JP4309263B2 - 半導体ツールインターフェースのフレーム - Google Patents

半導体ツールインターフェースのフレーム Download PDF

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Publication number
JP4309263B2
JP4309263B2 JP2003522990A JP2003522990A JP4309263B2 JP 4309263 B2 JP4309263 B2 JP 4309263B2 JP 2003522990 A JP2003522990 A JP 2003522990A JP 2003522990 A JP2003522990 A JP 2003522990A JP 4309263 B2 JP4309263 B2 JP 4309263B2
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JP
Japan
Prior art keywords
wafer
efem
foup
door
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2003522990A
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English (en)
Japanese (ja)
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JP2005525688A (ja
JP2005525688A5 (https=
Inventor
アンソニー シー ボノラ
リチャード エイチ ゴールド
ロジャー ジー ハイン
マイケル クロラック
ジェリー スピースル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asyst Technologies Inc
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Asyst Technologies Inc
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Publication date
Application filed by Asyst Technologies Inc filed Critical Asyst Technologies Inc
Publication of JP2005525688A publication Critical patent/JP2005525688A/ja
Publication of JP2005525688A5 publication Critical patent/JP2005525688A5/ja
Application granted granted Critical
Publication of JP4309263B2 publication Critical patent/JP4309263B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
JP2003522990A 2001-08-31 2002-08-30 半導体ツールインターフェースのフレーム Expired - Lifetime JP4309263B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US10/087,638 US7100340B2 (en) 2001-08-31 2002-03-01 Unified frame for semiconductor material handling system
PCT/US2002/030297 WO2003019630A2 (en) 2001-08-31 2002-08-30 Unified frame for semiconductor material handling system

Publications (3)

Publication Number Publication Date
JP2005525688A JP2005525688A (ja) 2005-08-25
JP2005525688A5 JP2005525688A5 (https=) 2006-02-02
JP4309263B2 true JP4309263B2 (ja) 2009-08-05

Family

ID=26777219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003522990A Expired - Lifetime JP4309263B2 (ja) 2001-08-31 2002-08-30 半導体ツールインターフェースのフレーム

Country Status (6)

Country Link
US (2) US7100340B2 (https=)
JP (1) JP4309263B2 (https=)
KR (1) KR100809107B1 (https=)
CN (1) CN100359634C (https=)
DE (1) DE10297170T5 (https=)
WO (1) WO2003019630A2 (https=)

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US7607879B2 (en) * 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module
US7578650B2 (en) * 2004-07-29 2009-08-25 Kla-Tencor Technologies Corporation Quick swap load port
US7375490B2 (en) * 2004-09-14 2008-05-20 Siemens Energy & Automation, Inc. Methods for managing electrical power
US7622884B2 (en) * 2004-09-14 2009-11-24 Siemens Industry, Inc. Methods for managing electrical power
JP4579723B2 (ja) * 2005-03-07 2010-11-10 川崎重工業株式会社 搬送系ユニットおよび分割体
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7637708B2 (en) * 2006-01-09 2009-12-29 Sumco Corporation Production system for wafer
KR100832772B1 (ko) * 2006-05-22 2008-05-27 주식회사 나온테크 반도체이송장비
JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
US8021513B2 (en) * 2006-08-23 2011-09-20 Tokyo Electron Limited Substrate carrying apparatus and substrate carrying method
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US7934898B2 (en) * 2007-07-16 2011-05-03 Semitool, Inc. High throughput semiconductor wafer processing
WO2009014647A1 (en) * 2007-07-20 2009-01-29 Applied Materials, Inc. Dual-mode robot systems and methods for electronic device manufacturing
JP5185853B2 (ja) * 2009-02-16 2013-04-17 アテル株式会社 基板搬送装置
JP5603030B2 (ja) * 2009-06-23 2014-10-08 Ｄｍｇ森精機株式会社 加工機械の温度制御装置
JP5445015B2 (ja) 2009-10-14 2014-03-19 シンフォニアテクノロジー株式会社 キャリア移載促進装置
JP5952526B2 (ja) * 2011-02-04 2016-07-13 株式会社ダイヘン ワーク搬送システム
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
CN103824794B (zh) * 2014-03-07 2016-09-28 上海华虹宏力半导体制造有限公司 用于控制smif和机台的控制装置、运输装置
KR101593386B1 (ko) 2014-09-01 2016-02-15 로체 시스템즈(주) 퍼지 모듈 및 이를 포함하는 로드 포트
EP3016136B1 (en) * 2014-10-27 2021-07-21 Robert Bosch GmbH Transport system with magnetically driven transport elements and according transportation method
US10177020B2 (en) 2015-02-07 2019-01-08 Kla-Tencor Corporation System and method for high throughput work-in-process buffer
KR101852323B1 (ko) * 2016-07-05 2018-04-26 로체 시스템즈(주) 퍼지 모듈 지그 및 이를 포함한 퍼지 모듈
US10541165B2 (en) 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
CN109065470B (zh) * 2018-06-20 2024-03-19 常州瑞赛环保科技有限公司 光伏板研磨分离装置
US10784136B2 (en) 2018-07-27 2020-09-22 Onto Innovation Inc. FOUP purge shield
US10533852B1 (en) * 2018-09-27 2020-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Leveling sensor, load port including the same, and method of leveling a load port
CN109212703B (zh) * 2018-11-06 2023-04-18 中国工程物理研究院激光聚变研究中心 用于光学元件离线精密装校的自洁净型自动化夹具库
US11527425B2 (en) * 2019-12-31 2022-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for tray cassette warehousing
TWI705516B (zh) * 2020-01-22 2020-09-21 迅得機械股份有限公司 晶圓盒移載裝置
CN114242632A (zh) * 2020-06-28 2022-03-25 上海果纳半导体技术有限公司 半导体设备的载入装置以及半导体设备
US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
JP7817523B2 (ja) * 2021-12-02 2026-02-19 株式会社東京精密 筐体及びプローバ

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Also Published As

Publication number Publication date
DE10297170T5 (de) 2004-07-29
WO2003019630A3 (en) 2003-11-20
KR20040048402A (ko) 2004-06-09
US20030044268A1 (en) 2003-03-06
JP2005525688A (ja) 2005-08-25
CN1561537A (zh) 2005-01-05
KR100809107B1 (ko) 2008-03-04
US20060177289A1 (en) 2006-08-10
CN100359634C (zh) 2008-01-02
WO2003019630A2 (en) 2003-03-06
US7100340B2 (en) 2006-09-05

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