JP4251721B2 - 気密端子およびその製造方法 - Google Patents
気密端子およびその製造方法 Download PDFInfo
- Publication number
- JP4251721B2 JP4251721B2 JP18100699A JP18100699A JP4251721B2 JP 4251721 B2 JP4251721 B2 JP 4251721B2 JP 18100699 A JP18100699 A JP 18100699A JP 18100699 A JP18100699 A JP 18100699A JP 4251721 B2 JP4251721 B2 JP 4251721B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- brazing material
- metal layer
- metal
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 120
- 239000002184 metal Substances 0.000 claims description 120
- 238000005219 brazing Methods 0.000 claims description 97
- 239000000463 material Substances 0.000 claims description 73
- 238000007747 plating Methods 0.000 claims description 36
- 239000011521 glass Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 21
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 238000005275 alloying Methods 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 description 35
- 239000013078 crystal Substances 0.000 description 28
- 229910000679 solder Inorganic materials 0.000 description 21
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 238000007789 sealing Methods 0.000 description 16
- 229910002056 binary alloy Inorganic materials 0.000 description 15
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 230000005496 eutectics Effects 0.000 description 10
- 229910018731 Sn—Au Inorganic materials 0.000 description 9
- 229910020888 Sn-Cu Inorganic materials 0.000 description 8
- 229910019204 Sn—Cu Inorganic materials 0.000 description 8
- 239000006104 solid solution Substances 0.000 description 7
- 229910020816 Sn Pb Inorganic materials 0.000 description 6
- 229910020922 Sn-Pb Inorganic materials 0.000 description 6
- 229910008783 Sn—Pb Inorganic materials 0.000 description 6
- 239000007791 liquid phase Substances 0.000 description 6
- 229910020836 Sn-Ag Inorganic materials 0.000 description 5
- 229910020988 Sn—Ag Inorganic materials 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010897 surface acoustic wave method Methods 0.000 description 4
- 229910002058 ternary alloy Inorganic materials 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Images
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18100699A JP4251721B2 (ja) | 1999-06-28 | 1999-06-28 | 気密端子およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18100699A JP4251721B2 (ja) | 1999-06-28 | 1999-06-28 | 気密端子およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001015188A JP2001015188A (ja) | 2001-01-19 |
| JP2001015188A5 JP2001015188A5 (enExample) | 2006-08-17 |
| JP4251721B2 true JP4251721B2 (ja) | 2009-04-08 |
Family
ID=16093102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18100699A Expired - Fee Related JP4251721B2 (ja) | 1999-06-28 | 1999-06-28 | 気密端子およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4251721B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4817370B2 (ja) * | 2006-03-24 | 2011-11-16 | エヌイーシー ショット コンポーネンツ株式会社 | 電子部品用パッケージ |
| JP4933849B2 (ja) * | 2006-06-30 | 2012-05-16 | シチズンファインテックミヨタ株式会社 | 圧入型シリンダータイプ圧電振動子の気密端子、圧入型シリンダータイプ圧電振動子及び気密端子の製造方法 |
| DE102006054843B4 (de) * | 2006-10-10 | 2015-02-12 | BC Tech Holding AG | Elektrische Durchführung, sowie Verfahren zum Herstellen einer solchen Durchführung |
| WO2011068200A1 (ja) * | 2009-12-04 | 2011-06-09 | 株式会社大真空 | リード型圧電振動デバイス |
| JP2013035046A (ja) * | 2011-08-10 | 2013-02-21 | Nec Schott Components Corp | 金属膜とリードのはんだ接合構体およびその熱処理方法 |
-
1999
- 1999-06-28 JP JP18100699A patent/JP4251721B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001015188A (ja) | 2001-01-19 |
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