JP2005123581A5 - - Google Patents

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Publication number
JP2005123581A5
JP2005123581A5 JP2004236398A JP2004236398A JP2005123581A5 JP 2005123581 A5 JP2005123581 A5 JP 2005123581A5 JP 2004236398 A JP2004236398 A JP 2004236398A JP 2004236398 A JP2004236398 A JP 2004236398A JP 2005123581 A5 JP2005123581 A5 JP 2005123581A5
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JP
Japan
Prior art keywords
electrode
path
sub
laser
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004236398A
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English (en)
Japanese (ja)
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JP4281960B2 (ja
JP2005123581A (ja
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Priority to JP2004236398A priority Critical patent/JP4281960B2/ja
Priority claimed from JP2004236398A external-priority patent/JP4281960B2/ja
Publication of JP2005123581A publication Critical patent/JP2005123581A/ja
Publication of JP2005123581A5 publication Critical patent/JP2005123581A5/ja
Application granted granted Critical
Publication of JP4281960B2 publication Critical patent/JP4281960B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004236398A 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置 Expired - Lifetime JP4281960B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004236398A JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003334729 2003-09-26
JP2004236398A JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Publications (3)

Publication Number Publication Date
JP2005123581A JP2005123581A (ja) 2005-05-12
JP2005123581A5 true JP2005123581A5 (https=) 2006-08-17
JP4281960B2 JP4281960B2 (ja) 2009-06-17

Family

ID=34622063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004236398A Expired - Lifetime JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Country Status (1)

Country Link
JP (1) JP4281960B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007118072A (ja) * 2005-10-31 2007-05-17 Shinka Jitsugyo Kk 半田付け方法及び装置
JP4982198B2 (ja) * 2007-01-30 2012-07-25 新科實業有限公司 半田ノズル及びこれを備えた半田付け装置
JP2008187056A (ja) * 2007-01-30 2008-08-14 Shinka Jitsugyo Kk 半田付け方法及び装置
DE102008017180B4 (de) * 2008-04-02 2020-07-02 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur Applikation eines elektronischen Bauelements
JP6400318B2 (ja) * 2014-03-28 2018-10-03 株式会社谷黒組 チップ部品及びその製造方法
CN110911331A (zh) * 2018-09-14 2020-03-24 东莞市中麒光电技术有限公司 一种转移并便于led芯片固定的吸嘴及单颗led芯片转移、固定于背板的方法
KR102561680B1 (ko) * 2021-08-10 2023-07-31 주식회사 코윈디에스티 라인 빔 레이저를 이용한 솔더 볼의 부착 방법 및 그 장치

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