JP4287589B2 - 装置、クランプ機構、アーム組立体及び方法 - Google Patents

装置、クランプ機構、アーム組立体及び方法 Download PDF

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Publication number
JP4287589B2
JP4287589B2 JP2000513311A JP2000513311A JP4287589B2 JP 4287589 B2 JP4287589 B2 JP 4287589B2 JP 2000513311 A JP2000513311 A JP 2000513311A JP 2000513311 A JP2000513311 A JP 2000513311A JP 4287589 B2 JP4287589 B2 JP 4287589B2
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JP
Japan
Prior art keywords
lever
workpiece
clamp
robot arm
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000513311A
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English (en)
Japanese (ja)
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JP2001517562A (ja
JP2001517562A5 (enExample
Inventor
ピーター， エフ． エビング，
サティシュ サンダー，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2001517562A5 publication Critical patent/JP2001517562A5/ja
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Publication of JP4287589B2 publication Critical patent/JP4287589B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2000513311A 1997-09-22 1998-08-19 装置、クランプ機構、アーム組立体及び方法 Expired - Fee Related JP4287589B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/935,293 US6155773A (en) 1997-09-22 1997-09-22 Substrate clamping apparatus
US08/935,293 1997-09-22
PCT/US1998/017234 WO1999016111A1 (en) 1997-09-22 1998-08-19 Substrate clamping apparatus

Publications (3)

Publication Number Publication Date
JP2001517562A JP2001517562A (ja) 2001-10-09
JP2001517562A5 JP2001517562A5 (enExample) 2008-03-06
JP4287589B2 true JP4287589B2 (ja) 2009-07-01

Family

ID=25466878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000513311A Expired - Fee Related JP4287589B2 (ja) 1997-09-22 1998-08-19 装置、クランプ機構、アーム組立体及び方法

Country Status (3)

Country Link
US (1) US6155773A (enExample)
JP (1) JP4287589B2 (enExample)
WO (1) WO1999016111A1 (enExample)

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US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
EP1041604B1 (en) * 1999-04-01 2007-05-02 Applied Materials, Inc. Pneumatically actuated flexure gripper for wafer handling robots
US6662673B1 (en) 1999-04-08 2003-12-16 Applied Materials, Inc. Linear motion apparatus and associated method
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6557237B1 (en) 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
WO2000066480A2 (en) * 1999-05-04 2000-11-09 Ade Corporation Edge gripping end effector wafer handling apparatus
TW543079B (en) * 1999-06-03 2003-07-21 Applied Materials Inc Robot blade for semiconductor processing equipment
JP4230642B2 (ja) * 1999-07-08 2009-02-25 株式会社荏原製作所 基板搬送治具及び基板搬送装置
US6513848B1 (en) 1999-09-17 2003-02-04 Applied Materials, Inc. Hydraulically actuated wafer clamp
US6430468B1 (en) * 2000-11-17 2002-08-06 Applied Materials, Inc. Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber
US6623235B2 (en) * 2001-04-11 2003-09-23 Pri Automation, Inc. Robot arm edge gripping device for handling substrates using two four-bar linkages
GB2380602B (en) * 2001-05-19 2005-03-02 Wentworth Lab Ltd Wafer alignment device
US6817640B2 (en) * 2001-06-28 2004-11-16 Applied Materials, Inc. Four-bar linkage wafer clamping mechanism
US7281741B2 (en) * 2001-07-13 2007-10-16 Semitool, Inc. End-effectors for handling microelectronic workpieces
US7140655B2 (en) * 2001-09-04 2006-11-28 Multimetrixs Llc Precision soft-touch gripping mechanism for flat objects
US6682113B2 (en) 2001-11-16 2004-01-27 Applied Materials, Inc. Wafer clamping mechanism
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
SG115602A1 (en) * 2003-01-09 2005-10-28 Disco Corp Conveying device for a plate-like workpiece
US7151981B2 (en) * 2003-02-20 2006-12-19 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
US7499767B2 (en) * 2003-02-20 2009-03-03 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
SG125948A1 (en) * 2003-03-31 2006-10-30 Asml Netherlands Bv Supporting structure for use in a lithographic apparatus
EP1465012A3 (en) * 2003-03-31 2004-12-22 ASML Netherlands B.V. Supporting structure for use in a lithographic apparatus
US7300082B2 (en) * 2003-07-21 2007-11-27 Asyst Technologies, Inc. Active edge gripping and effector
US7226269B2 (en) * 2004-01-15 2007-06-05 Applied Materials, Inc. Substrate edge grip apparatus
JP2005209954A (ja) * 2004-01-23 2005-08-04 Kawasaki Heavy Ind Ltd 基板保持装置
US7290813B2 (en) * 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US20060130767A1 (en) 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
CN1824592B (zh) * 2005-02-25 2012-02-29 细美事有限公司 晶片传送装置
US20060236941A1 (en) * 2005-04-20 2006-10-26 Applied Materials, Inc. Passive wafer support for particle free wafer acceleration
US7712808B2 (en) * 2005-09-29 2010-05-11 Brooks Automation, Inc. End effector with centering grip
US20080190364A1 (en) * 2007-02-13 2008-08-14 Applied Materials, Inc. Substrate support assembly
JP4871910B2 (ja) * 2007-05-16 2012-02-08 株式会社日立ハイテクノロジーズ ディスクチャック機構およびディスクハンドリングロボット
JP4959427B2 (ja) * 2007-06-05 2012-06-20 日本電産サンキョー株式会社 産業用ロボット
KR100949686B1 (ko) * 2007-11-14 2010-03-26 주식회사 테스 기판 이송 장치 및 이를 포함한 기판 처리 장치
CN101959643B (zh) * 2008-03-05 2013-04-17 平田机工株式会社 工件移送装置
KR101217337B1 (ko) * 2008-10-17 2012-12-31 가부시키가이샤 알박 반송 장치 및 진공 장치
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
TWI564988B (zh) 2011-06-03 2017-01-01 Ｔｅｌ Ｎｅｘｘ公司 平行且單一的基板處理系統
US9324598B2 (en) 2011-11-08 2016-04-26 Intevac, Inc. Substrate processing system and method
WO2014100506A1 (en) 2012-12-19 2014-06-26 Intevac, Inc. Grid for plasma ion implant
US9536764B2 (en) 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
US11075105B2 (en) * 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
US11020852B2 (en) 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
US10759062B2 (en) 2017-12-08 2020-09-01 Dishcraft Robotics, Inc. Article of dishware gripping systems
JP2024079167A (ja) * 2022-11-30 2024-06-11 東京エレクトロン株式会社 搬送システム、処理システムおよび搬送方法

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Also Published As

Publication number Publication date
JP2001517562A (ja) 2001-10-09
US6155773A (en) 2000-12-05
WO1999016111A1 (en) 1999-04-01

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