JP4287741B2 - 伝導性パターンを有する材料；ならびに伝導性パターンの形成のための材料及び方法 - Google Patents

伝導性パターンを有する材料；ならびに伝導性パターンの形成のための材料及び方法 Download PDF

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Publication number
JP4287741B2
JP4287741B2 JP2003507633A JP2003507633A JP4287741B2 JP 4287741 B2 JP4287741 B2 JP 4287741B2 JP 2003507633 A JP2003507633 A JP 2003507633A JP 2003507633 A JP2003507633 A JP 2003507633A JP 4287741 B2 JP4287741 B2 JP 4287741B2
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JP
Japan
Prior art keywords
conductive
group
conductive element
conductive pattern
substituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2003507633A
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English (en)
Japanese (ja)
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JP2004533519A (ja
JP2004533519A5 (OSRAM
Inventor
ラモツテ，ヨハン
テレル，ダビド
Original Assignee
アグフア−ゲヴエルト，ナームローゼ・フエンノートシヤツプ
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Publication date
Priority claimed from PCT/EP2001/007083 external-priority patent/WO2002006898A2/en
Priority claimed from US09/891,649 external-priority patent/US6638680B2/en
Application filed by アグフア−ゲヴエルト，ナームローゼ・フエンノートシヤツプ filed Critical アグフア−ゲヴエルト，ナームローゼ・フエンノートシヤツプ
Publication of JP2004533519A publication Critical patent/JP2004533519A/ja
Publication of JP2004533519A5 publication Critical patent/JP2004533519A5/ja
Application granted granted Critical
Publication of JP4287741B2 publication Critical patent/JP4287741B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/093—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antistatic means, e.g. for charge depletion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/0163—Non ionic diazonium compounds, e.g. diazosulphonates; Precursors thereof, e.g. triazenes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
JP2003507633A 2001-06-22 2002-06-18 伝導性パターンを有する材料；ならびに伝導性パターンの形成のための材料及び方法 Expired - Fee Related JP4287741B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
PCT/EP2001/007083 WO2002006898A2 (en) 2000-06-26 2001-06-22 Material and method for making an electroconductive pattern
US09/891,649 US6638680B2 (en) 2000-06-26 2001-06-26 Material and method for making an electroconductive pattern
EP01000731 2001-12-10
PCT/EP2002/006740 WO2003001299A1 (en) 2001-06-22 2002-06-18 Material having a conductive pattern; and a material and method for making a conductive pattern

Publications (3)

Publication Number Publication Date
JP2004533519A JP2004533519A (ja) 2004-11-04
JP2004533519A5 JP2004533519A5 (OSRAM) 2006-01-05
JP4287741B2 true JP4287741B2 (ja) 2009-07-01

Family

ID=39736484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003507633A Expired - Fee Related JP4287741B2 (ja) 2001-06-22 2002-06-18 伝導性パターンを有する材料；ならびに伝導性パターンの形成のための材料及び方法

Country Status (5)

Country Link
EP (1) EP1402319B1 (OSRAM)
JP (1) JP4287741B2 (OSRAM)
KR (1) KR100883215B1 (OSRAM)
DE (1) DE60228572D1 (OSRAM)
WO (1) WO2003001299A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101440859B1 (ko) * 2013-06-04 2014-09-17 에스케이씨 주식회사 전도성 고분자 필름용 전도성 저감제 및 이를 이용한 패턴 형성 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7223571B2 (en) 1998-04-02 2007-05-29 The Board Of Regents Of The Universtiy Of Oklahoma Targeted glycosaminoglycan polymers by polymer grafting and methods of making and using same
US20040260016A1 (en) 2003-06-20 2004-12-23 Agfa-Gevaert Process for preparing electroconductive coatings
JP2007508563A (ja) 2003-10-15 2007-04-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 装置、システム及び電気素子
JP4786206B2 (ja) * 2004-11-22 2011-10-05 信越ポリマー株式会社 帯電防止塗料、帯電防止膜及び帯電防止フィルム、光学フィルタ、光情報記録媒体
TWI325007B (en) 2004-10-08 2010-05-21 Shinetsu Polymer Co Conductive composition and production method thereof, antistatic coating material, antistatic coating, antistatic film, optical filter, and optical information recording medium, and capacitors and production method thereof
CN101681131A (zh) * 2007-06-12 2010-03-24 东亚合成株式会社 导电性高分子上的抗蚀剂膜的剥离剂、抗蚀剂膜的剥离方法及具有已图案化的导电性高分子的基板
JP5880444B2 (ja) 2010-12-13 2016-03-09 コニカミノルタ株式会社 透明面電極、有機エレクトロニクス素子及び透明面電極の製造方法
KR101812606B1 (ko) * 2011-04-26 2017-12-27 니폰 메크트론 가부시키가이샤 투명인쇄회로 제조방법 및 투명터치패널 제조방법
FR3108756B1 (fr) * 2020-03-30 2022-04-01 Commissariat Energie Atomique Capteur de motif thermique
CN120686540B (zh) * 2025-08-25 2025-10-28 合肥工业大学 水基显影可精密图案化的聚乙烯醇基透明复合导电材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE170109T1 (de) * 1992-09-30 1998-09-15 Dow Chemical Co Elektrostatische beschichtung von polymergegenständen und verfahren zur herstellung
US5370825A (en) * 1993-03-03 1994-12-06 International Business Machines Corporation Water-soluble electrically conducting polymers, their synthesis and use
DE19524132A1 (de) 1995-07-03 1997-01-09 Bayer Ag Kratzfeste leitfähige Beschichtungen
DE69715361T2 (de) * 1996-12-30 2003-04-30 Centre Nat Rech Scient Ionisch leitfähige Materialien, die Salze von perfluorierten Amiden enthalten, und ihre Verwendungen
DE69827239T2 (de) * 1997-07-25 2005-12-01 Acep Inc., Montreal Aus ionischen Perfluorvinylverbindungen gewonnene Membranen
DE19824186A1 (de) * 1998-05-29 1999-12-02 Bayer Ag Elektrochrome Anordnung auf Basis von Poly-(3,4-ethylendioxy-thiophen)-Derivaten und Gel-Elektrolyt mit UV-Schutz

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101440859B1 (ko) * 2013-06-04 2014-09-17 에스케이씨 주식회사 전도성 고분자 필름용 전도성 저감제 및 이를 이용한 패턴 형성 방법

Also Published As

Publication number Publication date
JP2004533519A (ja) 2004-11-04
KR20040030695A (ko) 2004-04-09
WO2003001299A1 (en) 2003-01-03
DE60228572D1 (de) 2008-10-09
EP1402319A1 (en) 2004-03-31
KR100883215B1 (ko) 2009-02-13
EP1402319B1 (en) 2008-08-27

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