JP4326805B2 - 光結合素子構造の形成方法 - Google Patents
光結合素子構造の形成方法 Download PDFInfo
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- JP4326805B2 JP4326805B2 JP2002588642A JP2002588642A JP4326805B2 JP 4326805 B2 JP4326805 B2 JP 4326805B2 JP 2002588642 A JP2002588642 A JP 2002588642A JP 2002588642 A JP2002588642 A JP 2002588642A JP 4326805 B2 JP4326805 B2 JP 4326805B2
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- JP
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- Prior art keywords
- diffraction grating
- refractive index
- photoresist
- silicon
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 40
- 230000003287 optical effect Effects 0.000 title claims description 16
- 230000008878 coupling Effects 0.000 title claims description 14
- 238000010168 coupling process Methods 0.000 title claims description 14
- 238000005859 coupling reaction Methods 0.000 title claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 41
- 239000010703 silicon Substances 0.000 claims description 41
- 229920002120 photoresistant polymer Polymers 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 34
- 150000004767 nitrides Chemical class 0.000 claims description 28
- 238000005530 etching Methods 0.000 claims description 14
- 239000000969 carrier Substances 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 3
- 238000001312 dry etching Methods 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 39
- 239000004065 semiconductor Substances 0.000 description 21
- 239000012212 insulator Substances 0.000 description 17
- 230000008569 process Effects 0.000 description 13
- 230000008901 benefit Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/34—Optical coupling means utilising prism or grating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
れる。
別の形態では、88,90などの角錐に反転され得、実質的にシリコンにより形成される。検波器124は図2乃至7に示すようなものである。
って、明細書と図は説明上のもので制約的なものでない、またこれら全ての変更は本発明の範囲に内包されるものである。
Claims (19)
- 半球形状に形成された複数の回折格子フィーチャを有する光結合素子構造を形成する方法であって、前記各回折格子フィーチャは所定の周期性を有して配置される光結合素子構造の形成方法において、
第一屈折率を有する第一物質を提供する工程と、
前記第一物質上に第二物質を提供する工程であって、前記第二物質は第二屈折率を有し、かつ前記第二屈折率は前記第一屈折率より大きい工程と、
前記第二物質内にドープされた領域を提供する工程と、
前記第二物質上に第三屈折率を有する第三物質を提供する工程と、
前記第三物質上にフォトレジスト層を成膜する工程と、
フォトレジストのパターンを残すために、前記フォトレジスト層の第一部分を除去して同フォトレジスト層をパターニングする工程と、
前記フォトレジストのパターンに従って前記第三物質をエッチングすることにより、前記第三物質からなる複数の回折格子フィーチャが半球形状に、かつ所定の周期性を有して配置されるように形成される工程と、
前記フォトレジストを除去する工程と、
キャリアを生成すべく、前記第二物質内部に光を結合するために、前記第二物質及び前記第三物質の少なくとも一部を露光する工程と、
キャリアを集める工程と
を備える方法。 - 前記第二物質及び前記第三物質は、同一の物質である請求項1に記載の方法。
- 前記第一物質は、酸化層である請求項1に記載の方法。
- 前記第二物質は、シリコンを含む請求項1に記載の方法。
- 前記第二物質は、さらにゲルマニウムを含む請求項4に記載の方法。
- 前記第三物質は、シリコンを含む請求項1に記載の方法。
- 前記第三物質は、さらに窒化物を含む請求項6に記載の方法。
- 前記第三物質は、さらにシリコン酸化物を含む請求項6に記載の方法。
- 前記第三物質のエッチングは、KOHを使用して行われる請求項1に記載の方法。
- KOHを使用して前記第三物質がエッチングされる際に、前記第三物質の表面を粗面化する工程、及びフォトレジスト層のパターンを除去する工程をさらに含む請求項9に記載の方法。
- 前記第三物質の表面の粗面化は、前記第三物質をドライエッチングすることにより実行される請求項10に記載の方法。
- 前記第三物質のエッチングは、ドライエッチングにより実行される請求項1に記載の方法。
- 前記第二物質内にコレクタ領域を形成する工程をさらに含む請求項1に記載の方法。
- 前記第二物質上において、複数のフィーチャを相互にほぼ等距離になるように形成する請求項1に記載の方法。
- 前記第三物質のエッチングは、前記第三物質を該第三物質の表面に平行な面に沿った第一方向及び第二方向にエッチングする工程をさらに含み、前記第一方向は前記第二方向と直交する請求項1に記載の方法。
- 前記第一方向は、前記第二方向よりも緩慢にエッチングされる請求項1に記載の方法。
- 前記フォトレジスト層の第二部分を除去する工程をさらに含む請求項1に記載の方法。
- 前記第三屈折率が、前記第二屈折率である請求項1に記載の方法。
- 前記光は、ほぼ850ナノメータの波長を有する請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/846,087 US6594422B2 (en) | 2001-05-02 | 2001-05-02 | Opto-coupling device structure and method therefor |
PCT/US2002/011169 WO2002091486A1 (en) | 2001-05-02 | 2002-03-27 | An opto-coupling device structure and method therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004535667A JP2004535667A (ja) | 2004-11-25 |
JP4326805B2 true JP4326805B2 (ja) | 2009-09-09 |
Family
ID=25296902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002588642A Expired - Fee Related JP4326805B2 (ja) | 2001-05-02 | 2002-03-27 | 光結合素子構造の形成方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6594422B2 (ja) |
JP (1) | JP4326805B2 (ja) |
KR (2) | KR100926243B1 (ja) |
CN (1) | CN1286189C (ja) |
TW (1) | TW554545B (ja) |
WO (1) | WO2002091486A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7965901B2 (en) * | 2003-10-31 | 2011-06-21 | Hewlett-Packard Development Company, L.P. | Hard imaging methods and devices and optical scanning systems |
US7964925B2 (en) * | 2006-10-13 | 2011-06-21 | Hewlett-Packard Development Company, L.P. | Photodiode module and apparatus including multiple photodiode modules |
CN1295522C (zh) * | 2003-12-19 | 2007-01-17 | 上海交通大学 | 光学三维测量用高精密组合光栅器件 |
US7109051B2 (en) * | 2004-11-15 | 2006-09-19 | Freescale Semiconductor, Inc. | Method of integrating optical devices and electronic devices on an integrated circuit |
US7309628B2 (en) * | 2004-11-15 | 2007-12-18 | Omar Zia | Method of forming a semiconductor device |
US7169654B2 (en) * | 2004-11-15 | 2007-01-30 | Freescale Semiconductor, Inc. | Method of forming a semiconductor device |
US7067342B2 (en) * | 2004-11-15 | 2006-06-27 | Freescale Semiconductor, Inc. | Method of integrating optical devices and electronic devices on an integrated circuit |
US7098090B2 (en) * | 2004-11-15 | 2006-08-29 | Freescale Semiconductor, Inc. | Method of forming a semiconductor device |
US7896891B2 (en) * | 2005-05-20 | 2011-03-01 | Neotract, Inc. | Apparatus and method for manipulating or retracting tissue and anatomical structure |
US7523547B2 (en) | 2005-08-31 | 2009-04-28 | International Business Machines Corporation | Method for attaching a flexible structure to a device and a device having a flexible structure |
US7821091B2 (en) * | 2007-11-29 | 2010-10-26 | International Business Machines Corporation | Photo detector |
US7692135B2 (en) * | 2008-04-30 | 2010-04-06 | Hewlett-Packard Development Company, L.P. | WDM signal detector |
CN102776566A (zh) * | 2011-05-11 | 2012-11-14 | 深圳光启高等理工研究院 | 基于多晶硅的超材料制备方法和基于多晶硅的超材料 |
CN102800971B (zh) * | 2011-06-01 | 2014-11-26 | 深圳光启高等理工研究院 | 基于半导体的超材料制备方法和基于半导体的超材料 |
WO2016196883A1 (en) * | 2015-06-03 | 2016-12-08 | Luna Innovations, Inc. | Photoresistor on silicon-on-insulator substrate and photodetectors incorporating same |
CN111668338B (zh) * | 2019-03-06 | 2023-09-22 | 苏州旭创科技有限公司 | 一种光栅式的面入射型光探测器 |
US11367803B2 (en) * | 2020-04-01 | 2022-06-21 | Taiwan Semiconductor Manufacturing Company Ltd. | Light detecting device, optical device and method of manufacturing the same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4006432A (en) | 1974-10-15 | 1977-02-01 | Xerox Corporation | Integrated grating output coupler in diode lasers |
US3982810A (en) | 1975-07-09 | 1976-09-28 | The United States Of America As Represented By The Secretary Of The Navy | Directional radiation by asymmetrical dielectric gratings |
DE3447357A1 (de) * | 1984-12-24 | 1986-07-03 | Basf Ag, 6700 Ludwigshafen | Trockenfilmresist und verfahren zur herstellung von resistmustern |
DE69026850T2 (de) | 1989-02-17 | 1996-10-10 | Sharp Kk | Gitterkoppler |
US5026148A (en) | 1989-12-26 | 1991-06-25 | Hughes Aircraft Company | High efficiency multiple quantum well structure and operating method |
US5056889A (en) * | 1989-12-29 | 1991-10-15 | At&T Bell Laboratories | Optical device including a grating |
JP2689178B2 (ja) | 1990-06-06 | 1997-12-10 | 富士写真フイルム株式会社 | 光導波路素子 |
GB2248964A (en) | 1990-10-17 | 1992-04-22 | Philips Electronic Associated | Plural-wavelength infrared detector devices |
DE488868T1 (de) | 1990-11-30 | 1994-02-03 | Rhone Poulenc Chimie | Gerüststoff auf Basis von Alkalimetallsilikaten für Reinigungsmittelzusammensetzungen. |
JPH0643312A (ja) * | 1992-07-24 | 1994-02-18 | Mitsubishi Electric Corp | 回折格子の製造方法 |
JPH0694939A (ja) | 1992-09-09 | 1994-04-08 | Fuji Photo Film Co Ltd | 光導波路素子 |
JPH07240534A (ja) | 1993-03-16 | 1995-09-12 | Seiko Instr Inc | 光電変換半導体装置及びその製造方法 |
US5657407A (en) | 1995-06-07 | 1997-08-12 | Biota Corp. | Optical waveguide coupling device having a parallelogramic grating profile |
GB9524862D0 (en) | 1995-12-06 | 1996-02-07 | The Technology Partnership Plc | Colour diffractive structure |
US6087707A (en) * | 1996-04-16 | 2000-07-11 | Micron Technology, Inc. | Structure for an antifuse cell |
EP0993053A1 (en) * | 1998-10-09 | 2000-04-12 | STMicroelectronics S.r.l. | Infrared detector integrated with a waveguide and method of manufacturing |
-
2001
- 2001-05-02 US US09/846,087 patent/US6594422B2/en not_active Expired - Fee Related
-
2002
- 2002-03-27 KR KR1020037014315A patent/KR100926243B1/ko not_active IP Right Cessation
- 2002-03-27 WO PCT/US2002/011169 patent/WO2002091486A1/en active Application Filing
- 2002-03-27 CN CNB02809266XA patent/CN1286189C/zh not_active Expired - Fee Related
- 2002-03-27 KR KR1020097010709A patent/KR100926249B1/ko not_active IP Right Cessation
- 2002-03-27 JP JP2002588642A patent/JP4326805B2/ja not_active Expired - Fee Related
- 2002-04-04 TW TW091106847A patent/TW554545B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20090068383A (ko) | 2009-06-26 |
TW554545B (en) | 2003-09-21 |
CN1505842A (zh) | 2004-06-16 |
KR100926243B1 (ko) | 2009-11-12 |
US6594422B2 (en) | 2003-07-15 |
US20020164122A1 (en) | 2002-11-07 |
KR100926249B1 (ko) | 2009-11-12 |
CN1286189C (zh) | 2006-11-22 |
KR20030092125A (ko) | 2003-12-03 |
WO2002091486A1 (en) | 2002-11-14 |
JP2004535667A (ja) | 2004-11-25 |
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