからなるスタッドバンプを形成する工程、
前記スタッドバンプに、他の前記ボンディングパッドからのワイヤーと、リード電極からのワイヤーとを圧着して、電気的接合を行う工程、
樹脂により少なくとも前記半導体素子および前記電気的接合部を覆うとともに、前記リード電極の他端が導出するよう樹脂部を形成する工程、
とからなることを特徴とするスタッドバンプを含む半導体装置の製造方法。
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