JP2001035970A5 - - Google Patents

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Publication number
JP2001035970A5
JP2001035970A5 JP1999203536A JP20353699A JP2001035970A5 JP 2001035970 A5 JP2001035970 A5 JP 2001035970A5 JP 1999203536 A JP1999203536 A JP 1999203536A JP 20353699 A JP20353699 A JP 20353699A JP 2001035970 A5 JP2001035970 A5 JP 2001035970A5
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JP
Japan
Prior art keywords
semiconductor
substrate
semiconductor device
identification symbol
package
Prior art date
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Application number
JP1999203536A
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English (en)
Japanese (ja)
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JP2001035970A (ja
JP4234270B2 (ja
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Priority to JP20353699A priority Critical patent/JP4234270B2/ja
Priority claimed from JP20353699A external-priority patent/JP4234270B2/ja
Publication of JP2001035970A publication Critical patent/JP2001035970A/ja
Publication of JP2001035970A5 publication Critical patent/JP2001035970A5/ja
Application granted granted Critical
Publication of JP4234270B2 publication Critical patent/JP4234270B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP20353699A 1999-07-16 1999-07-16 半導体装置の製造方法 Expired - Fee Related JP4234270B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20353699A JP4234270B2 (ja) 1999-07-16 1999-07-16 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20353699A JP4234270B2 (ja) 1999-07-16 1999-07-16 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2001035970A JP2001035970A (ja) 2001-02-09
JP2001035970A5 true JP2001035970A5 (https=) 2006-08-31
JP4234270B2 JP4234270B2 (ja) 2009-03-04

Family

ID=16475787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20353699A Expired - Fee Related JP4234270B2 (ja) 1999-07-16 1999-07-16 半導体装置の製造方法

Country Status (1)

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JP (1) JP4234270B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3711341B2 (ja) 2001-04-27 2005-11-02 沖電気工業株式会社 半導体装置
JP4648596B2 (ja) * 2001-09-12 2011-03-09 大日本印刷株式会社 半導体装置の製造方法
JP4488733B2 (ja) * 2003-12-24 2010-06-23 三洋電機株式会社 回路基板の製造方法および混成集積回路装置の製造方法。
TW200949961A (en) * 2008-05-30 2009-12-01 Powertech Technology Inc Manufacturing method of semiconductor element
JP2025088549A (ja) * 2023-11-30 2025-06-11 Ｒａｐｉｄｕｓ株式会社 電子装置

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