JP4281960B2 - 半田を用いた接合方法および接合装置 - Google Patents

半田を用いた接合方法および接合装置 Download PDF

Info

Publication number
JP4281960B2
JP4281960B2 JP2004236398A JP2004236398A JP4281960B2 JP 4281960 B2 JP4281960 B2 JP 4281960B2 JP 2004236398 A JP2004236398 A JP 2004236398A JP 2004236398 A JP2004236398 A JP 2004236398A JP 4281960 B2 JP4281960 B2 JP 4281960B2
Authority
JP
Japan
Prior art keywords
electrode
solder ball
solder
laser
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004236398A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005123581A (ja
JP2005123581A5 (https=
Inventor
修 進藤
亨 水野
哲 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAE Magnetics HK Ltd
Original Assignee
SAE Magnetics HK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAE Magnetics HK Ltd filed Critical SAE Magnetics HK Ltd
Priority to JP2004236398A priority Critical patent/JP4281960B2/ja
Publication of JP2005123581A publication Critical patent/JP2005123581A/ja
Publication of JP2005123581A5 publication Critical patent/JP2005123581A5/ja
Application granted granted Critical
Publication of JP4281960B2 publication Critical patent/JP4281960B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2004236398A 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置 Expired - Lifetime JP4281960B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004236398A JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003334729 2003-09-26
JP2004236398A JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Publications (3)

Publication Number Publication Date
JP2005123581A JP2005123581A (ja) 2005-05-12
JP2005123581A5 JP2005123581A5 (https=) 2006-08-17
JP4281960B2 true JP4281960B2 (ja) 2009-06-17

Family

ID=34622063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004236398A Expired - Lifetime JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Country Status (1)

Country Link
JP (1) JP4281960B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007118072A (ja) * 2005-10-31 2007-05-17 Shinka Jitsugyo Kk 半田付け方法及び装置
JP4982198B2 (ja) * 2007-01-30 2012-07-25 新科實業有限公司 半田ノズル及びこれを備えた半田付け装置
JP2008187056A (ja) * 2007-01-30 2008-08-14 Shinka Jitsugyo Kk 半田付け方法及び装置
DE102008017180B4 (de) * 2008-04-02 2020-07-02 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur Applikation eines elektronischen Bauelements
JP6400318B2 (ja) * 2014-03-28 2018-10-03 株式会社谷黒組 チップ部品及びその製造方法
CN110911331A (zh) * 2018-09-14 2020-03-24 东莞市中麒光电技术有限公司 一种转移并便于led芯片固定的吸嘴及单颗led芯片转移、固定于背板的方法
KR102561680B1 (ko) * 2021-08-10 2023-07-31 주식회사 코윈디에스티 라인 빔 레이저를 이용한 솔더 볼의 부착 방법 및 그 장치

Also Published As

Publication number Publication date
JP2005123581A (ja) 2005-05-12

Similar Documents

Publication Publication Date Title
CN1332779C (zh) 焊料接合方法和焊料接合装置
JP2005081406A (ja) 半田ボールの接合方法および接合装置
JPS59119844A (ja) 可撓性配線のレ−ザろう付方法
KR101576138B1 (ko) 유도가열 솔더링 장치
JP4281960B2 (ja) 半田を用いた接合方法および接合装置
TWI808356B (zh) 電子構件之移除方法以及其裝置
JP2008187056A (ja) 半田付け方法及び装置
CN1990148B (zh) 焊接方法及其装置
JP2007026478A (ja) 磁気ヘッドアッセンブリの金属ボール接合方法
US20060065642A1 (en) Bonding apparatus using conductive material
JP2006088192A (ja) 半田ボールの接合方法および接合装置
WO2017154242A1 (ja) 半田接合装置および半田接合方法
JP4206202B2 (ja) ２つの基板の端子領域を熱的に接続させる接続方法およびこの接続に使用する接触装置
CN100517469C (zh) 磁头组件的焊锡球结合方法
JPH06151035A (ja) 回路基板へのリード端子接合方法
JP2006156446A (ja) 半田付け方法及び装置
JP2005123581A5 (https=)
CN101670474A (zh) 磁头组件及其钎焊接合方法
CN113545174A (zh) 印刷布线板以及电子设备
JP4684784B2 (ja) 電極接合方法及びその装置
CA2240184A1 (en) Method and apparatus for attaching electronic components to substrates
JPH0951162A (ja) 電子部品搭載装置
JP2006221689A (ja) 磁気ヘッドアッセンブリの半田ボール接合方法
JPH05303982A (ja) ハンダ付き端子およびその製造方法、並びに端子用ハンダおよびその製造装置
JP3049976B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060704

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060704

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20071015

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20071015

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090205

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090311

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090312

R150 Certificate of patent or registration of utility model

Ref document number: 4281960

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120327

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120327

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130327

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130327

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140327

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term