CN100359634C - 用于半导体材料处理系统的一体化机架 - Google Patents

用于半导体材料处理系统的一体化机架 Download PDF

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Publication number
CN100359634C
CN100359634C CNB028193776A CN02819377A CN100359634C CN 100359634 C CN100359634 C CN 100359634C CN B028193776 A CNB028193776 A CN B028193776A CN 02819377 A CN02819377 A CN 02819377A CN 100359634 C CN100359634 C CN 100359634C
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CN
China
Prior art keywords
wafer
efem
transputer
foup
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028193776A
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English (en)
Chinese (zh)
Other versions
CN1561537A (zh
Inventor
安东尼·C·博诺拉
理查德·H·古尔德
罗杰·G·海纳
迈克尔·克罗拉克
杰里·斯皮斯尔
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Azenta Inc
Original Assignee
Asyst Technologies Inc
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Filing date
Publication date
Application filed by Asyst Technologies Inc filed Critical Asyst Technologies Inc
Publication of CN1561537A publication Critical patent/CN1561537A/zh
Application granted granted Critical
Publication of CN100359634C publication Critical patent/CN100359634C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
CNB028193776A 2001-08-31 2002-08-30 用于半导体材料处理系统的一体化机架 Expired - Lifetime CN100359634C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US60/316,722 2001-08-31
US10/087,638 2002-03-01
US10/087,638 US7100340B2 (en) 2001-08-31 2002-03-01 Unified frame for semiconductor material handling system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNA2007100079333A Division CN1996553A (zh) 2001-08-31 2002-08-30 用于半导体材料处理系统的一体化机架

Publications (2)

Publication Number Publication Date
CN1561537A CN1561537A (zh) 2005-01-05
CN100359634C true CN100359634C (zh) 2008-01-02

Family

ID=26777219

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028193776A Expired - Lifetime CN100359634C (zh) 2001-08-31 2002-08-30 用于半导体材料处理系统的一体化机架

Country Status (6)

Country Link
US (2) US7100340B2 (https=)
JP (1) JP4309263B2 (https=)
KR (1) KR100809107B1 (https=)
CN (1) CN100359634C (https=)
DE (1) DE10297170T5 (https=)
WO (1) WO2003019630A2 (https=)

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US7637708B2 (en) * 2006-01-09 2009-12-29 Sumco Corporation Production system for wafer
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JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
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JP5185853B2 (ja) * 2009-02-16 2013-04-17 アテル株式会社 基板搬送装置
JP5603030B2 (ja) * 2009-06-23 2014-10-08 Ｄｍｇ森精機株式会社 加工機械の温度制御装置
JP5445015B2 (ja) 2009-10-14 2014-03-19 シンフォニアテクノロジー株式会社 キャリア移載促進装置
JP5952526B2 (ja) * 2011-02-04 2016-07-13 株式会社ダイヘン ワーク搬送システム
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
CN103824794B (zh) * 2014-03-07 2016-09-28 上海华虹宏力半导体制造有限公司 用于控制smif和机台的控制装置、运输装置
KR101593386B1 (ko) 2014-09-01 2016-02-15 로체 시스템즈(주) 퍼지 모듈 및 이를 포함하는 로드 포트
EP3016136B1 (en) * 2014-10-27 2021-07-21 Robert Bosch GmbH Transport system with magnetically driven transport elements and according transportation method
US10177020B2 (en) 2015-02-07 2019-01-08 Kla-Tencor Corporation System and method for high throughput work-in-process buffer
KR101852323B1 (ko) * 2016-07-05 2018-04-26 로체 시스템즈(주) 퍼지 모듈 지그 및 이를 포함한 퍼지 모듈
US10541165B2 (en) 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
CN109065470B (zh) * 2018-06-20 2024-03-19 常州瑞赛环保科技有限公司 光伏板研磨分离装置
US10784136B2 (en) 2018-07-27 2020-09-22 Onto Innovation Inc. FOUP purge shield
US10533852B1 (en) * 2018-09-27 2020-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Leveling sensor, load port including the same, and method of leveling a load port
CN109212703B (zh) * 2018-11-06 2023-04-18 中国工程物理研究院激光聚变研究中心 用于光学元件离线精密装校的自洁净型自动化夹具库
US11527425B2 (en) * 2019-12-31 2022-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for tray cassette warehousing
TWI705516B (zh) * 2020-01-22 2020-09-21 迅得機械股份有限公司 晶圓盒移載裝置
CN114242632A (zh) * 2020-06-28 2022-03-25 上海果纳半导体技术有限公司 半导体设备的载入装置以及半导体设备
US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
JP7817523B2 (ja) * 2021-12-02 2026-02-19 株式会社東京精密 筐体及びプローバ

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US6013920A (en) * 1997-11-28 2000-01-11 Fortrend Engineering Coirporation Wafer-mapping load post interface having an effector position sensing device
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US6281516B1 (en) * 1998-07-13 2001-08-28 Newport Corporation FIMS transport box load interface

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Also Published As

Publication number Publication date
DE10297170T5 (de) 2004-07-29
WO2003019630A3 (en) 2003-11-20
KR20040048402A (ko) 2004-06-09
US20030044268A1 (en) 2003-03-06
JP2005525688A (ja) 2005-08-25
CN1561537A (zh) 2005-01-05
KR100809107B1 (ko) 2008-03-04
US20060177289A1 (en) 2006-08-10
JP4309263B2 (ja) 2009-08-05
WO2003019630A2 (en) 2003-03-06
US7100340B2 (en) 2006-09-05

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CROSSIN AUTOMATION CORPORATION

Free format text: FORMER OWNER: ASYST TECHNOLOGIES INC.

Effective date: 20120201

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20120201

Address after: American California

Patentee after: Crossing Automation, Inc.

Address before: American California

Patentee before: ASYST TECHNOLOGIES, Inc.

CX01 Expiry of patent term

Granted publication date: 20080102

CX01 Expiry of patent term