JP4305707B2 - 基板の製造方法および半導体装置の製造方法 - Google Patents

基板の製造方法および半導体装置の製造方法 Download PDF

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JP4305707B2
JP4305707B2 JP2000196861A JP2000196861A JP4305707B2 JP 4305707 B2 JP4305707 B2 JP 4305707B2 JP 2000196861 A JP2000196861 A JP 2000196861A JP 2000196861 A JP2000196861 A JP 2000196861A JP 4305707 B2 JP4305707 B2 JP 4305707B2
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substrate
ridge portion
manufacturing
mask pattern
wet etching
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JP2001332530A5 (enExample
JP2001332530A (ja
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豪作 加藤
健博 谷口
展賢 岡野
康成 半澤
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Sony Corp
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Sony Corp
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  • Weting (AREA)
JP2000196861A 2000-03-14 2000-06-29 基板の製造方法および半導体装置の製造方法 Expired - Fee Related JP4305707B2 (ja)

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JP2000196861A JP4305707B2 (ja) 2000-03-14 2000-06-29 基板の製造方法および半導体装置の製造方法

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JP2000-70521 2000-03-14
JP2000070521 2000-03-14
JP2000196861A JP4305707B2 (ja) 2000-03-14 2000-06-29 基板の製造方法および半導体装置の製造方法

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JP2006308576A Division JP2007088503A (ja) 2000-03-14 2006-11-15 半導体発光素子

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JP2001332530A JP2001332530A (ja) 2001-11-30
JP2001332530A5 JP2001332530A5 (enExample) 2006-12-28
JP4305707B2 true JP4305707B2 (ja) 2009-07-29

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Publication number Priority date Publication date Assignee Title
US8138002B2 (en) 2008-08-21 2012-03-20 Sony Corporation Semiconductor light-emitting element, fabrication method thereof, convex part formed on backing, and convex part formation method for backing

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