JP4270344B2 - 平行度調整機構を備えた塗布装置および平行度調整方法 - Google Patents
平行度調整機構を備えた塗布装置および平行度調整方法 Download PDFInfo
- Publication number
- JP4270344B2 JP4270344B2 JP2003402216A JP2003402216A JP4270344B2 JP 4270344 B2 JP4270344 B2 JP 4270344B2 JP 2003402216 A JP2003402216 A JP 2003402216A JP 2003402216 A JP2003402216 A JP 2003402216A JP 4270344 B2 JP4270344 B2 JP 4270344B2
- Authority
- JP
- Japan
- Prior art keywords
- slit nozzle
- screw
- frame
- gap
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011248 coating agent Substances 0.000 title claims description 17
- 238000000576 coating method Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 7
- 230000010355 oscillation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Description
特に、測定にギャップ測定用センサを備えたトレイを用いることで、調整作業を効率よく行うことができる。
Claims (2)
- ベースの上面に水平方向に移動可能な移動部材を設け、この移動部材に左右の支柱を立設し、左右の支柱間に門型をなすフレームを係合し、このフレームにスリットノズルを取付け、このスリットノズルは一端側が水平軸を介して前記フレーム下面に支持されることで他端側が垂直方向に揺動可能とされ、前記他端側におけるフレームとスリットノズルとの間隔が調整部材にて調整可能とされ、前記調整部材は前記スリットノズルの長さ方向に沿って前記フレームの下面に支持されるスクリューネジとこのスクリューネジに螺合するするとともにフレームの下面とスリットノズルの上面との間に挟まれる外径形状が非円形の楔部材とからなり、前記スクリューネジを回転せしめて前記楔部材をスリットノズルの長さ方向に沿って移動せしめることでスリットノズルの平行度を調整することを特徴とする平行度調整機構を備えた塗布装置。
- 請求項1に記載する塗布装置を用いて平行度を調整する方法であって、離間した箇所にギャップ測定用センサを備えたトレイを前記スリットノズルの下方に挿入し、それぞれのセンサによって揺動中心となる一端側のギャップと垂直方向に揺動可能とされた他端側のギャップを読み取り、他端側のギャップを一端側のギャップに近づけるように調整することを特徴とする平行度調整方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003402216A JP4270344B2 (ja) | 2003-12-01 | 2003-12-01 | 平行度調整機構を備えた塗布装置および平行度調整方法 |
TW093136596A TW200524678A (en) | 2003-12-01 | 2004-11-26 | Coating apparatus having structure for adjusting to be horizontal and method for adjusting to be horizontal |
KR1020040099078A KR20050053013A (ko) | 2003-12-01 | 2004-11-30 | 평행도 조정 기구를 구비한 도포 장치 및 평행도 조정 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003402216A JP4270344B2 (ja) | 2003-12-01 | 2003-12-01 | 平行度調整機構を備えた塗布装置および平行度調整方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005161167A JP2005161167A (ja) | 2005-06-23 |
JP4270344B2 true JP4270344B2 (ja) | 2009-05-27 |
Family
ID=34725868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003402216A Expired - Lifetime JP4270344B2 (ja) | 2003-12-01 | 2003-12-01 | 平行度調整機構を備えた塗布装置および平行度調整方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4270344B2 (ja) |
KR (1) | KR20050053013A (ja) |
TW (1) | TW200524678A (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101284746B1 (ko) * | 2006-12-26 | 2013-07-16 | 주식회사 케이씨텍 | 포토레지스트 도포 노즐의 처짐 방지장치 |
KR101347517B1 (ko) * | 2006-12-26 | 2014-01-03 | 주식회사 케이씨텍 | 포토레지스트 도포 노즐의 처짐 보정장치 및 방법 |
JP4937784B2 (ja) * | 2007-02-20 | 2012-05-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR101000549B1 (ko) * | 2008-09-19 | 2010-12-14 | 주식회사 디엠에스 | 감광액 도포장치 |
KR101682600B1 (ko) * | 2014-02-26 | 2017-01-23 | 주식회사 쓰리디스퀘어 | 3d 프린트의 헤드갭 자동 측정장치 및 그 측정방법 |
CN105549338B (zh) * | 2016-02-18 | 2018-02-16 | 武汉华星光电技术有限公司 | 曝光量测装置及其量测平台 |
KR102641446B1 (ko) * | 2017-07-19 | 2024-02-28 | 주식회사 탑 엔지니어링 | 디스펜싱 장치 |
-
2003
- 2003-12-01 JP JP2003402216A patent/JP4270344B2/ja not_active Expired - Lifetime
-
2004
- 2004-11-26 TW TW093136596A patent/TW200524678A/zh unknown
- 2004-11-30 KR KR1020040099078A patent/KR20050053013A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20050053013A (ko) | 2005-06-07 |
JP2005161167A (ja) | 2005-06-23 |
TW200524678A (en) | 2005-08-01 |
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