JP4270667B2 - 回路部品の冷却装置および電子機器 - Google Patents

回路部品の冷却装置および電子機器 Download PDF

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Publication number
JP4270667B2
JP4270667B2 JP23070199A JP23070199A JP4270667B2 JP 4270667 B2 JP4270667 B2 JP 4270667B2 JP 23070199 A JP23070199 A JP 23070199A JP 23070199 A JP23070199 A JP 23070199A JP 4270667 B2 JP4270667 B2 JP 4270667B2
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JP
Japan
Prior art keywords
heat
receiving block
heat receiving
base
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23070199A
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English (en)
Japanese (ja)
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JP2001057490A (ja
JP2001057490A5 (enExample
Inventor
雄二 中島
守哉 宜保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23070199A priority Critical patent/JP4270667B2/ja
Publication of JP2001057490A publication Critical patent/JP2001057490A/ja
Publication of JP2001057490A5 publication Critical patent/JP2001057490A5/ja
Application granted granted Critical
Publication of JP4270667B2 publication Critical patent/JP4270667B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP23070199A 1999-08-17 1999-08-17 回路部品の冷却装置および電子機器 Expired - Lifetime JP4270667B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23070199A JP4270667B2 (ja) 1999-08-17 1999-08-17 回路部品の冷却装置および電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23070199A JP4270667B2 (ja) 1999-08-17 1999-08-17 回路部品の冷却装置および電子機器

Publications (3)

Publication Number Publication Date
JP2001057490A JP2001057490A (ja) 2001-02-27
JP2001057490A5 JP2001057490A5 (enExample) 2006-08-17
JP4270667B2 true JP4270667B2 (ja) 2009-06-03

Family

ID=16911973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23070199A Expired - Lifetime JP4270667B2 (ja) 1999-08-17 1999-08-17 回路部品の冷却装置および電子機器

Country Status (1)

Country Link
JP (1) JP4270667B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005107122A (ja) 2003-09-30 2005-04-21 Toshiba Corp 電子機器
JP4387777B2 (ja) 2003-11-28 2009-12-24 株式会社東芝 電子機器
JP2005317797A (ja) 2004-04-28 2005-11-10 Toshiba Corp ポンプ、電子機器および冷却装置
JP2005315156A (ja) 2004-04-28 2005-11-10 Toshiba Corp ポンプおよびポンプを備える電子機器
JP4234635B2 (ja) 2004-04-28 2009-03-04 株式会社東芝 電子機器
JP4343032B2 (ja) 2004-05-31 2009-10-14 株式会社東芝 冷却構造および投射型画像表示装置
JP4910922B2 (ja) * 2007-07-18 2012-04-04 株式会社デンソー 電子装置およびその製造方法
JP4908610B2 (ja) 2010-04-09 2012-04-04 株式会社東芝 電子機器
JP2013080489A (ja) * 2012-11-28 2013-05-02 Toshiba Corp 電子機器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5829944U (ja) * 1981-08-21 1983-02-26 吉岡　利之 容器
JP2766068B2 (ja) * 1990-11-21 1998-06-18 株式会社日立製作所 電子装置におけるヒートシンクの取り外し方法
JP3081326B2 (ja) * 1991-12-04 2000-08-28 株式会社日立製作所 半導体モジュール装置
JPH05243439A (ja) * 1992-03-03 1993-09-21 Mitsubishi Electric Corp ヒートシンクの取付け機構
JPH06196598A (ja) * 1992-12-25 1994-07-15 Oki Electric Ind Co Ltd 半導体チップの実装構造
FR2729045B1 (fr) * 1994-12-29 1997-01-24 Bull Sa Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes
JPH0982859A (ja) * 1995-09-11 1997-03-28 Toshiba Corp ヒートシンク組立体
JP2828059B2 (ja) * 1996-08-28 1998-11-25 日本電気株式会社 ヒートシンクの実装構造
JPH10173111A (ja) * 1996-12-09 1998-06-26 Canon Inc 半導体チップの冷却装置
JP3492504B2 (ja) * 1997-11-28 2004-02-03 エヌイーシーコンピュータテクノ株式会社 電子部品の放熱装置

Also Published As

Publication number Publication date
JP2001057490A (ja) 2001-02-27

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