JP4304354B2 - 半導体装置の処理方法 - Google Patents

半導体装置の処理方法 Download PDF

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Publication number
JP4304354B2
JP4304354B2 JP11329298A JP11329298A JP4304354B2 JP 4304354 B2 JP4304354 B2 JP 4304354B2 JP 11329298 A JP11329298 A JP 11329298A JP 11329298 A JP11329298 A JP 11329298A JP 4304354 B2 JP4304354 B2 JP 4304354B2
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Japan
Prior art keywords
gas
processing
gas discharge
discharge line
line
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Expired - Lifetime
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JP11329298A
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English (en)
Japanese (ja)
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JPH11307523A (ja
JPH11307523A5 (enExample
Inventor
誠 津里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP11329298A priority Critical patent/JP4304354B2/ja
Publication of JPH11307523A publication Critical patent/JPH11307523A/ja
Publication of JPH11307523A5 publication Critical patent/JPH11307523A5/ja
Application granted granted Critical
Publication of JP4304354B2 publication Critical patent/JP4304354B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP11329298A 1998-04-23 1998-04-23 半導体装置の処理方法 Expired - Lifetime JP4304354B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11329298A JP4304354B2 (ja) 1998-04-23 1998-04-23 半導体装置の処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11329298A JP4304354B2 (ja) 1998-04-23 1998-04-23 半導体装置の処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007010597A Division JP4342559B2 (ja) 2007-01-19 2007-01-19 基板処理装置及び半導体装置の形成方法

Publications (3)

Publication Number Publication Date
JPH11307523A JPH11307523A (ja) 1999-11-05
JPH11307523A5 JPH11307523A5 (enExample) 2005-10-13
JP4304354B2 true JP4304354B2 (ja) 2009-07-29

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ID=14608501

Family Applications (1)

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JP11329298A Expired - Lifetime JP4304354B2 (ja) 1998-04-23 1998-04-23 半導体装置の処理方法

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JP (1) JP4304354B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1013667C2 (nl) * 1999-11-25 2000-12-15 Asm Int Werkwijze en inrichting voor het vormen van een oxidelaag op wafers vervaardigd uit halfgeleidermateriaal.
JP4876322B2 (ja) * 2001-03-30 2012-02-15 東京エレクトロン株式会社 ロードロック室、その排気方法及び熱処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2670515B2 (ja) * 1988-08-26 1997-10-29 東京エレクトロン株式会社 縦型熱処理装置
JP2849255B2 (ja) * 1991-11-29 1999-01-20 東洋エンジニアリング株式会社 高性能半導体製造用の排気システムおよびその制御方法

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Publication number Publication date
JPH11307523A (ja) 1999-11-05

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