JP4235980B2 - 小型被めっき物のめっき装置 - Google Patents

小型被めっき物のめっき装置 Download PDF

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Publication number
JP4235980B2
JP4235980B2 JP2001352892A JP2001352892A JP4235980B2 JP 4235980 B2 JP4235980 B2 JP 4235980B2 JP 2001352892 A JP2001352892 A JP 2001352892A JP 2001352892 A JP2001352892 A JP 2001352892A JP 4235980 B2 JP4235980 B2 JP 4235980B2
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JP
Japan
Prior art keywords
small
plating
cathode
plated
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001352892A
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English (en)
Japanese (ja)
Other versions
JP2003155600A (ja
Inventor
正視 堤野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2001352892A priority Critical patent/JP4235980B2/ja
Priority to US10/286,172 priority patent/US20030094373A1/en
Priority to CNB021529035A priority patent/CN1260401C/zh
Publication of JP2003155600A publication Critical patent/JP2003155600A/ja
Application granted granted Critical
Publication of JP4235980B2 publication Critical patent/JP4235980B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2001352892A 2001-11-19 2001-11-19 小型被めっき物のめっき装置 Expired - Fee Related JP4235980B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001352892A JP4235980B2 (ja) 2001-11-19 2001-11-19 小型被めっき物のめっき装置
US10/286,172 US20030094373A1 (en) 2001-11-19 2002-11-02 Apparatus for plating small-sized plating-piece
CNB021529035A CN1260401C (zh) 2001-11-19 2002-11-11 小型被镀物的电镀装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001352892A JP4235980B2 (ja) 2001-11-19 2001-11-19 小型被めっき物のめっき装置

Publications (2)

Publication Number Publication Date
JP2003155600A JP2003155600A (ja) 2003-05-30
JP4235980B2 true JP4235980B2 (ja) 2009-03-11

Family

ID=19165010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001352892A Expired - Fee Related JP4235980B2 (ja) 2001-11-19 2001-11-19 小型被めっき物のめっき装置

Country Status (3)

Country Link
US (1) US20030094373A1 (zh)
JP (1) JP4235980B2 (zh)
CN (1) CN1260401C (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5435355B2 (ja) * 2009-09-04 2014-03-05 日立金属株式会社 メッキ装置
CN102677118B (zh) * 2012-05-03 2014-12-31 武汉威蒙环保科技有限公司 板状金属氧化物电极的复极式电沉积方法
CN102677088B (zh) * 2012-05-03 2015-04-01 武汉威蒙环保科技有限公司 复极式板状金属氧化物电极消除应力的方法
CN105734650B (zh) * 2016-05-12 2017-11-14 陈鸣辉 一种料段电镀处理装置
CN108085734B (zh) * 2017-12-26 2019-11-05 石家庄铁道大学 试验用小型滚镀装置
CN110373702B (zh) * 2019-08-13 2021-02-26 创隆实业(深圳)有限公司 一种具有投料和搅拌功能的电镀系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833482A (en) * 1973-03-26 1974-09-03 Buckbee Mears Co Matrix for forming mesh
US4341613A (en) * 1981-02-03 1982-07-27 Rca Corporation Apparatus for electroforming
US5603815A (en) * 1994-10-04 1997-02-18 Lashmore; David S. Electrochemical fluidized bed coating of powders
US5656140A (en) * 1995-06-28 1997-08-12 Chamberlain Ltd., Inc. Electrochemical reclamation of heavy metals from natural materials such as soil
US5698081A (en) * 1995-12-07 1997-12-16 Materials Innovation, Inc. Coating particles in a centrifugal bed
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece

Also Published As

Publication number Publication date
JP2003155600A (ja) 2003-05-30
US20030094373A1 (en) 2003-05-22
CN1420212A (zh) 2003-05-28
CN1260401C (zh) 2006-06-21

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