US20030094373A1 - Apparatus for plating small-sized plating-piece - Google Patents

Apparatus for plating small-sized plating-piece Download PDF

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Publication number
US20030094373A1
US20030094373A1 US10/286,172 US28617202A US2003094373A1 US 20030094373 A1 US20030094373 A1 US 20030094373A1 US 28617202 A US28617202 A US 28617202A US 2003094373 A1 US2003094373 A1 US 2003094373A1
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United States
Prior art keywords
plating
small
sized
cathode
pieces
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Abandoned
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US10/286,172
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English (en)
Inventor
Masashi Tsutsumino
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Assigned to MURATA MANUFACTURING CO., LTD. reassignment MURATA MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TSUTSUMINO, MASASHI
Publication of US20030094373A1 publication Critical patent/US20030094373A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Definitions

  • the present invention relates to an apparatus for electroplating a small-sized plating piece such as a small-sized electronic component and more particularly, to an improvement in the structure of a cathode thereof.
  • Outer electrodes provided on the outer surfaces of chip-type small-sized electronic components such as monolithic ceramic capacitors, cylindrical capacitors, stacked varistors, stacked inductors, and other such devices are plated in many cases.
  • chip-type small-sized electronic components such as monolithic ceramic capacitors, cylindrical capacitors, stacked varistors, stacked inductors, and other such devices are plated in many cases.
  • Japanese Unexamined Patent Application Publication No. 5-70999 describes the use of a plating apparatus shown in FIG. 6 when the above-described plating is carried out by an electroplating method.
  • the plating apparatus 1 contains a plating bath which has a plating solution 2 .
  • a cathode 4 and an anode 5 each made of a conductor are dipped in the plating solution 2 .
  • a plurality of small-sized plating pieces (a set of the pieces are schematically shown by the broken line) to be plated are placed in a container 7 for components disposed in the plating solution 2 .
  • the plating pieces 6 include a plurality of small-sized electronic components 6 a and also a plurality of media 6 b made of conductors.
  • the above-described electrode 4 is arranged so as to define a portion of the bottom of the component-container 7 .
  • the small-sized electronic components 6 a and the media 6 b are placed on the cathode 4 in the plating solution 2 .
  • the component-container 7 is provided with a vertical shaft 8 .
  • the component-container 7 is rotated on the vertical axial line of the vertical shaft 8 so that the plating solution 2 is agitated, and moreover, the agitation-action is exerted on the small-sized electronic components 6 a and the media 6 b , so that the small-sized electronic components 6 a and the media 6 b can evenly contact the cathode 6 , respectively.
  • the surface of the cathode 4 provided in the plating apparatus 1 which is to come into contact with the small-sized electronic components 6 a and the media 6 b is so smooth and flat that the agitation of the small-sized electronic components 6 a and the media 6 b is not disturbed.
  • the cathode 4 has a smooth surface as described above, an electric field tends to be concentrated on the edges of the cathode 4 during plating. In some cases, the deposit 9 forms protuberances 10 on the edges of the cathode 4 as shown in FIG. 7.
  • the above-described protuberances 10 disturb the agitation of the small-sized electronic components 6 a and the media 6 b , and moreover, cause the deposit to peel off during plating. As a result, in some cases, the deposit 9 adheres as foreign matters to the small-sized electronic components 6 a.
  • the protuberances 10 formed on the deposit 9 disturb the agitation of the small-sized electronic components 6 a and the media 6 b .
  • the state in which the small-sized electronic components 6 a and the media 6 b are prevented from contacting with the cathode 4 occurs very easily and completely.
  • the deposit is formed in a larger amount, so that the protuberances 10 readily occur.
  • this process is undesirably repeated.
  • preferred embodiments of the present invention provide a plating apparatus for greatly improving a process for plating a small-sized plating piece.
  • an apparatus for plating a plurality of small-sized plating-pieces includes a plating bath in which a plating solution is contained, and a cathode and an anode made of conductors, which are dipped into the plating solution, respectively, the cathode having concavities formed on the surface thereof which is to contact with the small-sized plating-pieces, wherein a plurality of the small-sized plating-pieces are caused to contact with the cathode in the plating solution, and conduction is carried out between the cathode and the anode, so that plating films are deposited onto the small-sized plating-pieces.
  • the concavities may be a plurality of grooves formed on the surface of the cathode which is to contact with the small-sized plating-pieces, may be a plurality of small holes formed on the surface, or may be a chamfer portion formed on the circumferential edge of the surface.
  • the concavities are grooves
  • the grooves are arranged so as to intersect each other.
  • the apparatus for plating small-sized plating-pieces of a preferred embodiment of the present invention also includes a container for accommodating a plurality of the small-sized plating-pieces in the plating solution, and the cathode is arranged so as to define a portion of the bottom of the container.
  • the container is arranged to be rotated about a vertical axis thereof
  • Preferred embodiments of the present invention can be applied to different types of small-sized plating-pieces, and advantageously, is applied to plating of small-sized electronic components.
  • FIG. 1 illustrates a plating apparatus according to a first preferred embodiment of the present invention, and is a plan view of a container provided in the plating apparatus;
  • FIG. 2A is an enlarged plan view of the portion of the container shown in FIG. 1 in which a cathode is disposed;
  • FIG. 2B is a cross-sectional view thereof
  • FIG. 3 illustrates a cathode according to a second preferred embodiment of the present invention, and corresponds to FIG. 2A;
  • FIG. 4 illustrates a cathode according to a third preferred embodiment of the present invention, and corresponds to FIG. 2A;
  • FIG. 5 illustrates a cathode according to a fourth preferred embodiment of the present invention, and corresponds to FIG. 2A;
  • FIG. 6 is a schematic cross-sectional view of a plating apparatus relevant to preferred embodiments of the present invention.
  • FIG. 7 is a cross-sectional view of a container, and illustrates problems to be solved by preferred embodiments of the present invention.
  • FIG. 6 will be also referred to for illustration of a preferred embodiment of the present invention.
  • the plating apparatus 1 shown in FIG. 6 one of the novel characteristics of preferred embodiments of the present invention is the structure of the cathode 4 .
  • FIG. 1 illustrates a first preferred embodiment of the present invention, and is a plan view of a component-container 7 .
  • Cathodes 4 a are arranged so as to define a portion of the bottom of the component container 7 . According to this preferred embodiment, four electrodes 4 a are preferably arranged at intervals of about 90° around a shaft 8 .
  • FIG. 2B is an enlarged view showing the portion of the component container 7 in which the cathode 4 a is disposed.
  • FIG. 2A is an enlarged plan view of the portion of the component container, and
  • FIG. 2B is a cross-sectional view thereof.
  • a plurality of grooves 11 are formed on the upper surface of the cathode 4 a , that is, on the surface of the cathode 4 a which is to come into contact with the small-sized electronic components 6 a as the plating-pieces 6 and the media 6 b (see FIG. 6). These grooves 11 form concavities on the upper surface of the cathode 4 a .
  • the widths of the grooves 11 are preferably smaller than the respective sizes of the small-sized electronic components 6 a and the media 6 b , so that the small-sized electronic components 6 a and the media 6 b are prevented from fitting into the grooves 11 .
  • three grooves 11 per one cathode 4 a are preferably arranged so as to be substantially parallel to each other.
  • the number and the intervals of the grooves can be changed, if desired.
  • the extending direction of the grooves 11 formed in each of the four cathodes 4 a is substantially coincident with the radial direction of the component-container 7 , as shown in FIG. 1.
  • the extending direction of the grooves 11 may be optionally changed.
  • each of the grooves 11 preferably has a substantially V-shaped cross-section, as shown in FIG. 2B.
  • the groove may have a substantially U-shaped configuration, a substantially quadrangular-shaped configuration, or other suitable configuration.
  • FIG. 3 illustrates a second preferred embodiment of the present invention, and corresponds to FIG. 2A.
  • a plurality of the grooves 11 are formed on the upper surface of a cathode 4 b shown in FIG. 3, and moreover, a plurality of grooves 11 a are arranged so as to intersect the grooves 11 , that is, so as to be substantially perpendicular to the grooves 11 .
  • FIGS. 4A and 4B illustrate a third preferred embodiment of the present invention, and correspond to FIGS. 2A and 2B, respectively.
  • a plurality of small holes 12 are formed on the upper surface of a cathode 4 c shown in FIGS. 4A and 4B. These small holes 12 form concavities.
  • the sizes of the small holes 12 are preferably smaller than those of the small-sized electronic components 6 a and the media 6 b to be plated, so that the small-sized electronic components 6 a and the media 6 b are prevented from fitting into the small holes 12 .
  • the number and the distribution of the small holes 12 may be optionally changed, if necessary.
  • the small holes 12 are preferably substantially circular in the plan view thereof as shown in FIG. 4A, and may be angular in the plan view instead of the substantially circular shape.
  • the grooves 11 have a substantially V-shaped configuration in the cross section as shown in FIG. 4B, and may have a substantially U-shaped configuration, a substantially quadrangular shape, or other suitable shape.
  • FIGS. 5A and 5B illustrate a fourth preferred embodiment of the present invention, and correspond to FIG. 2A and 2B, respectively.
  • a chamfer portion 13 is provided on the circumferential edge of the upper surface of the cathode 4 d.
  • the chamfer portion 13 defines a concavity.
  • the size of the concavity defined by the chamfer portion 13 is preferably smaller compared to the sizes of the small-sized electronic components 6 a and the media 6 b to be plated, so that the small-sized electronic components 6 a and the media 6 b are prevented from fitting into the concavity.
  • the chamfer portion 13 shown in the drawing is bent to a radius as shown in FIG. 5B, and may be changed to be an inclined flat surface.
  • the region of a cathode to which an electric field is readily concentrated during plating can be divided and distributed in the vicinities of the grooves 11 , those of the grooves 11 and 11 a , and those of the small holes 12 , and in the vicinity of the chamfer portion 13 .
  • the electric field which would be concentrated, can be dispersed.
  • the phenomenon in which a relatively large amount of deposit 9 is formed only on the edge of the cathode 4 so that a protuberance 10 is formed, as shown in FIG. 7, is prevented from occurring.
  • formation of the protuberance 10 which would disturb the agitation of the small-sized electronic components 6 a and the media 6 b , can be prevented from occurring.
  • the grooves 11 and 11 a , the small holes 12 , and the chamfered portion 13 are formed as the concavities so as to have such sizes that the plating-pieces 6 such as the small-sized electronic components 6 a and the media 6 b are prevented from fitting into the concavities. This is done to prevent the small-sized electronic components 6 a and the media 6 b from fitting into the concavities and disturb the agitation thereof.
  • the concavities have sizes that are sufficiently larger than those of the small-sized electronic components and the media, the components and the media, even if they are fitted into the cavities, can be easily moved out of the concavities. Thus, they are prevented from staying in the concavities, and the agitation thereof is not disturbed.
  • cathode 4 a two types of cathodes having diameters of about 20 mm and about 30 mm were disposed in the component containers 7 , respectively.
  • monolithic capacitors each having approximate dimensions of 1.0 mm ⁇ 0.5 mm ⁇ 0.5 mm were used.
  • the surfaces of outer electrodes disposed on both end surfaces of each monolithic capacitor were plated.
  • Table 1 shows the maximum thicknesses of deposits formed on the cathodes in the example of preferred embodiments of the present invention and Comparative Example, respectively.
  • Table 1 Diameter of Comparative cathode Example example 20 mm 3 mm 8 mm 30 mm 1.5 mm 5 mm
  • Table 2 shows peeling or not of deposits on the cathodes and the thicknesses (average) of plated-films formed on the outer electrodes of the monolithic capacitors in the example of preferred embodiments of the present invention and the Comparative Example for the cathodes each having a diameter of about 20 mm, respectively.
  • TABLE 2 Plating thickness Peeling of deposit (average) Example peeling 4.9 ⁇ m Comparative not peeling 3.4 ⁇ m example
  • the plating thicknesses were compared.
  • the thickness could be increased in the example of preferred embodiments of the present invention, compared to that in the Comparative Example.
  • the maximum thicknesses of deposits on the cathodes in the example of preferred embodiments of the present invention are smaller that those in the Comparative Example.
  • the following is estimated. Formation of protuberances, which would disturb the agitation of the monolithic capacitors to be plated, is reliably prevented, so that the monolithic capacitors could come into contact with the cathode more fluently. As a result, the plating films each having a large thickness could be obtained.
  • the three grooves 11 extending substantially parallel to each other were formed on the cathode 4 a with a diameter of about 20 mm as in the example of preferred embodiments of the present invention as shown in FIGS. 1, 2A, and 2 B. It was determined that when the cathode 4 b having the three grooves 11 extending in the longitudinal direction and the three grooves 11 a extending in the lateral direction is used, the maximum thickness of a deposit on the cathode 4 b can be further reduced by about 2 mm.
  • the concavities are formed on the surface of the cathode which is to come into contact with the small-sized plating pieces. Therefore, during plating, an electric field is readily concentrated in the vicinities of the concavities in addition to the edge of the cathode. Thus, the phenomena in which a larger amount of deposits are concentrated on the edge of the cathode, which causes protuberances or the like to be formed on the deposits, are reliably prevented.
  • the concavities have anchor-effects on a deposit formed on the cathode and prevent the deposit from peeling off from the cathode. Therefore, the deposit as foreign matters is prevented from adhering to the small-sized plating pieces.
  • the size of the cathode can be increased without any problems. Thus, the amount of deposit per unit area of the cathode can be increased, and also, the efficiency of plating can be greatly improved.
  • the concavities are a plurality of the grooves formed on the surface of the cathode which is to come into contact with the small-sized plating-pieces, the concavities can be easily distributed completely on the surface of the cathode. Thus, an electric field generated during plating can be dispersed more effectively.
  • the apparatus further includes a container for components which can accommodate a plurality of the small-sized plating pieces in a plating solution, and the cathode is arranged so as to form a portion of the bottom of the container.
  • the present invention can be applied most advantageously.
  • agitation-action is applied to the small-sized plating-pieces. In this state, the agitation-action can be more effectively exerted to the small-sized plating-pieces.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
US10/286,172 2001-11-19 2002-11-02 Apparatus for plating small-sized plating-piece Abandoned US20030094373A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001352892A JP4235980B2 (ja) 2001-11-19 2001-11-19 小型被めっき物のめっき装置
JP2001-352892 2001-11-19

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JP (1) JP4235980B2 (zh)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107287645A (zh) * 2016-05-12 2017-10-24 璧靛浆 一种防氧化的料段电镀处理装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5435355B2 (ja) * 2009-09-04 2014-03-05 日立金属株式会社 メッキ装置
CN102677118B (zh) * 2012-05-03 2014-12-31 武汉威蒙环保科技有限公司 板状金属氧化物电极的复极式电沉积方法
CN102677088B (zh) * 2012-05-03 2015-04-01 武汉威蒙环保科技有限公司 复极式板状金属氧化物电极消除应力的方法
CN108085734B (zh) * 2017-12-26 2019-11-05 石家庄铁道大学 试验用小型滚镀装置
CN110373702B (zh) * 2019-08-13 2021-02-26 创隆实业(深圳)有限公司 一种具有投料和搅拌功能的电镀系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833482A (en) * 1973-03-26 1974-09-03 Buckbee Mears Co Matrix for forming mesh
US4341613A (en) * 1981-02-03 1982-07-27 Rca Corporation Apparatus for electroforming
US5656140A (en) * 1995-06-28 1997-08-12 Chamberlain Ltd., Inc. Electrochemical reclamation of heavy metals from natural materials such as soil
US6254757B1 (en) * 1994-10-04 2001-07-03 Materials Innovation, Inc. Method for electrochemical fluidized bed coating of powders
US6287445B1 (en) * 1995-12-07 2001-09-11 Materials Innovation, Inc. Coating particles in a centrifugal bed
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833482A (en) * 1973-03-26 1974-09-03 Buckbee Mears Co Matrix for forming mesh
US4341613A (en) * 1981-02-03 1982-07-27 Rca Corporation Apparatus for electroforming
US6254757B1 (en) * 1994-10-04 2001-07-03 Materials Innovation, Inc. Method for electrochemical fluidized bed coating of powders
US5656140A (en) * 1995-06-28 1997-08-12 Chamberlain Ltd., Inc. Electrochemical reclamation of heavy metals from natural materials such as soil
US6287445B1 (en) * 1995-12-07 2001-09-11 Materials Innovation, Inc. Coating particles in a centrifugal bed
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107287645A (zh) * 2016-05-12 2017-10-24 璧靛浆 一种防氧化的料段电镀处理装置
CN107287645B (zh) * 2016-05-12 2019-03-01 郑灵月 一种防氧化的料段电镀处理装置

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Publication number Publication date
CN1420212A (zh) 2003-05-28
CN1260401C (zh) 2006-06-21
JP4235980B2 (ja) 2009-03-11
JP2003155600A (ja) 2003-05-30

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Owner name: MURATA MANUFACTURING CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TSUTSUMINO, MASASHI;REEL/FRAME:013452/0011

Effective date: 20021031

STCB Information on status: application discontinuation

Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION