JP4309752B2 - フォトマスク検査方法、フォトマスク検査装置及びフォトマスク製造方法 - Google Patents

フォトマスク検査方法、フォトマスク検査装置及びフォトマスク製造方法 Download PDF

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Publication number
JP4309752B2
JP4309752B2 JP2003409608A JP2003409608A JP4309752B2 JP 4309752 B2 JP4309752 B2 JP 4309752B2 JP 2003409608 A JP2003409608 A JP 2003409608A JP 2003409608 A JP2003409608 A JP 2003409608A JP 4309752 B2 JP4309752 B2 JP 4309752B2
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Japan
Prior art keywords
photomask
laser beam
image
inspection method
defect
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Expired - Fee Related
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JP2003409608A
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Japanese (ja)
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JP2004110072A5 (enExample
JP2004110072A (ja
Inventor
勝樹 大橋
広 井上
明 小野
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Toshiba Corp
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Toshiba Corp
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Publication of JP2004110072A5 publication Critical patent/JP2004110072A5/ja
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  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2003409608A 1997-06-27 2003-12-08 フォトマスク検査方法、フォトマスク検査装置及びフォトマスク製造方法 Expired - Fee Related JP4309752B2 (ja)

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JP2003409608A JP4309752B2 (ja) 1997-06-27 2003-12-08 フォトマスク検査方法、フォトマスク検査装置及びフォトマスク製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17169597 1997-06-27
JP2003409608A JP4309752B2 (ja) 1997-06-27 2003-12-08 フォトマスク検査方法、フォトマスク検査装置及びフォトマスク製造方法

Related Parent Applications (1)

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JP17830098A Division JPH1172905A (ja) 1997-06-27 1998-06-25 フォトマスク修復方法、検査方法、検査装置及びフォトマスク製造方法

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JP2004110072A JP2004110072A (ja) 2004-04-08
JP2004110072A5 JP2004110072A5 (enExample) 2005-09-22
JP4309752B2 true JP4309752B2 (ja) 2009-08-05

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JP2003409608A Expired - Fee Related JP4309752B2 (ja) 1997-06-27 2003-12-08 フォトマスク検査方法、フォトマスク検査装置及びフォトマスク製造方法

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4309751B2 (ja) * 1997-06-27 2009-08-05 株式会社東芝 フォトマスク修復方法
US6849363B2 (en) 1997-06-27 2005-02-01 Kabushiki Kaisha Toshiba Method for repairing a photomask, method for inspecting a photomask, method for manufacturing a photomask, and method for manufacturing a semiconductor device
KR101652133B1 (ko) * 2008-09-29 2016-08-29 케이엘에이-텐코어 코오포레이션 계측 시스템의 조명 서브시스템들, 계측 시스템들 및 계측 측정들을 위한 표본을 조명하기 위한 방법들
US9080991B2 (en) 2008-09-29 2015-07-14 Kla-Tencor Corp. Illuminating a specimen for metrology or inspection
WO2010096062A1 (en) * 2009-02-23 2010-08-26 Dimensional Photonics International, Inc. Apparatus and method for high-speed phase shifting for interferometric measurement systems
US10234402B2 (en) * 2017-01-05 2019-03-19 Kla-Tencor Corporation Systems and methods for defect material classification
CN110673319B (zh) * 2019-09-29 2021-04-09 江苏才道精密仪器有限公司 一种可自动调光源的显微镜激光修复系统及装置
CN112254801B (zh) * 2020-12-21 2021-04-02 浙江中自庆安新能源技术有限公司 一种微小振动视觉测量方法及系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173322A (ja) * 1987-01-13 1988-07-16 Toshiba Corp 半導体露光装置
JPH01114035A (ja) * 1987-10-28 1989-05-02 Hitachi Ltd 露光装置
DE69208413T2 (de) * 1991-08-22 1996-11-14 Kla Instr Corp Gerät zur automatischen Prüfung von Photomaske
US5668887A (en) * 1992-05-29 1997-09-16 Eastman Kodak Company Coating density analyzer and method using non-synchronous TDI camera
JP4309751B2 (ja) * 1997-06-27 2009-08-05 株式会社東芝 フォトマスク修復方法

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