JP4301474B2 - 保護素子 - Google Patents
保護素子 Download PDFInfo
- Publication number
- JP4301474B2 JP4301474B2 JP29525599A JP29525599A JP4301474B2 JP 4301474 B2 JP4301474 B2 JP 4301474B2 JP 29525599 A JP29525599 A JP 29525599A JP 29525599 A JP29525599 A JP 29525599A JP 4301474 B2 JP4301474 B2 JP 4301474B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- fusible alloy
- insulating substrate
- insulating
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000001681 protective effect Effects 0.000 title claims description 46
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 80
- 239000000758 substrate Substances 0.000 claims description 62
- 230000004907 flux Effects 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 13
- 229910052744 lithium Inorganic materials 0.000 description 13
- 239000000155 melt Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29525599A JP4301474B2 (ja) | 1999-10-18 | 1999-10-18 | 保護素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29525599A JP4301474B2 (ja) | 1999-10-18 | 1999-10-18 | 保護素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001118481A JP2001118481A (ja) | 2001-04-27 |
| JP2001118481A5 JP2001118481A5 (enExample) | 2006-11-24 |
| JP4301474B2 true JP4301474B2 (ja) | 2009-07-22 |
Family
ID=17818231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29525599A Expired - Fee Related JP4301474B2 (ja) | 1999-10-18 | 1999-10-18 | 保護素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4301474B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004265618A (ja) * | 2003-02-05 | 2004-09-24 | Sony Chem Corp | 保護素子 |
| US9129769B2 (en) | 2009-09-04 | 2015-09-08 | Cyntec Co., Ltd. | Protective device |
| US9025295B2 (en) | 2009-09-04 | 2015-05-05 | Cyntec Co., Ltd. | Protective device and protective module |
| US8472158B2 (en) | 2009-09-04 | 2013-06-25 | Cyntec Co., Ltd. | Protective device |
| JP2012212689A (ja) * | 2012-07-23 | 2012-11-01 | Mitsubishi Electric Corp | 遮断機構を有する電力用半導体装置 |
-
1999
- 1999-10-18 JP JP29525599A patent/JP4301474B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001118481A (ja) | 2001-04-27 |
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