JP4234270B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4234270B2
JP4234270B2 JP20353699A JP20353699A JP4234270B2 JP 4234270 B2 JP4234270 B2 JP 4234270B2 JP 20353699 A JP20353699 A JP 20353699A JP 20353699 A JP20353699 A JP 20353699A JP 4234270 B2 JP4234270 B2 JP 4234270B2
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Japan
Prior art keywords
semiconductor
substrate
semiconductor substrate
package
package substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP20353699A
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English (en)
Japanese (ja)
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JP2001035970A5 (https=
JP2001035970A (ja
Inventor
辰夫 竹下
正之 榊原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP20353699A priority Critical patent/JP4234270B2/ja
Publication of JP2001035970A publication Critical patent/JP2001035970A/ja
Publication of JP2001035970A5 publication Critical patent/JP2001035970A5/ja
Application granted granted Critical
Publication of JP4234270B2 publication Critical patent/JP4234270B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP20353699A 1999-07-16 1999-07-16 半導体装置の製造方法 Expired - Fee Related JP4234270B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20353699A JP4234270B2 (ja) 1999-07-16 1999-07-16 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20353699A JP4234270B2 (ja) 1999-07-16 1999-07-16 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2001035970A JP2001035970A (ja) 2001-02-09
JP2001035970A5 JP2001035970A5 (https=) 2006-08-31
JP4234270B2 true JP4234270B2 (ja) 2009-03-04

Family

ID=16475787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20353699A Expired - Fee Related JP4234270B2 (ja) 1999-07-16 1999-07-16 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4234270B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3711341B2 (ja) 2001-04-27 2005-11-02 沖電気工業株式会社 半導体装置
JP4648596B2 (ja) * 2001-09-12 2011-03-09 大日本印刷株式会社 半導体装置の製造方法
JP4488733B2 (ja) * 2003-12-24 2010-06-23 三洋電機株式会社 回路基板の製造方法および混成集積回路装置の製造方法。
TW200949961A (en) * 2008-05-30 2009-12-01 Powertech Technology Inc Manufacturing method of semiconductor element
JP2025088549A (ja) * 2023-11-30 2025-06-11 Ｒａｐｉｄｕｓ株式会社 電子装置

Also Published As

Publication number Publication date
JP2001035970A (ja) 2001-02-09

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