JP4262207B2 - 低気泡性感放射線性組成物用現像液 - Google Patents
低気泡性感放射線性組成物用現像液 Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims description 40
- 230000005855 radiation Effects 0.000 title claims description 33
- 239000002736 nonionic surfactant Substances 0.000 claims description 40
- 239000000126 substance Substances 0.000 claims description 34
- -1 oxypropylene group Chemical group 0.000 claims description 19
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 125000006353 oxyethylene group Chemical group 0.000 claims description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- 229920001400 block copolymer Polymers 0.000 claims description 6
- 229920001451 polypropylene glycol Polymers 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000001413 cellular effect Effects 0.000 claims 1
- 238000011161 development Methods 0.000 description 33
- 238000000034 method Methods 0.000 description 25
- 239000000758 substrate Substances 0.000 description 14
- 239000003513 alkali Substances 0.000 description 11
- 230000000149 penetrating effect Effects 0.000 description 10
- 239000000049 pigment Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000011550 stock solution Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 229920002359 Tetronic® Polymers 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004945 emulsification Methods 0.000 description 3
- 230000001804 emulsifying effect Effects 0.000 description 3
- 239000001023 inorganic pigment Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000012860 organic pigment Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- 229940013085 2-diethylaminoethanol Drugs 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 241000047703 Nonion Species 0.000 description 1
- 229920002362 Tetronic® 1304 Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- ZUQAPLKKNAQJAU-UHFFFAOYSA-N acetylenediol Chemical compound OC#CO ZUQAPLKKNAQJAU-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ZYWUVGFIXPNBDL-UHFFFAOYSA-N n,n-diisopropylaminoethanol Chemical compound CC(C)N(C(C)C)CCO ZYWUVGFIXPNBDL-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/467—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis by electrochemical disinfection; by electrooxydation or by electroreduction
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2303/00—Specific treatment goals
- C02F2303/04—Disinfection
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Organic Chemistry (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
が−O−[AO] m −Hに対してパラ位に結合する。
1.現像液の製造
上記製造した現像液を100倍希釈して気泡性を評価した。容量200mLのガラス管に20mLの現像液を入れ、100ml/minの流量で窒素ガスをバブリングして、気泡体積が100cm3となるまでの時間を測定して下記のように5段階で気泡性を評価した。
5:400秒以上
4:300〜400秒
3:200〜300秒
2:100〜200秒
1:100秒未満
3.乳化分散性の評価
5:100時間以上安定
4:80〜100時間
3:60〜80時間
2:40〜60時間
1:40時間未満
4.経時的変化の評価
5−1.試片の製造
コーニング(製品番号1737、5×5×0.7cm)社の試験用ガラス基板上にスピンコーターを利用してレジスト(東友ファインケム社製)を最終膜厚1.9〜2.0μmとなるようにスピンコーティングした。次いで、コンベンションオーブン内で100℃で3分間プレベークを実施した。次いで、150mJ/cm2の露光量で露光した後、現像力試験のための試片を製造した。
上記で用意された試片で現像力の試験を実施した。現像力の試験方法は、温度26℃でコーニング社のホットプレート上に500mlビーカーを用意し、250mlの現像液を満たした後、マグネティックバーを回転させながら沈積して現像を実施した。一定時間の間現像した後、上記試片を取り出して超純水に水洗してリンスを実施した。窒素ガスで乾燥させた後、次いで、プレベークを実施した同一の種類のオーブンで220℃で20分間ハードベークを実施した。
上記現像された試片を走査電子顕微鏡(SEM:日立社、モデル名S−4100)で検査して形成されたパターン周辺の非露光部の残留の有無及びレジストのパターンエッジを評価し、その結果を下記表1と表2に表した。
5:パターンエッジが鮮明で、残留物が完全に除去された場合
4:パターンエッジが鮮明で、残留物が少量残留した場合
3:パターンエッジが伸び、残留物が少量残留した場合
2:パターンエッジが伸び、残留物が多量残留した場合
1:現像不良により比較が不可能な場合
Claims (8)
- 下記化学式1の非イオン性界面活性剤5〜20重量%、下記化学式2の非イオン性界面活性剤1〜20重量%、アルカリ性化合物1〜10重量%及び残量の水を含有する低気泡性感放射線性組成物用現像液:
(上記化学式1において、nは1〜3の整数であり、AOはオキシエチレン基、オキシプロピレン基及びポリオキシエチレン・ポリオキシプロピレンブロック共重合体からなる群より選ばれた1種以上であり、mは5〜30の整数であり、但し、nが1である場合は、
が−O−[AO] m −Hに対してパラ位に結合する)
(上記化学式2において、EOはオキシエチレン基、POはオキシプロピレン基であり、それぞれのx及びyは、x+yが4〜25の整数からなる群より選ばれた整数である) - 下記化学式1の非イオン性界面活性剤5〜20重量%、下記化学式3の非イオン性界面活性剤0.5〜5重量%、アルカリ性化合物1〜10重量%及び残量の水を含有する低気泡性感放射線性組成物用現像液:
(上記化学式1において、nは1〜3の整数であり、AOはオキシエチレン基、オキシプロピレン基及びポリオキシエチレン・ポリオキシプロピレンブロック共重合体からなる群より選ばれた1種以上であり、mは5〜30の整数であり、但し、nが1である場合は、
が−O−[AO] m −Hに対してパラ位に結合する)
(上記化学式3において、AOはオキシエチレン基、オキシプロピレン基及びポリオキシエチレン・ポリオキシプロピレンブロック共重合体からなる群より選ばれた1種以上であり、nは1〜40の整数である) - 化学式1の非イオン性界面活性剤の含量が10〜15重量%であり、化学式3の非イオン性界面活性剤の含量が1〜3重量%である請求項2に記載の低気泡性感放射線性組成物用現像液。
- 化学式1の非イオン性界面活性剤の含量が5〜10重量%であり、化学式2の非イオン性界面活性剤の含量が5〜15重量%である請求項1に記載の低気泡性感放射線性組成物用現像液。
- 化学式1の非イオン性界面活性剤は、そのHLBの範囲が12〜15であり、現像液の表面張力の範囲が38〜45dyne/cmである請求項1または2何れかに記載の低気泡性感放射線性組成物用現像液。
- 化学式2の非イオン性界面活性剤は、そのHLBの範囲が12〜16であり、現像液の表面張力の範囲が35〜45dyne/cmである請求項1に記載の低気泡性感放射線性組成物用現像液。
- 化学式3の非イオン性界面活性剤は、そのHLBの範囲が8〜18であり、現像液の表面張力の範囲が35〜45dyne/cmである請求項2に記載の低気泡性感放射線性組成物用現像液。
- アルカリ性化合物は、水酸化カリウム、水酸化ナトリウム、炭酸ナトリウムからなる群より選ばれる請求項1または2何れかに記載の低気泡性感放射線性組成物用現像液。
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KR1020040011396A KR100555589B1 (ko) | 2004-02-20 | 2004-02-20 | 감방사선성 조성물 현상액 |
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JP2005326813A JP2005326813A (ja) | 2005-11-24 |
JP4262207B2 true JP4262207B2 (ja) | 2009-05-13 |
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Families Citing this family (2)
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KR101957875B1 (ko) * | 2018-06-14 | 2019-03-13 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 조성물 및 이를 이용하는 패턴 형성 방법 |
KR101957876B1 (ko) * | 2018-06-14 | 2019-03-13 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 조성물 및 이를 이용하는 패턴 형성 방법 |
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KR100555589B1 (ko) | 2006-03-03 |
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