JP4220527B2 - Development processing equipment - Google Patents

Description

  The present invention relates to a development processing apparatus that performs a single or a series of development processing steps while conveying a substrate to be processed horizontally.

  Recently, in a resist coating and developing processing system in LCD (liquid crystal display) manufacturing, as a developing method that can advantageously cope with the enlargement of the LCD substrate, the LCD substrate is mounted on a conveying path in which conveying rollers and a conveying belt are laid horizontally. A so-called flat-flow method, in which a series of development processing steps such as development, rinsing, and drying are performed during transportation, is attracting attention (for example, see Patent Document 1). Compared with the spinner method that rotates the substrate, such a flat flow method has advantages such as simple substrate handling, transport system and drive system configuration, and less mist generation or reattachment to the substrate. is there.

In general, in a flat-flow type development processing apparatus, in order to collect the liquid that has fallen under the conveyance path for each liquid processing unit in the development process and the rinsing process that are sequentially set from the upstream side to the downstream side along the conveyance path. A pan-like container or pan is provided, and the drain of each pan is connected to a separate drainage system.
JP-A-9-17931

  However, in the conventional flat-flow type development processing apparatus, the substrate is transported from the upstream side liquid processing unit to the downstream side liquid processing unit while maintaining the horizontal posture on the transport path, and thus used in the upstream side liquid processing unit. The processed liquid remained on the substrate and was sent to the downstream liquid processing section and dropped or mixed into the downstream pan, making it difficult to separate and collect each processing liquid. There is also a problem that the processing solution (developing solution, rinsing solution, etc.) that has been tilted and dropped down rebounds to the development processing section and reattaches to the substrate being developed.

  The present invention has been made in view of the above-described problems of the prior art, and efficiently removes the processing liquid supplied to the substrate to be processed on the transport path laid in the horizontal direction from the substrate in a single time. Another object of the present invention is to provide a development processing apparatus which prevents as much as possible the liquid once drained from the substrate from reattaching to the substrate being developed.

In order to achieve the above object, the development processing apparatus according to the first aspect of the present invention provides a substrate on a conveyance path formed by horizontally laying a conveyance body for carrying and carrying a substrate to be processed substantially horizontally. A developing processing apparatus for performing a developing process on the substrate while the substrate is transported within a predetermined section, wherein the developer supplying section supplies the developer onto the substrate in the first section on the transport path, and the transport A developer dropping unit for dropping the developer from the substrate in a second section downstream from the first section on the path, and a second section downstream from the second section on the transport path. A rinsing liquid supply unit for supplying a rinsing liquid onto the substrate in a section 3; and a rinsing liquid is dropped from the substrate in a fourth section downstream of the third section on the transport path. and a rinsing liquid off portion, the developer drop portion, the substrate First substrate tilting means is provided that lifts the substrate to a position higher than the position on the transport path while tilting a plurality of lift members arranged at regular intervals from the bottom to tilt the substrate in the transport direction. Then, the substrate is tilted forward so that the rear end side of the substrate faces up in the transport direction, and the developer on the substrate is dropped to the front of the substrate, and the rinse liquid dropping unit is configured to remove the substrate in the transport direction. The rinse liquid on the substrate is dropped to the front of the substrate by inclining forward so that the rear end side is up.

In the development processing apparatus according to the first aspect, immediately after the developer supply process, the substrate is moved in the transport direction in the developer drop part so that the end of the substrate on the developer supply processing part side is up, that is, the developer supply The substrate is tilted so that the end of the substrate far from the processing unit faces down, and the developer remaining on or adhering to the substrate is allowed to flow away from the developer supply processing unit by gravity. Accordingly, it is possible to reduce the possibility that the developer that has fallen and bounced off the substrate will fly to the developer supply processing unit and adhere to the substrate being developed. Furthermore, immediately after the rinsing liquid supply process, the substrate end on the side of the developer supply processing part in the direction of transporting the substrate in the rinsing liquid dropping part or the rinse liquid dropping process is up, that is, far from the developer supply processing part The substrate is tilted so that the end of the substrate faces downward, and the rinsing liquid remaining on or adhering to the substrate is allowed to flow away from the developer supply processing unit by gravity. Accordingly, it is possible to reduce the possibility that the rinse liquid that has fallen and bounced off the substrate will fly to the developer supply processing section and adhere to the substrate being developed. In the developer drop portion, the first substrate tilting means lifts the substrate to a position higher than the position on the transport path while applying a plurality of lift members arranged at predetermined intervals to the substrate from the bottom. Therefore, the entire substrate is kept in a stable tilted posture without undue external force or damage to the substrate, and the liquid adhering or remaining on the substrate is effectively dropped by gravity to quickly remove the liquid. Can be cut.

In the development processing apparatus according to the second aspect of the present invention, while the substrate is transported in a predetermined section on a transport path in which a transport body for placing and transporting the substrate to be processed is horizontally placed. A development processing apparatus for performing development processing on the substrate, wherein a prewetting liquid supply unit that supplies a prewetting liquid onto the substrate in a first section on the transport path; and the first section on the transport path. A prewetting liquid dropping part for dropping the prewetting liquid from the substrate in the second section on the downstream side of the substrate, and the third section on the downstream side of the second section on the transport path. A developer supply unit for supplying the developer onto the substrate, and a developer drop unit for dropping the developer from the substrate in a fourth section on the downstream side of the third section on the transport path. , Downstream of the fourth section on the conveyance path A rinsing liquid supply section for supplying a rinsing liquid onto the substrate in a fifth section, and the prewetting liquid dropping section is in a rearward posture so that the front end side of the substrate is up in the transport direction of the substrate. The developer is dropped to drop the prewetting liquid on the substrate to the rear side of the substrate, and the developer dropping portion holds the substrate with a plurality of lift members arranged at predetermined intervals on the substrate from below. The first substrate tilting means is lifted to a position higher than the position on the transport path and tilted in the transport direction, and the substrate is tilted forward so that the rear end side of the substrate faces up in the transport direction. The developing solution on the substrate was dropped in front of the substrate.

In the development processing apparatus according to the second aspect, immediately after the prewetting liquid supply process, the substrate is moved in the transport direction in the prewetting liquid dropping section so that the end of the substrate on the developing liquid supply processing section side is up, that is, development is performed. The pre-wetting liquid remaining on or adhering to the substrate is caused to flow away from the developer supply processing section by gravity, so that the end of the substrate far from the liquid supply processing section is inclined downward. Accordingly, it is possible to reduce the possibility that the prewetting liquid that has fallen and bounced off the substrate will fly to the developing solution supply processing unit side and adhere to the developing substrate. Further, immediately after the developing solution supply process , the substrate at the developing solution dropping unit is positioned so that the substrate end on the developing solution supply processing unit side is in the transport direction, that is, the substrate farther from the developing solution supply processing unit. The developer is inclined so that the end portion is at the bottom, and the developer remaining on or adhering to the substrate is allowed to flow away from the developer supply processing unit by gravity. Accordingly, it is possible to reduce the possibility that the developer that has fallen and bounced off the substrate will fly to the developer supply processing unit and adhere to the substrate being developed. In the developer drop portion, the first substrate tilting means lifts the substrate to a position higher than the position on the transport path while applying a plurality of lift members arranged at predetermined intervals to the substrate from the bottom. Therefore, the entire substrate is kept in a stable tilted posture without undue external force or damage to the substrate, and the liquid adhering to or remaining on the substrate is effectively dropped by gravity to quickly remove the liquid. Can be cut.

In the development processing apparatus according to the third aspect of the present invention, the substrate is transported in a predetermined section on a transport path in which a transport body for placing and transporting the substrate to be processed is horizontally placed. A development processing apparatus for performing development processing on the substrate, wherein a prewetting liquid supply unit that supplies a prewetting liquid onto the substrate in a first section on the transport path; and the first section on the transport path. A prewetting liquid dropping part for dropping the prewetting liquid from the substrate in the second section on the downstream side of the substrate, and the third section on the downstream side of the second section on the transport path. A developer supply unit for supplying the developer onto the substrate, and a developer drop unit for dropping the developer from the substrate in a fourth section on the downstream side of the third section on the transport path. , Downstream of the fourth section on the conveyance path A rinsing liquid supply unit that supplies a rinsing liquid onto the substrate in a fifth section, and a rinsing liquid is dropped from the substrate in a sixth section on the downstream side of the fifth section on the transport path. A pre-wetting liquid drop part that drops the pre-wet liquid on the substrate to the rear side of the substrate by inclining backward so that the front end side of the substrate faces up in the transport direction. The developer dropping portion lifts the substrate to a position higher than the position on the conveyance path while tilting the plurality of lift members arranged at predetermined intervals on the substrate from the bottom, and tilts in the conveyance direction. A first substrate tilting means configured to be in a posture, tilting the substrate forward so that the rear end side of the substrate is up in the transport direction, dropping the developer on the substrate to the front of the substrate, and dropping the rinse liquid; Part transports the substrate And configured to drop the rinse liquid on the substrate in the substrate front end side of the substrate is forward tilted so on.

In the development processing apparatus according to the third aspect, immediately after the prewetting liquid supply process, the substrate is moved in the transport direction in the prewetting liquid dropping section so that the end of the substrate on the developing liquid supply processing section side is up, that is, development is performed. The pre-wetting liquid remaining on or adhering to the substrate is caused to flow away from the developer supply processing section by gravity, so that the end of the substrate far from the liquid supply processing section is inclined downward. Accordingly, it is possible to reduce the possibility that the prewetting liquid that has fallen and bounced off the substrate will fly to the developing solution supply processing unit side and adhere to the developing substrate. Further, immediately after the developing solution supply process , the substrate at the developing solution dropping unit is positioned so that the substrate end on the developing solution supply processing unit side is in the transport direction, that is, the substrate farther from the developing solution supply processing unit. The developer is inclined so that the end portion is at the bottom, and the developer remaining on or adhering to the substrate is allowed to flow away from the developer supply processing unit by gravity. Accordingly, it is possible to reduce the possibility that the developer that has fallen and bounced off the substrate will fly to the developer supply processing unit and adhere to the substrate being developed. Further, immediately after the rinsing liquid supply processing, the substrate end on the side of the developer supply processing section in the transport direction in the rinsing liquid dropping section is up, that is, the substrate end portion farther from the developer supply processing section. The rinse solution remaining or adhering to the substrate is caused to flow down by gravity toward the far side from the developer supply processing unit. Accordingly, it is possible to reduce the possibility that the rinse liquid that has fallen and bounced off the substrate will fly to the developer supply processing section and adhere to the substrate being developed. In the developer drop portion, the first substrate tilting means lifts the substrate to a position higher than the position on the transport path while applying a plurality of lift members arranged at predetermined intervals to the substrate from the bottom. Therefore, the entire substrate is kept in a stable tilted posture without undue external force or damage to the substrate, and the liquid adhering or remaining on the substrate is effectively dropped by gravity to quickly remove the liquid. Can be cut.

In the development processing apparatus of the present invention, as a preferred embodiment, the rinse liquid dropping portion and the pre-wet liquid dropping portion are arranged so that the substrate is removed from the bottom while applying a plurality of lift members arranged at predetermined intervals to the substrate. Each of the second and third substrate tilting means is lifted to a position higher than the position on the transport path to be inclined in the transport direction . According to such a configuration, even in the rinse liquid drop portion and the pre-wet liquid drop portion, the entire substrate was adhered or remained on the substrate while keeping the entire substrate in a stable inclined posture without causing excessive external force or damage to the substrate. The liquid can be effectively dropped by gravity and drained in a short time.

  According to the development processing apparatus of the present invention, the processing liquid supplied to the substrate to be processed is efficiently drained from the substrate in a single time on the conveyance path laid in the horizontal direction by having the above configuration and operation. At the same time, the liquid once drained from the substrate can be prevented as much as possible from reattaching to the substrate being developed.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing processing system as one configuration example to which the developing processing apparatus of the present invention can be applied. The coating and developing processing system 10 is installed in a clean room, and uses, for example, an LCD substrate as a substrate to be processed, and performs various processes such as cleaning, resist coating, pre-baking, developing, and post-baking in the photolithography process in the LCD manufacturing process. Is. The exposure process is performed by an external exposure apparatus 12 installed adjacent to this system.

  In the coating and developing system 10, a horizontally long process station (P / S) 16 is disposed at the center, and a cassette station (C / S) 14 and an interface station (I / F) are disposed at both ends in the longitudinal direction (X direction). ) 18.

  The cassette station (C / S) 10 is a cassette loading / unloading port of the system 10, and can accommodate up to four cassettes C that can accommodate a plurality of substrates C in a horizontal direction, for example, in the Y direction by stacking substrates G in multiple stages. A cassette stage 20 and a transport mechanism 22 for loading and unloading the substrate G with respect to the cassette C on the stage 20. The transport mechanism 22 has a means for holding the substrate G, for example, a transport arm 22a, can be operated with four axes of X, Y, Z, and θ, and is adjacent to the adjacent process station (P / S) 16 side and the substrate G. Delivery is now possible.

  In the process station (P / S) 16, the processing units are arranged in the order of the process flow or process on a pair of parallel and opposite lines A and B extending in the system longitudinal direction (X direction). More specifically, the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side includes a cleaning process unit 24, a first thermal processing unit 26, and The coating process section 28 and the second thermal processing section 30 are arranged in a horizontal row. On the other hand, in the downstream process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side, a second thermal processing unit 30, a development processing unit 32, and a decolorization process are provided. The unit 34 and the third thermal processing unit 36 are arranged in a horizontal row. In this line configuration, the second thermal processing unit 30 is located at the end of the upstream process line A and at the beginning of the downstream process line B, and straddles between both lines A and B. ing.

  An auxiliary transfer space 38 is provided between the process lines A and B, and a shuttle 40 that can horizontally place the substrate G in units of one sheet is bidirectional in the line direction (X direction) by a drive mechanism (not shown). Can be moved to.

  In the upstream process line A, the cleaning process unit 24 includes a scrubber cleaning unit (SCR) 42, and an excimer is disposed at a location adjacent to the cassette station (C / S) 10 in the scrubber cleaning unit (SCR) 42. A UV irradiation unit (e-UV) 41 is arranged. Although not shown, the cleaning unit in the scrubber cleaning unit (SCR) 42 brushes and cleans the upper surface (surface to be processed) of the substrate G while transporting the LCD substrate G in a horizontal position in the direction of line A by roller transport or belt transport. And blow cleaning.

  The first thermal processing unit 26 adjacent to the downstream side of the cleaning process unit 24 is provided with a vertical transfer mechanism 46 at the center along the process line A, and a plurality of units are arranged in multiple stages on both front and rear sides thereof. is doing. For example, as shown in FIG. 2, the upstream multi-stage unit section (TB) 44 includes a substrate passing pass unit (PASS) 50, dehydrating baking heating units (DHP) 52 and 54, and an adhesion unit. (AD) 56 are stacked in order from the bottom. Here, the pass unit (PASS) 50 is used to transfer the substrate G to the scrubber cleaning unit (SCR) 42 side. In addition, a substrate passing pass unit (PASS) 60, cooling units (CL) 62 and 64, and an adhesion unit (AD) 66 are stacked in order from the bottom on the downstream multi-stage unit section (TB) 48. Here, the pass unit (PASS) 60 is for delivering the substrate G to the coating process unit 28 side.

  As shown in FIG. 2, the transport mechanism 46 includes a lift transport body 70 that can be moved up and down along a guide rail 68 that extends in the vertical direction, and a turn that can rotate or swivel in the θ direction on the lift transport body 70. It has a transport body 72 and a transport arm or tweezers 74 that can move back and forth in the front-rear direction while supporting the substrate G on the rotary transport body 72. A drive unit 76 for raising and lowering the lifting and lowering conveyance body 70 is provided on the base end side of the vertical guide rail 68, and a drive unit 78 for rotating and driving the swivel conveyance body 72 is attached to the vertical conveyance body 70. A drive unit 80 for advancing and retracting 74 is attached to the rotary transport body 72. Each drive part 76,78,80 may be comprised by the electric motor etc., for example.

  The transport mechanism 46 configured as described above can move up and down or swivel at high speed to access any unit in the multistage unit sections (TB) 44 and 48 on both sides, and the shuttle on the auxiliary transport space 38 side. 40 can also deliver the substrate G.

  As shown in FIG. 1, the coating process unit 28 adjacent to the downstream side of the first thermal processing unit 26 includes a resist coating unit (CT) 82, a vacuum drying unit (VD) 84, and an edge remover unit (ER). 86 are arranged in a line along the process line A. Although not shown in the drawing, in the coating process section 28, a transport device is provided for loading and unloading the substrates G one by one in the order of the processes in these three units (CT) 82, (VD) 84, and (ER) 86. In each unit (CT) 82, (VD) 84, and (ER) 86, each process is performed in units of one substrate.

  The second thermal processing unit 30 adjacent to the downstream side of the coating process unit 28 has the same configuration as that of the first thermal processing unit 26, and a vertical type between the process lines A and B. , A multi-stage unit portion (TB) 88 is provided on the process line A side (last), and the other multi-stage unit portion (TB) 92 is provided on the process line B side (lead).

  Although not shown, for example, in the multi-stage unit section (TB) 88 on the process line A side, a pass unit (PASS) for substrate transfer is placed at the bottom, and a heating unit (PREBAKE) for pre-baking is placed thereon. For example, three stages may be stacked. In the multi-stage unit section (TB) 92 on the process line B side, a pass unit (PASS) for substrate transfer is placed at the bottom, and a cooling unit (COL) is stacked thereon, for example, one stage above it. In addition, prebaking heating units (PREBAKE) may be stacked in two stages, for example.

  The transport mechanism 90 in the second thermal processing unit 30 includes the coating process unit 28, the development process unit 32, and the substrate G through the pass units (PASS) of both the multistage unit units (TB) 88 and 92. In addition to delivering in units, the substrate G can also be delivered in units of sheets to the shuttle 40 in the auxiliary transport space 38 and the interface station (I / F) 18 described later.

  In the downstream process line B, the development process unit 32 includes a so-called flat-flow development unit (DEV) 94 that performs a series of development processing steps while transporting the substrate G in a horizontal posture. The configuration and operation of the developing unit (DEV) 94 will be described in detail later.

  A third thermal processing unit 36 is disposed downstream of the development process unit 32 with the decolorization process unit 34 interposed therebetween. The decoloring process unit 34 includes an i-ray UV irradiation unit (i-UV) 96 for performing a decoloring process by irradiating the surface to be processed of the substrate G with i-line (wavelength 365 nm).

  The third thermal processing unit 36 has the same configuration as that of the first thermal processing unit 26 and the second thermal processing unit 30, and the vertical transport mechanism 100 along the process line B. A pair of multi-stage unit portions (TB) 98 and 102 are provided on both the front and rear sides.

  Although not shown, for example, in the upstream multi-stage unit section (TB) 98, a pass unit (PASS) is placed at the lowermost stage, and a post-baking heating unit (POBAKE) is stacked, for example, in three stages. It's okay. In the downstream multi-stage unit (TB) 102, a post-baking unit (POBAKE) is placed at the lowermost stage, and a substrate-passing / cooling unit (PASS / COL) for transferring and cooling the substrate is placed thereon. The heating unit (POBAKE) for post-baking may be stacked in two layers.

  The transport mechanism 100 in the third thermal processing section 36 includes i-line UV irradiation units (PASS) (PASS) and pass cooling units (PASS / COL) of both multi-stage unit sections (TB) 98 and 102, respectively. i-UV) 96 and cassette station (C / S) 14 and the substrate G can be transferred not only in units of one sheet, but also can be transferred in units of sheets to the shuttle 40 in the auxiliary transport space 38. .

  The interface station (I / F) 18 includes a transfer device 104 for exchanging the substrate G with the adjacent exposure device 12, and a buffer stage (BUF) 106 and an extension / cooling stage (EXT / COL) around it. ) 108 and peripheral device 110 are arranged. A stationary buffer cassette (not shown) is placed on the buffer stage (BUF) 106. The extension / cooling stage (EXT / COL) 108 is a stage for transferring a substrate having a cooling function, and is used when the substrate G is exchanged with the process station (P / S) 16 side. For example, the peripheral device 110 may have a configuration in which a titler (TITLER) and a peripheral exposure device (EE) are stacked vertically. The transfer device 104 has a means for holding the substrate G, for example, a transfer arm 104a, and transfers the substrate G to and from the adjacent exposure device 12, each unit (BUF) 106, (EXT / COL) 108, (TITLER / EE) 110. Can be done.

  FIG. 3 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 14, the transport mechanism 22 takes out one substrate G from a predetermined cassette C on the stage 20, and the excimer of the cleaning process unit 24 of the process station (P / S) 16. It is carried into the UV irradiation unit (e-UV) 41 (step S1).

  In the excimer UV irradiation unit (e-UV) 41, the substrate G is subjected to dry cleaning by ultraviolet irradiation (step S2). This UV cleaning mainly removes organic substances on the substrate surface. After completion of the ultraviolet cleaning, the substrate G is moved to the scrubber cleaning unit (SCR) 42 of the cleaning process unit 24 by the transport mechanism 22 of the cassette station (C / S) 14.

  In the scrubber cleaning unit (SCR) 42, as described above, the substrate G is brushed or blown onto the upper surface (surface to be processed) of the substrate G while being transported in a horizontal position in the horizontal direction by roller transport or belt transport. By performing cleaning, particulate dirt is removed from the substrate surface (step S3). Note that the substrate G is dried with an air knife or the like while the substrate G is transported in a flat flow even after cleaning, and the substrate G is dried.

  The substrate G that has been cleaned in the scrubber cleaning unit (SCR) 42 is carried into the pass unit (PASS) 50 in the upstream multistage unit section (TB) 44 of the first thermal processing section 26.

  In the first thermal processing unit 26, the substrate G is rotated in a predetermined unit by the transport mechanism 46 in a predetermined sequence. For example, the substrate G is first transferred from the pass unit (PASS) 50 to one of the heating units (DHP) 52 and 54, where it undergoes a dehydration process (step S4). Next, the substrate G is transferred to one of the cooling units (COL) 62 and 64, where it is cooled to a constant substrate temperature (step S5). Thereafter, the substrate G is transferred to an adhesion unit (AD) 56, where it is subjected to a hydrophobic treatment (step S6). After completion of the hydrophobic treatment, the substrate G is cooled to a constant substrate temperature by one of the cooling units (COL) 62 and 64 (step S7). Finally, the substrate G is moved to the pass unit (PASS) 50 belonging to the downstream multistage unit section (TB) 48.

  As described above, in the first thermal processing unit 26, the substrate G is interposed between the upstream multi-stage unit unit (TB) 44 and the downstream multi-stage unit unit (TB) 48 via the transport mechanism 46. You can come and go arbitrarily. The second and third thermal processing units 30 and 36 can perform the same substrate transfer operation.

  The substrate G that has undergone a series of thermal or thermal processing as described above in the first thermal processing section 26 is adjacent to the downstream side from the pass unit (PASS) 60 in the downstream multistage unit section (TB) 48. Is moved to a resist coating unit (CT) 82 of the coating process unit 28.

  The substrate G is coated with a resist solution on the upper surface (surface to be processed) by a resist coating unit (CT) 82, for example, by spin coating, and immediately after that, it is subjected to a drying process by a reduced pressure drying unit (VD) 84 adjacent to the downstream side. Then, the unnecessary (unnecessary) resist on the peripheral edge of the substrate is removed by the edge remover unit (ER) 86 adjacent to the downstream side (step S8).

  The substrate G that has undergone the resist coating process as described above is transferred from the vacuum drying unit (VD) 84 to the pass unit (PASS) belonging to the upstream multi-stage unit section (TB) 88 of the adjacent second thermal processing section 30. Delivered.

  Within the second thermal processing unit 30, the substrate G is rotated through a predetermined unit by the transport mechanism 90 in a predetermined sequence. For example, the substrate G is first transferred from the pass unit (PASS) to one of the heating units (PREBAKE), where it is subjected to baking after resist coating (step S9). Next, the substrate G is transferred to one of the cooling units (COL), where it is cooled to a constant substrate temperature (step S10). Thereafter, the substrate G passes through the downstream side multistage unit (TB) 92 side pass unit (PASS) or without passing through the interface station (I / F) 18 side extension cooling stage (EXT COL). ) 108.

  In the interface station (I / F) 18, the substrate G is transferred from the extension / cooling stage (EXT / COL) 108 to the peripheral exposure device (EE) of the peripheral device 110, where the resist adhering to the peripheral portion of the substrate G is removed. After receiving an exposure for removal at the time of development, it is sent to the adjacent exposure apparatus 12 (step S11).

  In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Then, when the substrate G that has undergone pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18 (step S11), it is first carried into a titler (TITLERR) of the peripheral device 110, where a predetermined value on the substrate is obtained. Predetermined information is written in the part (step S12). Thereafter, the substrate G is returned to the extension / cooling stage (EXT / COL) 108. Transfer of the substrate G in the interface station (I / F) 18 and exchange of the substrate G with the exposure apparatus 12 is performed by the transfer device 104.

  In the process station (P / S) 16, the transport mechanism 90 receives the exposed substrate G from the extension / cooling stage (EXT / COL) 108 in the second thermal processing unit 30, and the multi-stage unit unit on the process line B side (TB) The image is transferred to the development process unit 32 via the pass unit (PASS) in 92.

  In the development process unit 32, the substrate G received from the pass unit (PASS) in the multi-stage unit unit (TB) 92 is carried into the development unit (DEV) 94. In the developing unit (DEV) 94, the substrate G is transported in a horizontal orientation in a flat-flow manner toward the downstream of the process line B, and a series of development processing steps of development, rinsing, and drying are performed during the transport (step S13). .

  The substrate G that has undergone the development process in the development process unit 32 is carried into the decolorization process unit 34 adjacent to the downstream side, where it undergoes a decolorization process by i-line irradiation (step S14). The substrate G that has been subjected to the decoloring process is transferred to the pass unit (PASS) in the upstream multistage unit section (TB) 98 of the third thermal processing section 36.

  In the third thermal processing section (TB) 98, the substrate G is first transferred from the pass unit (PASS) to one of the heating units (POBAKE), where it is subjected to post-baking (step S15). Next, the substrate G is transferred to a path cooling unit (PASS / COL) in the downstream multi-stage unit section (TB) 102, where it is cooled to a predetermined substrate temperature (step S16). The transport mechanism 100 transports the substrate G in the third thermal processing unit 36.

  On the cassette station (C / S) 14 side, the transport mechanism 22 receives and receives the substrate G that has completed all the steps of the coating and developing process from the pass cooling unit (PASS COL) of the third thermal processing unit 36. The substrate G is accommodated in any one cassette C (step S1).

  In the coating and developing processing system 10, the present invention can be applied to, for example, the developing unit (DEV) 94 of the developing process unit 32. Hereinafter, an embodiment in which the present invention is applied to a developing unit (DEV) 94 will be described with reference to FIGS.

  FIG. 4 schematically shows the overall configuration of the developing unit (DEV) 94 according to one embodiment of the present invention. The developing unit (DEV) 94 is formed by continuously arranging a plurality of, for example, eight modules M1 to M8 forming a continuous conveyance path 108 extending in the horizontal direction (X direction) along the process line B. .

  Among these modules M1 to M8, the module M1 located at the most upstream end constitutes the substrate carry-in section 110, the subsequent four modules M2, M3, M4, and M5 constitute the developing section 112, and the next The rinsing unit 114 is configured by the module M6, the drying unit 116 is configured by the next module M7, and the substrate carry-out unit 118 is configured by the last module M8.

  The substrate carry-in section 110 is provided with a plurality of lift pins 120 that can be moved up and down to receive a substrate G delivered from an adjacent substrate transport mechanism (not shown) in a horizontal position and transfer it onto the transport path 108. Yes. The substrate carry-out portion 118 is also provided with a plurality of lift pins 122 that can be lifted and lowered to lift the substrate G in a horizontal posture and hand it over to an adjacent substrate transport mechanism (not shown).

  More specifically, the developing unit 112 includes a prewetting unit 124 in the module M2, a developing solution supply unit 126 in the modules M3 and M4, and a developing solution dropping unit 128 in the module M5. The pre-wetting unit 124 has a nozzle discharge port directed toward the conveyance path 108 and can move in both directions along the conveyance path 108, and a pre-wetting liquid supply nozzle PN for supplying a pre-wetting liquid such as pure water to the substrate. One or more are provided. The developer supply unit 126 has a nozzle discharge port directed toward the transport path 108 and can move in both directions along the transport path 108, and includes one developer supply nozzle DN for supplying the developer to the substrate. A plurality are provided. In this configuration example, developer supply nozzles DNa and DNb that can move independently for each of the modules M3 and M4 are provided. The developer dropping unit 128 and the prewetting unit 124 are provided with a substrate tilting mechanism 180 (FIGS. 11 and 12) described later for tilting the substrate G.

  The rinsing section 114 has a nozzle discharge port directed to the transport path 108 and can move in both directions along the transport path 108, and has one rinse liquid supply nozzle RN for supplying a substrate rinse liquid, for example, pure water, or A plurality are provided. The drying unit 116 is provided with one or more air knives EN for draining the liquid (mainly rinse liquid) adhering to the substrate G along the transport path 108 with the transport path 108 interposed therebetween. .

  In the developing unit 112 and the rinsing unit 114, pans 130, 132, and 134 for collecting liquid that has fallen under the conveyance path 108 are provided. In the developing unit 112, more specifically, the prewetting unit 124, the developer supply unit 126, and the developer dropping unit 128 are respectively provided with dedicated pans 130 and 132. A drainage port is provided at the bottom of each pan 130, 132, 134, and drainage pipes 131, 133, 135 of different drainage systems are connected thereto.

  5 to 8 show configurations around the transport path 108 in the substrate carry-in unit 110 and the pre-wet unit 124. FIG.

  The conveyance path 108 is configured as a roller conveyance type conveyance path in which a pair of conveyance rollers 138A and 138B fixed to a rotatable shaft 136 at a predetermined interval are laid horizontally along the process line B. Yes.

  More specifically, bearings 142A and 142B are attached to the upper portions of the left and right side walls of each module M or the shaft leg member 140 at regular intervals in the direction of the process line B, and the transport rollers 138A and 138B are positioned inside the left and right side walls. In this manner, the shaft 136 is rotatably spanned between each pair of bearings 142A and 142B. Then, a screw gear 144 is fixed to one end portion of each shaft 136 that extends outward from the bearing 142A on one side, and the rotational drive shaft 146 side that extends in the process line B direction to each screw gear 144 on each shaft 136 side. The screw gears 148 mesh with each other from a right angle direction. The rotation drive shaft 146 is coupled to the rotation shaft of the electric motor 150. When the electric motor 150 rotationally drives the rotation drive shaft 146 in a predetermined direction, the rotation drive force is transmitted from each screw gear 148 on the rotation shaft 146 side to the screw gear 144 on the conveyance shaft 136 side, and the conveyance roller 138A of each shaft 136 is transmitted. , 138B rotate in a predetermined direction (a direction in which the substrate G is fed to the front of the transport path 108).

  In the substrate carry-in section 110, the substrate delivery lift pins 120 are discretely erected or planted at predetermined intervals on a lifting plate 152 disposed horizontally below the transport path. Under the elevating plate 152, for example, an elevating drive unit 154 including an air cylinder (not shown) is installed.

  As shown in FIG. 7, when the elevating drive unit 154 lifts the elevating plate 152 to a predetermined height, the lift pin 120 protrudes over the conveying path 108 through the gap between the shafts 136, and at the height position, the adjacent lift pin 120 The substrate G can be received in a horizontal posture from a substrate transport mechanism (not shown).

  When the substrate G is transferred onto the lift pins 120, as shown in FIG. 8, the lifting drive unit 154 lowers the lifting plate 152 to the original position, so that both end portions of the substrate G (the conveyance path 108) are being lowered. The substrate G is transferred onto the transport path 108 in a horizontal posture so that both end portions in the width direction are placed on the transport rollers 138A and 138B. The outer diameter of each of the transport rollers 138A and 138B is one step thinner on the inner side (shaft center side), and one end of the substrate G is placed on the small diameter portion 139.

Parallel 4, prewetting liquid supply nozzle PN, the developing solution supply nozzle DNa, DNb and rinsing liquid supply nozzle RN, the nozzle scanning mechanism SC _P respectively, the conveying path 108 above the conveying path 108 by the SC _D and SC _R To move to.

9 and 10 show the configuration of the nozzle scanning mechanism SC according to an embodiment _{(SC P, SC D, SC} R). The nozzle scanning mechanism SC includes a nozzle support 156 having an inverted U-shaped cross section for supporting the movable nozzle N (PN, DNa, DNb, RN), and a nozzle parallel to the transport path 108 above the transport path 108. A guide rail 158 (FIG. 9) for guiding the support 156 and a scanning drive unit 160 for driving the nozzle support 156 to move along the guide rail 158 are provided.

  As shown in FIG. 10, for example, the scan driving unit 160 connects one or more endless belts 162 coupled to the nozzle carrier 156 via one or more vertical support members 161 to guide rails 158 ( 9) (see FIG. 9) (ie, parallel to the conveyance path 108), the drive pulley 164 is bridged between the idle pulley 166 and the drive pulley 164 is operatively coupled to the rotating shaft of the electric motor 168. The rotational driving force of the electric motor 168 is converted into a linear motion of the noise carrier 156 in the belt length direction (X direction) via the pulleys 164 and 166 and the belt 162. By controlling the rotation speed of the electric motor 168, the linear movement speed of the nozzle conveyance body 156 can be adjusted to a desired value, and by switching the rotation direction of the electric motor 168, the linear movement direction of the nozzle conveyance body 156 can be switched. . In FIG. 10, the guide rail 158 is not shown for simplification of illustration.

  In the nozzle carrier 156, a lifting drive unit 170 made of an actuator such as an air cylinder is attached to inner walls on both the left and right side surfaces, and a horizontal pipe made of a hollow tube, for example, is interposed between the pair of left and right lifting drive units 170. A support rod 172 is stretched horizontally. A cylindrical movable nozzle N is horizontally attached to the lower end portion of a vertical support rod 174 made of, for example, a hollow tube, extending vertically downward from the center portion of the horizontal support rod 172 with the discharge port n facing downward. ing. A number of discharge ports n of the nozzle N may be formed at regular intervals in the longitudinal direction of the nozzle as long as the processing liquid can be supplied almost uniformly from one end to the other end of the substrate G in the width direction of the transport path 108.

  Within the nozzle carrier 156, the movable nozzle N can be raised and lowered via the horizontal support rod 172 and the vertical support rod 174 by the elevation drive of the elevation drive unit 170. The height is moved between a height position Ha for discharging the processing liquid and a height position Hb for retreating from the transport path 108 without discharging the processing liquid. A flexible processing liquid supply pipe 176 from a processing liquid supply source (not shown) installed outside the conveyance path 108 is drawn into one end of the horizontal support rod 172. The processing liquid supply pipe 176 is connected to the processing liquid inlet of the nozzle N through the horizontal support rod 172 and the vertical support rod 174.

  As shown in FIG. 9, a cover 178 having an inverted U-shaped cross section for shielding the movable area (X direction and Z direction) of the movable nozzle N on the conveyance path 108 from the outside is preferably provided along the conveyance path 108. May be provided. In the illustrated configuration example, the left and right side surfaces of the cover 178 are suspended to the upper end portions of the left and right side walls of the module M or the shaft leg member 140, and the gap is made as small as possible. A slit (opening) 178 a for passing the horizontal support rod 172 may be formed on the upper surface or ceiling of the cover 178. In this way, by covering or isolating the movable nozzle N from the scanning drive system by the cover 178, the processing liquid can be supplied from the movable nozzle N to the substrate G on the transport path 108 in the processing space PS with little foreign matter inside the cover 178. It is like that.

  5 and 6, the pre-wetting portion 124 is provided with a substrate tilting mechanism 180 according to one embodiment. The substrate tilting mechanism 180 includes a base plate 182 that can be moved up and down below the transport path 108 and tiltable in the front-rear direction, and discretely standing or planting at a predetermined interval on the upper surface of the base plate 182. A plurality of lift pins 184 provided, and a drive unit 188 for supporting the base plate 182 from below via a lift shaft 186 to perform lift drive and tilt drive. The elevating shaft 186 passes through the opening 190 formed in the corresponding module M 2 and the bottom plate of the developer pan 130. A cylindrical wall portion 130 a for preventing liquid leakage around the opening 190 is formed on the inner bottom of the developer pan 130.

  Immediately behind the lift pins 184 in the last row, as a fall prevention means for receiving the rear end of the substrate G and preventing the fall when tilted, a branch pin 192 that branches from the lift pins 184 and stands upright is made of rubber, for example. A cylindrical stopper member 194 is rotatably attached.

  Here, the effect | action of the board | substrate inclination mechanism 180 is demonstrated about FIG. 11 and FIG. When the substrate G approaches the substrate tilting mechanism 180 on the transport path 108, a predetermined position sensor (not shown) detects the substrate G and responds to a signal output from the sensor to drive the transport drive system. The control unit stops the rotation of at least all the transport rollers 138A and 138B in the module, and stops the substrate G.

  Immediately after that, a controller (not shown) of the substrate tilting mechanism 180 is actuated to actuate the drive unit 188 and raise the elevating shaft 186. Then, as shown in FIG. 11, the base plate 182 and the lift pins 184 are also lifted, and the substrate G is lifted above the transport path 108 so that the lift pins 184 push up from below.

  Next, the controller controls the drive unit 188 so that the base plate 182 has a predetermined angle (for example, in the front-rear direction, preferably rearward as shown in the figure) about a shaft 196 extending in the width direction of the transport path 108. Rotate by 10 ° ~ 20 °). Then, as shown in FIG. 12, the portion above the base plate 182, that is, the lift pins 192, the stopper member 194, and the substrate G are also tilted backward by the same angle on the transport path 108. At that time, the substrate G is received by the stopper member 194 by sliding slightly backward on the lift pins 184. However, the liquid Q accumulated on or attached to the substrate G slides down the inclined surface of the substrate by gravity and falls outside the substrate. The liquid Q that has fallen from the substrate G is collected and collected in a pan (pre-wet liquid pan 130 in the pre-wet unit 124) installed in the module.

  After holding the tilt posture as described above for a certain period of time, under the control of the controller, the drive unit 188 rotates the base plate 182 in the opposite direction to the above by the same angle as described above to set the horizontal posture (state of FIG. 11). Then, the lifting shaft 186 is lowered to the original position (position shown in FIG. 6).

  In the prewetting unit 124, the substrate G is tilted in the transport direction and the developer supply unit 126 side for performing the next process is on the upper side. Further, the possibility that the liquid that has fallen and bounced off the prewetting liquid pan 130 adheres to the substrate G on the developer supply unit 126 side that performs the next process can be reduced.

  As described above, in the substrate tilting mechanism 180, the substrate G is lifted above the transport path 108 and stabilized in the transport direction while the plurality of lift pins 184 arranged at a predetermined interval are initially placed on the lower surface of the substrate G. The inclined posture is taken, and the liquid is dropped from the top of the substrate to the front or rear of the substrate by using gravity, so that the liquid is drained in a short time. In addition, no special external force is applied, and there is very little risk of damaging the substrate G.

  As described above, in the substrate tilting mechanism 180, the substrate G is tilted on the transport path 108 and the liquid is dropped from the substrate using gravity, so that the liquid can be drained in a short time. Moreover, it is not necessary to use a special external force, and there is very little possibility of damaging the substrate G.

  Next, the operation of the developing unit (DEV) 94 will be described. As described above with reference to FIGS. 7 and 8, the substrate carry-in unit 120 receives the substrates G from the adjacent substrate transport mechanism (not shown) one by one and transfers them to the transport path 108. The conveying rollers 138A and 138B of the conveying shaft 136 constituting the conveying path 108 are rotated by the rotational driving force of the electric motor 150 through the transmission mechanism such as the rotational driving shaft 146 and the screw gears 148 and 144 as described above. Therefore, the substrate G placed on the transport path 108 is immediately transported toward the adjacent developing unit 112.

In the developing unit 112, the substrate G is first carried into the prewetting unit 124, and, for example, pure water or a low concentration developer is sprayed as a prewetting liquid from the prewetting liquid supply nozzle PN during roller conveyance. In this embodiment, the upper surface of the substrate G being conveyed while moving horizontally along the nozzle scanning mechanism SC nozzle PN conveying path 108 by the scanning driving of _P as described above per FIGS. 9 and 10 (surface to be processed) Spray the prewetting liquid toward The prewetting liquid that has splattered outside the substrate when it hits the substrate G or the prewetting liquid that did not hit the substrate G is collected by a prewetting liquid pan 130 installed under the transport path 108.

As shown in FIG. 13A, when the direction in which the nozzle PN is scanned while discharging the prewetting liquid toward the substrate G on the transport path 108 is set in the direction opposite to the substrate transport direction, the nozzle scanning speed The nozzle N (PN) scans from the front end to the rear end of the substrate G at a relative speed (V _N + V _G ) obtained by adding V _N and the substrate transport speed V _G , even if the size of the substrate G is large. The entire surface to be processed (resist surface) of the substrate G can be wetted with the prewetting liquid in a very short time.

  When the substrate G arrives at a predetermined position on the downstream side in the pre-wetting portion 124, the substrate tilting mechanism 180 operates as described above with reference to FIGS. 11 and 12, and the substrate G is lifted above the transport path 108 and tilted backward. Let Due to the inclined posture of the substrate G, most of the prewetting liquid remaining on or adhering to the substrate G flows down to the rear of the substrate and is collected in the prewetting liquid pan 130.

The substrate G that has been subjected to the pre-wetting process as described above in the pre-wetting unit 124 is carried on the transport path 108 and carried into the developer supply unit 126. In the developer supply unit 126, the developer is sprayed from the developer supply nozzle DNa while passing through the first module M3, and the developer is sprayed from the developer supply nozzle DNb while passing through the next module M4. Each developer supply nozzle DNa, DNb is in roller conveyor while moving horizontally along the conveying path 108 above the conveying path 108 by the scanning driving of the nozzle scanning mechanism SC _D as described above per FIGS. 9 and 10 A developing solution is sprayed toward the upper surface (surface to be processed) of the substrate G. The liquid that has fallen out of the substrate G due to the spraying of the developer is collected and collected by the developer pan 132 installed under the transport path 108.
Of the prewetting liquid (pure water) used in the prewetting section 124 as described above, most of the prewetting liquid remaining on the substrate G is collected in the prewetting liquid pan 130 by the substrate tilting mechanism 180. The ratio of being brought into the developer supply unit 126 is low, and therefore the ratio of being mixed into the developer pan 132 is also low.

Similar to the pre-wetting unit 124 described above, in the developer supply unit 126 as well, the nozzle DN is scanned while discharging the developer toward the substrate G on the transport path 108 as shown in FIG. May be set in the direction opposite to the substrate transport direction. As a result, the nozzle DN scans from the front end to the rear end of the substrate G at a relative speed (V _N + V _G ) obtained by adding the nozzle scanning speed V _N and the substrate transport speed V _G. The developer can be supplied to the entire surface to be processed (resist surface) of the substrate G in a very short time even if it is large.

In this embodiment, individual for each module M3, M4 developer supply nozzle DNa, since the provided DNb and nozzle scanning mechanism SC _D, the temporal and spatial intervals against the substrate G on the conveying path 108 The developer can be supplied a plurality of times, and the characteristics (density, etc.) of the developer can be changed between the first time and the second time.

  The substrate G, to which the developing solution has been supplied to the entire surface to be processed as described above by the developing solution supply unit 126, is carried on the transport path 108 and carried into the developing solution dropping unit 128 as it is. When the developer dropping unit 128 arrives at a predetermined position on the downstream side, the substrate tilting mechanism 180 installed there operates to lift the substrate G above the conveyance path 108 and to move the substrate G in the conveyance direction. In addition, for example, the substrate G is inclined so that it faces forward, that is, the developer supply unit 126 side that performs the pre-process is on the upper side. Due to this tilted posture, most of the developer accumulated on the substrate G flows down to the front of the substrate and is collected in the developer pan 132. Thus, since the substrate G is tilted so that the developer supply unit 126 side that performs the pre-process is on the upper side, when the substrate G is tilted by the developer dropping unit 128 and the liquid is drained, the developer pan 132 The possibility that the rebounded liquid adheres to the substrate G on the developer supply unit 126 side can be reduced.

The substrate G that has been supplied and collected as described above in the developing unit 112 is carried on the transport path 108 and carried into the rinse unit 114. The rinsing section 114, the upper surface (the substrate G being conveyed while moving horizontally along the rinsing liquid supply nozzle RN conveying path 108 by the scanning driving of the nozzle scanning mechanism SC _R as described above per FIGS. 9 and 10 A rinsing liquid such as pure water is sprayed toward the treatment surface. The rinse liquid that has fallen out of the substrate G is received and collected by a rinse liquid pan 134 that is installed under the conveyance path 108.

  Of the developer used in the developer supply unit 126 as described above, most of the developer remaining on the substrate G is collected in the developer pan 132 by the substrate tilting mechanism 180 in the developer dropping unit 128. Therefore, the ratio brought into the rinse part 114 is low, and therefore, the ratio mixed into the rinse liquid pan 134 is also low.

Also in the rinsing unit 114, as shown in FIG. 13A, the direction in which the nozzle RN is scanned while discharging the developer toward the substrate G on the transport path 108 may be set to be opposite to the substrate transport direction. . As a result, the nozzle RN scans from the front end to the rear end of the substrate G at a relative speed (V _N + V _G ) obtained by adding the nozzle scanning speed V _N and the substrate transport speed V _G. Even if it is large, the rinsing liquid can be supplied to the entire surface to be processed (resist surface) of the substrate G within a very short time, and the rinsing liquid can be quickly replaced (development stopped). A rinsing liquid supply nozzle (not shown) for cleaning the back surface of the substrate G may be provided below the transport path 108.

  The substrate G that has been subjected to the rinsing process as described above in the rinsing unit 114 is carried on the transport path 108 and carried into the drying unit 116. In the drying unit 116, as shown in FIG. 4, the upper and lower air knives EN placed at predetermined positions with respect to the substrate G transported on the transport path 108 are sharpened like a knife on the upper surface (surface to be processed) and the back surface. By applying a gas flow, for example, air, the liquid adhering to the substrate G (mainly the rinsing liquid) is wiped off (removed from the liquid) to the rear of the substrate.

  The substrate G drained by the drying unit 116 is transferred to the substrate unloading unit 118 as it is on the transport path 108. The substrate carry-out unit 118 has the same configuration as that of the substrate carry-in unit 110 and operates in the same manner as the substrate carry-in unit 110 except that the substrate carrying direction is opposite between carry-in and carry-out. In other words, the lift pins 122 for transferring the substrate are placed on standby at a position lower than the transport path 108 and wait for the substrate G to flow from the upstream side (drying unit 116), and the substrate G arrives at a predetermined position directly above the lift pins 122. If there is, the lift pin 122 is pushed up to lift the substrate G in a horizontal posture and handed to the next substrate transport mechanism (not shown).

  In this developing unit (DEV) 94, by providing separate pans 130, 132, and 134 for the prewetting section 124, the developing solution supply section 126, and the rinsing section 114, each processing solution (prewetting liquid, developing solution, rinsing) Liquid)). In particular, in the pre-wetting part 124 and the developer dropping part 128, the substrate tilting mechanism 180 allows each processing liquid (pre-wetting liquid and developing solution) to be efficiently performed on the substrate G in a short time after each process (pre-wetting process and developing process). At the same time as draining well, it is recovered in the corresponding pans 130 and 132 with high purity, and the fractional recovery rate is remarkably increased.

  A substrate tilt mechanism 180 may be provided in the rinse part 114. In that case, immediately after the rinsing step, the rinsing liquid can be efficiently drained from the substrate G in a short time, and the rinsing liquid can be efficiently collected in the rinsing liquid pan 134 to increase the separation recovery rate of the rinsing liquid. .

  When the substrate G is tilted by the rinse unit 114, the substrate G may be tilted in the transport direction, for example, so that the developing unit 112 side is on the upper side. Since the substrate G is tilted so that the developing unit 112 side is on the upper side, the rinse liquid discharged from the rinse liquid supply nozzle RN rebounds on the tilted substrate G, and the boiled rinse liquid adheres to the substrate G on the developing unit 112 side. The possibility of doing so can be reduced.

  In the developing unit (DEV) 94, a prewetting section 124, a developing solution supply section 126, a developing solution dropping section 128, a rinsing section are conveyed while conveying a large number of substrates G in a line at a predetermined interval on the conveying path 108. Each of the processes is sequentially performed in the unit 114 and the drying unit 116, so that a high-efficiency or high-throughput development process step by a pipeline method can be realized.

  In particular, in the pre-wetting unit 124, the developing solution supply unit 126, and the rinsing unit 114, nozzles PN, DNa, and DNb that supply a processing solution (pre-wetting solution, developing solution, rinsing solution) to the substrate G on the transport path 108. , RN are scanned along the transport path 108 above the transport path 108, so that the entire substrate processing surface can be used even when the size of the substrate G is large or the transport speed of the transport path 108 is not high. It is possible to quickly supply the processing liquid in a short time. In particular, in the developer supply process, the processing solution supply time difference between one end (front end) and the other end (rear end) in the transport direction of the substrate G can be shortened as much as possible. In-plane uniformity of development quality on the substrate can be improved.

In the nozzle scanning mechanism SC of this embodiment, since the nozzle N can be scanned bidirectionally along the transport path 108, the nozzle N is directed in the direction opposite to the substrate transport direction as shown in FIG. It is also possible to supply the processing liquid Q to the entire surface of the substrate G while scanning. In this case, it is necessary to set the nozzle scanning speed V _N ′ to a speed larger than the substrate transport speed V _G.

  In this embodiment, the pre-wetting unit 124 and the developer supply unit 126 are configured to perform spray-type development. However, it is easy to change to the paddle method, and the developer supply nozzles DNa and DNb in the developer supply unit 126 may be changed from a spray type to a liquid discharge type discharge structure. Further, in the paddle system, the pre-wetting unit 124 is not necessary.

  In the developer supply unit 126, it is possible to omit one of the developer supply nozzles DNa and DNb (usually, DNb on the downstream side). Further, the scannable area of each movable nozzle N on the conveyance path 108 may be set in a range exceeding one module M, and it is possible to adopt a configuration in which adjacent movable nozzles can get on a common guide rail. .

  In this embodiment, as described above, the developer is efficiently collected from the substrate G before being carried into the rinse unit 114 by the substrate tilting mechanism 180 disposed in the downstream portion of the developing unit 112. Thus, dropping the developer from the substrate G immediately before the rinsing step has an advantage that replacement with the rinsing solution or development stop can be accelerated in the rinsing step.

  A configuration in which an air knife mechanism as shown in FIG. 14 is provided near the boundary between the developing unit 112 and the rinse unit 114 in combination with such a substrate tilting mechanism is also effective. In FIG. 14, the air knife FN has innumerable air discharge ports or slit-like air discharge ports extending from end to end of the substrate W in the width direction of the transport path 108. A sharp knife-like gas flow (usually an air flow or a nitrogen gas flow) is applied to the substrate G that passes through the substrate G. As a result, while the substrate G passes through the air knife FN, the developer Q on the substrate is swept away from the substrate so as to be swept toward the rear end side of the substrate.

  The substrate tilting mechanism 180 in the above-described embodiment has a configuration in which the substrate G is once lifted in a horizontal posture from the transport path 108 and then tilted. However, as another method, a substrate tilting mechanism in which a member whose upper end surface is tilted from the beginning is pushed up from below the substrate G is also possible.

  Further, it is possible to incline the transport rollers (138A, 138B) constituting the transport path 108 over a predetermined section. FIGS. 15 to 17 show a configuration example of the substrate tilting mechanism 200 based on the transport path tilting method.

  In this substrate tilting mechanism 200, in a proper position on the transport path 108, for example, in a tiltable section K set in the developer drop section 128, each transport shaft 136 and the driving shaft 136a on the transmission gear 144 side and the transport roller (138A, 138B) side driven shaft 136b, and both shafts 136a and 136b are detachably connected via the clutch 202.

  The driven shaft 136b is rotatably supported by a pair of bearings 204A and 204B provided on the outer sides in the axial direction of both the transport rollers 138A and 138B. Each of the bearings 204A and 204B is supported by a support plate 206 provided horizontally above the conveyance path 108 via a vertical support bar 208. More specifically, the lower end portion of the vertical support bar 208 is fixed to the bearings 204 </ b> A and 204 </ b> B, and the upper end portion of the vertical support bar 208 is pivotally supported on the side surface of the support plate 206 via the pin 210.

  The support plate 206 is pivotally supported by the pivot 212 at one end in the conveying direction, for example, at the front end (downstream end), and is installed upward at the opposite end (rear end). The piston 214 is coupled to the piston shaft 218a of the lateral cylinder 218 via a wire 216 that hangs substantially vertically from the reel 214.

  In such a configuration, when the clutch 202 is turned on by a clutch drive unit (not shown) and the driving shaft 136a and the driven shaft 136b are connected, the rotational driving force of the electric motor 150 (FIGS. 5 and 6) is reduced. This is transmitted to both conveying rollers 138A and 138B via the rotational drive shaft 146, the screw gears 148 and 144, the driving shaft 136a, the clutch 202 and the driven shaft 136b. Accordingly, the substrate G can smoothly enter the tiltable section K from the upstream side on the transport path 108 and can smoothly exit from the tiltable section K to the downstream side.

  However, when the clutch 202 is turned off and the driven shaft 136b is disconnected from the driving shaft 136a, the rotational driving force from the electric motor 150 is cut off by the clutch 202 and is not transmitted to the driven shaft 136b. Under this state, when the cylinder 218 is driven to move the piston shaft 218a forward or forward by a predetermined distance, the support plate 206 moves rearward so that the rear end side is lowered about the pivot 212 on the front end side. Rotate or tilt. When the support plate 206 is tilted rearward in this way, each driven shaft 136b and both transport rollers 138A, 138B hanging from the support plate 206 via the vertical support rod 208 and the bearing 204 (204A, 204B) also correspond to each position. Looking at the row of conveyance rollers 138 constituting the conveyance path 108 in the inclinable section K, as shown in FIG. 17, it is inclined backward at the same angle in parallel with the support plate 206. Thus, when the substrate G is positioned on the transport path 108 in the tiltable section K, the substrate G is tilted backward and at the same angle together with the transport path 108. This inclination angle can be adjusted by the advance distance of the piston shaft 218a in the cylinder 218.

  One or more air cylinders 220 are installed upside down in the width direction of the transport path 108 in the width direction of the transport path 108 in proximity to the rear end of the support plate 206 (upstream in the transport direction). For example, a rubber cylindrical stopper member 222 is attached to the tip. In accordance with the timing change of the support plate 206 from the horizontal state to the inclined state as described above, each air cylinder 220 advances or lowers the piston shaft 220a, so that the stopper member 222 is sectioned as shown in FIG. The rear end of the substrate G inclined backward on the transport path 108 in the K is received.

  In this way, the substrate G tilts backward integrally with the row of the transport rollers 138 in the tiltable section K and the stopper member 222 stably holds the tilt posture, so that the substrate G is stacked on the substrate G, or The adhering liquid (the developing liquid in the developing liquid dropping unit 128) Q slides down the inclined surface of the substrate due to gravity, falls from the rear end of the substrate, and is collected by the pan 132.

  In order to return the inclined posture as described above to the horizontal posture, the piston shafts 218a and 220a of the two air cylinders 218 and 220 may be moved back to their original positions at the same timing. Then, after the conveying path 108 or the conveying roller 138 row in the tiltable section K returns to the horizontal state, the clutch 202 may be turned on to connect the driven shaft 136b to the driving shaft 136a. The driving shaft 136a may be supported by a bearing 224 installed on the axially outer side of the screw gear 144 (FIG. 15). In the substrate tilting mechanism 200, mechanisms (206, 214, 218, 220, etc.) provided above the transport path 108 may be housed in a box or enclosure 226.

  In order to stop the substrate G that has been transported on the transport path 108 from the upstream side within the tiltable section K, as with the substrate tilting mechanism 180, when the substrate G reaches a predetermined position, the position sensor detects it. It is only necessary that the clutch drive unit turns off the clutch 202 in response to the detection and the sensor output signal. As such a substrate arrival detection sensor, for example, a limit switch 230 as shown in FIG. 18 can be used. In the limit switch 230, when the substrate G reaches a predetermined position on the conveyance path 108 (FIG. 18A), the front end portion of the substrate comes into contact with the front end portion of the roller lever 232 provided there, and the roller lever Under the substrate G, the 232 is rotated in a predetermined direction (clockwise) about the shaft 236 against the tension coil spring 234 (FIG. 18B). Then, the optical sensor 238 detects the other end portion of the roller lever 232 and outputs a predetermined substrate arrival detection signal. For example, as shown in FIG. 18C, the optical sensor 238 may have a light emitting element 238a and a light receiving element 238b arranged to face each other with a gap 240 therebetween, and the roller lever 232 enters the gap 240. An output signal obtained from the light receiving element 238b when the light beam LB from the light emitting element 238a is blocked may be used as the substrate arrival detection signal.

  The configuration of each part in the above-described embodiment is an example, and various modifications can be made in parts other than the substrate tilting mechanism. For example, the configuration of the nozzle support 156, the scan driver 160, and the like in the nozzle scanning mechanism SC can be arbitrarily modified. Alternatively, a prewetting liquid supply nozzle, a developing liquid supply nozzle, a rinsing liquid supply nozzle, or the like can be configured as a stationary nozzle.

  In the above-described embodiment, the roller conveyance type conveyance path 108 is configured by horizontally laying a pair of conveyance rollers 138A and 138B fixed to the rotatable shaft 136 at a predetermined interval. In such a roller conveyance type conveyance path, a substrate conveyance roller may be attached to an intermediate position between both conveyance rollers 138A and 138B. It is also possible to divide the drive system of the transport path 108 into a plurality of parts in the transport direction and independently control the transport operation (speed, stop, etc.) on each divided transport path. Further, a belt conveyance type conveyance path in which a pair of belts are laid in the horizontal direction with a certain interval is also possible.

  In addition, in the prewetting part 124, the developer dropping part 128, and the rinsing part 114, the direction in which the substrate is inclined may be set to a direction different from the above-described direction, or the substrate may be processed in a horizontal state or an inclined state. Needless to say.

  The substrate to be processed in the present invention is not limited to an LCD substrate, and includes any substrate to which a development process can be applied.

It is a top view which shows the structure of the coating development processing system which can apply the development processing apparatus of this invention. It is a side view which shows the structure of the thermal process part in the said application | coating development processing system. It is a flowchart which shows the process sequence in the said application | coating development processing system. FIG. 2 is a front view illustrating an overall configuration of a developing unit in the embodiment. It is a top view which shows the structure around the board | substrate carrying-in part in the said developing unit, and a prewetting part. It is a partial cross section front view which shows the structure around the board | substrate carrying-in part and pre-wet part in the said image development unit. It is a partial cross section front view which shows the structure and effect | action (substrate delivery) of the board | substrate carrying-in part in the said image development unit. It is a partial cross section front view which shows the structure and effect | action (transfer of a board | substrate) of the said board | substrate carrying-in part. It is a partial cross section side view which shows the structure of the nozzle scanning mechanism in the said developing unit. It is a perspective view which shows the structure of the said scanning mechanism. It is a partial cross section front view which shows the structure and effect | action (board | substrate lift) of the board | substrate inclination mechanism in embodiment. It is a partial cross section front view which shows the structure and effect | action (board | substrate inclination) of the board | substrate inclination mechanism in embodiment. It is a schematic side view which shows the effect | action of the nozzle scan in embodiment. It is a schematic side view which shows the effect | action of the air knife in embodiment. It is a partial cross section front view which shows the structure of the board | substrate inclination mechanism in another embodiment. It is a partial cross section front view which shows the structure and effect | action (board | substrate horizontal attitude | position) of the board | substrate inclination mechanism in embodiment. It is a partial cross section front view which shows the structure and effect | action (board | substrate inclination attitude | position) of the board | substrate inclination mechanism in embodiment. It is a figure which shows the structural example of the board | substrate arrival detection sensor which can be used for the board | substrate inclination mechanism of embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Application | coating development system 16 (P / S) Process station 32 Application | coating process part 94 Application | coating unit 108 Conveyance path 112 Developing part 114 Rinse part 116 Drying part 124 Prewetting part 126 Developer supply part 128 Developer dropping part 130 Prewetting liquid Pan 132 Developer pan 134 Rinse solution pan N Movable nozzle PN Prewetting liquid supply nozzle DNa, DNb Developer supply nozzle RN Rinse liquid supply nozzle SCP, SCN, SCR Nozzle scanning mechanism 180 Substrate tilt mechanism 182 Base plate 184 Lift pin 186 Lifting shaft 194 Stopper 188 Drive unit 200 Substrate tilt mechanism 202 Clutch 204 (204A, 204B) Bearing 206 Support plate 208 Vertical support rod 216 Wire 218 Cylinder 220 Cylinder 222 Stopper

Claims (5)

A development processing apparatus that performs development processing on a substrate while the substrate is being transported within a predetermined section on a transport path in which a transport body for transporting the substrate to be processed is placed horizontally. And
A developer supply unit for supplying a developer onto the substrate in a first section on the transport path;
A developer drop unit for dropping the developer from the substrate in a second section downstream of the first section on the transport path;
A rinsing liquid supply unit for supplying a rinsing liquid onto the substrate in a third section downstream from the second section on the transport path;
A rinsing liquid dropping portion for dropping the rinsing liquid from the substrate in a fourth section on the downstream side of the third section on the transport path;
The developer dropping portion lifts the substrate to a position higher than the position on the transport path while holding a plurality of lift members arranged at predetermined intervals on the substrate from below, and tilts in the transport direction. First substrate tilting means, and tilting the substrate forward so that the rear end side of the substrate is up in the transport direction, and dropping the developer on the substrate to the front of the substrate,
The development processing apparatus, wherein the rinse liquid dropping unit tilts the substrate forward so that the rear end side of the substrate is in the transport direction, and drops the rinse liquid on the substrate forward of the substrate. A development processing apparatus that performs development processing on a substrate while the substrate is being transported within a predetermined section on a transport path in which a transport body for transporting the substrate to be processed is placed horizontally. And
A prewetting liquid supply section for supplying a prewetting liquid onto the substrate in a first section on the transport path;
A pre-wet liquid drop part for dropping the pre-wet liquid from the substrate in a second section downstream from the first section on the transport path;
A developer supply section for supplying a developer onto the substrate in a third section downstream from the second section on the transport path;
A developer drop unit for dropping the developer from the substrate in a fourth section on the downstream side of the third section on the transport path;
A rinsing liquid supply unit that supplies a rinsing liquid onto the substrate in a fifth section on the downstream side of the fourth section on the transport path;
The prewetting liquid dropping part is inclined in a backward posture so that the front end side of the substrate is up in the transport direction, and the prewetting liquid on the substrate is dropped to the rear of the substrate,
The developer dropping portion lifts the substrate to a position higher than the position on the transport path while holding a plurality of lift members arranged at predetermined intervals on the substrate from below, and tilts in the transport direction. And a first substrate tilting means for tilting the substrate forward so that the rear end side of the substrate faces up in the transport direction, and dropping the developer on the substrate to the front of the substrate. A development processing apparatus that performs development processing on a substrate while the substrate is being transported within a predetermined section on a transport path in which a transport body for transporting the substrate to be processed is placed horizontally. And
A prewetting liquid supply section for supplying a prewetting liquid onto the substrate in a first section on the transport path;
A pre-wet liquid drop part for dropping the pre-wet liquid from the substrate in a second section downstream from the first section on the transport path;
A developer supply section for supplying a developer onto the substrate in a third section downstream from the second section on the transport path;
A developer drop unit for dropping the developer from the substrate in a fourth section on the downstream side of the third section on the transport path;
A rinsing liquid supply section for supplying a rinsing liquid onto the substrate in a fifth section downstream from the fourth section on the transport path;
A rinsing liquid dropping part for dropping the rinsing liquid from the substrate in a sixth section downstream from the fifth section on the transport path;
The prewetting liquid dropping part tilts the substrate so that the front end side of the substrate faces up in the transport direction and drops the prewetting liquid on the substrate to the rear of the substrate;
The developer dropping portion lifts the substrate to a position higher than the position on the transport path while holding a plurality of lift members arranged at predetermined intervals on the substrate from below, and tilts in the transport direction. First substrate tilting means, and tilting the substrate forward so that the rear end side of the substrate is up in the transport direction, and dropping the developer on the substrate to the front of the substrate,
The development processing apparatus, wherein the rinse liquid dropping unit tilts the substrate forward so that the rear end side of the substrate is in the transport direction, and drops the rinse liquid on the substrate forward of the substrate. The rinse liquid drop portion lifts the substrate to a position higher than the position on the transport path while applying a plurality of lift members arranged at predetermined intervals to the substrate from the bottom to the forward inclined posture. 4. The development processing apparatus according to claim 3 , further comprising second substrate tilting means. The prewetting liquid dropping part lifts the substrate to a position higher than the position on the transport path while the plurality of lift members arranged at predetermined intervals on the substrate are applied from the bottom to the rearward tilt. developing apparatus according to any one of claims 2 or claim 3 having a third substrate inclining means for orientation.

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