JP4220707B2 - レーザ加工ヘッド - Google Patents

レーザ加工ヘッド Download PDF

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Publication number
JP4220707B2
JP4220707B2 JP2002050111A JP2002050111A JP4220707B2 JP 4220707 B2 JP4220707 B2 JP 4220707B2 JP 2002050111 A JP2002050111 A JP 2002050111A JP 2002050111 A JP2002050111 A JP 2002050111A JP 4220707 B2 JP4220707 B2 JP 4220707B2
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Japan
Prior art keywords
light
laser
lens
optical axis
light receiving
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Expired - Fee Related
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JP2002050111A
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English (en)
Japanese (ja)
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JP2003245789A5 (enrdf_load_stackoverflow
JP2003245789A (ja
Inventor
松本　　聡
良雄 磯部
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Priority to JP2002050111A priority Critical patent/JP4220707B2/ja
Publication of JP2003245789A publication Critical patent/JP2003245789A/ja
Publication of JP2003245789A5 publication Critical patent/JP2003245789A5/ja
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Publication of JP4220707B2 publication Critical patent/JP4220707B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Lenses (AREA)
  • Laser Beam Processing (AREA)
JP2002050111A 2002-02-26 2002-02-26 レーザ加工ヘッド Expired - Fee Related JP4220707B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002050111A JP4220707B2 (ja) 2002-02-26 2002-02-26 レーザ加工ヘッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002050111A JP4220707B2 (ja) 2002-02-26 2002-02-26 レーザ加工ヘッド

Publications (3)

Publication Number Publication Date
JP2003245789A JP2003245789A (ja) 2003-09-02
JP2003245789A5 JP2003245789A5 (enrdf_load_stackoverflow) 2005-10-27
JP4220707B2 true JP4220707B2 (ja) 2009-02-04

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JP2002050111A Expired - Fee Related JP4220707B2 (ja) 2002-02-26 2002-02-26 レーザ加工ヘッド

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JP (1) JP4220707B2 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4618531B2 (ja) * 2004-03-15 2011-01-26 株式会社ニコン レーザ加工用光学系及びこれを用いたレーザ加工装置
US7422988B2 (en) 2004-11-12 2008-09-09 Applied Materials, Inc. Rapid detection of imminent failure in laser thermal processing of a substrate
US7438468B2 (en) * 2004-11-12 2008-10-21 Applied Materials, Inc. Multiple band pass filtering for pyrometry in laser based annealing systems
CN101107501B (zh) * 2005-03-04 2011-07-27 松下电器产业株式会社 激光加热装置及激光加热方法
JP2009093984A (ja) * 2007-10-11 2009-04-30 Hitachi Displays Ltd 有機ｅｌ表示装置およびその製造方法
JP2011003558A (ja) * 2010-10-07 2011-01-06 Hitachi Displays Ltd 表示装置の製造方法
WO2015145681A1 (ja) * 2014-03-27 2015-10-01 三菱電機株式会社 レーザ加工装置
CN104942431A (zh) * 2015-06-17 2015-09-30 王金 一种激光加工装置及其激光热熔胶快速粘合工艺
WO2020080368A1 (ja) * 2018-10-16 2020-04-23 古河電気工業株式会社 温度計測システム、温度計測方法およびレーザ加工装置
JP7509575B2 (ja) * 2020-05-20 2024-07-02 浜松ホトニクス株式会社 熱輻射光検出装置及びレーザ加工装置
JP7616151B2 (ja) 2022-05-16 2025-01-17 トヨタ自動車株式会社 レーザ加工装置、および、評価方法
CN120395112A (zh) * 2025-07-04 2025-08-01 西安晟光硅研半导体科技有限公司 一种用于激光微射流设备加工头的紫外消色差物镜

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JP2003245789A (ja) 2003-09-02

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