JP4241056B2 - エポキシ樹脂組成物、エポキシ樹脂硬化剤 - Google Patents

エポキシ樹脂組成物、エポキシ樹脂硬化剤 Download PDF

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Publication number
JP4241056B2
JP4241056B2 JP2003009767A JP2003009767A JP4241056B2 JP 4241056 B2 JP4241056 B2 JP 4241056B2 JP 2003009767 A JP2003009767 A JP 2003009767A JP 2003009767 A JP2003009767 A JP 2003009767A JP 4241056 B2 JP4241056 B2 JP 4241056B2
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epoxy resin
epoxy
ester compound
reaction
compound
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Expired - Fee Related
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Japanese (ja)
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JP2004217869A5 (enExample
JP2004217869A (ja
Inventor
雄二 佐藤
文彦 前川
勝治 高橋
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DIC Corp
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DIC Corp
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  • Epoxy Resins (AREA)
JP2003009767A 2003-01-17 2003-01-17 エポキシ樹脂組成物、エポキシ樹脂硬化剤 Expired - Fee Related JP4241056B2 (ja)

Priority Applications (1)

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JP2003009767A JP4241056B2 (ja) 2003-01-17 2003-01-17 エポキシ樹脂組成物、エポキシ樹脂硬化剤

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Application Number Priority Date Filing Date Title
JP2003009767A JP4241056B2 (ja) 2003-01-17 2003-01-17 エポキシ樹脂組成物、エポキシ樹脂硬化剤

Publications (3)

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JP2004217869A JP2004217869A (ja) 2004-08-05
JP2004217869A5 JP2004217869A5 (enExample) 2006-01-26
JP4241056B2 true JP4241056B2 (ja) 2009-03-18

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JP2003009767A Expired - Fee Related JP4241056B2 (ja) 2003-01-17 2003-01-17 エポキシ樹脂組成物、エポキシ樹脂硬化剤

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101177519B (zh) * 2006-11-09 2010-11-24 莘茂复合材料股份有限公司 经改质的环氧树脂组成物
CN105273367A (zh) 2014-06-30 2016-01-27 新日铁住金化学株式会社 芳香族聚酯、芳香族聚酯的制造方法、硬化性树脂组合物及其应用
CN106046321B (zh) * 2016-06-13 2018-02-13 西北师范大学 一种功能性固化剂及其制备双酚a型环氧树脂的方法
JP2018080264A (ja) * 2016-11-16 2018-05-24 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
CN113227191B (zh) * 2019-01-10 2025-01-03 三菱化学株式会社 改性环氧树脂、环氧树脂组合物、固化物及电气/电子电路用层叠板
CN112375337A (zh) * 2020-12-09 2021-02-19 安徽威能电源科技有限公司 一种低介质损耗的环氧树脂制备方法
KR20250036816A (ko) * 2022-07-21 2025-03-14 아지노모토 가부시키가이샤 폴리에스테르 수지, 및 수지 조성물, 그 경화물, 그 용도
US20250258430A1 (en) * 2022-10-05 2025-08-14 Resonac Corporation Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring board

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JP2004217869A (ja) 2004-08-05

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